Literature DB >> 27186607

Endonuclease IV cleaves apurinic/apyrimidinic sites in single-stranded DNA and its application for biosensing.

Xiang-Juan Kong1, Shuang Wu, Yao Cen, Ting-Ting Chen, Ru-Qin Yu, Xia Chu.   

Abstract

Endonuclease IV (Endo IV), as a DNA repairing enzyme, plays a crucial role in repairing damaged DNA comprising abasic sites to maintain genomic integrity. The cleaving capability of Endo IV to apurinic/apyrimidinic sites (AP) in single-stranded DNA (ssDNA) was demonstrated. It was found that Endo IV has considerably high cleaving activity to AP sites in ssDNA compared with that in double-stranded DNA (dsDNA). The unique feature of Endo IV in cleaving AP sites in ssDNA was further applied to construct a novel dual signal amplified sensing system for highly sensitive enzyme and protein detection by a combination of exonuclease III (Exo III)-aided cyclic amplification reaction and a rolling circle replication (RCR) technique, which showed a good sensing performance with a detection limit of 0.008 U mL(-1) for Endo IV and 2.5 pM for streptavidin. In addition, the developed method had considerably high specificity for Endo IV and streptavidin over other potential interferences. The developed strategy indeed provides a novel platform for protein and enzyme assays and may find a broad spectrum of applications in bioanalysis, disease diagnosis, and drug development.

Mesh:

Substances:

Year:  2016        PMID: 27186607     DOI: 10.1039/c6an00738d

Source DB:  PubMed          Journal:  Analyst        ISSN: 0003-2654            Impact factor:   4.616


  2 in total

Review 1.  Fluorescent Probes of DNA Repair.

Authors:  David L Wilson; Eric T Kool
Journal:  ACS Chem Biol       Date:  2017-11-30       Impact factor: 5.100

2.  Complex genomic patterns of abasic sites in mammalian DNA revealed by a high-resolution SSiNGLe-AP method.

Authors:  Ye Cai; Huifen Cao; Fang Wang; Yufei Zhang; Philipp Kapranov
Journal:  Nat Commun       Date:  2022-10-05       Impact factor: 17.694

  2 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.