| Literature DB >> 27453536 |
Aftab M Hussain1, Muhammad M Hussain2.
Abstract
A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).Entities:
Keywords: 3D integration; flexible electronics; sensors; through polymer vias
Year: 2016 PMID： 27453536 DOI： 10.1002/smll.201600952
Source DB: PubMed Journal: Small ISSN： 1613-6810 Impact factor: 13.281