| Literature DB >> 26902556 |
Hung-Wei Tsai1, Chia-Wei Chen1, Stuart R Thomas1,2, Cheng-Hung Hsu1, Wen-Chi Tsai1, Yu-Ze Chen1, Yi-Chung Wang1, Zhiming M Wang2, Hwen-Fen Hong3, Yu-Lun Chueh1.
Abstract
The use of costly and rare metals such as indium and gallium in Cu(In,Ga)Se2 (CIGS) based solar cells has motivated research into the use of Cu2ZnSnS4 (CZTS) as a suitable replacement due to its non-toxicity, abundance of compositional elements and excellent optical properties (1.5 eV direct band gap and absorption coefficient of ~10(4) cm(-1)). In this study, we demonstrate a one-step pulsed hybrid electrodeposition method (PHED), which combines electrophoretic and electroplating deposition to deposit uniform CZTS thin-films. Through careful analysis and optimization, we are able to demonstrate CZTS solar cells with the VOC, JSC, FF and η of 350 mV, 3.90 mA/cm(2), 0.43 and 0.59%, respectively.Entities:
Year: 2016 PMID: 26902556 PMCID: PMC4763260 DOI: 10.1038/srep19102
Source DB: PubMed Journal: Sci Rep ISSN: 2045-2322 Impact factor: 4.379
Figure 1(a) A schematic of three-electrode cell used for pulsed hybrid electrodeposition. (b) Curve of voltage, current and timing utilised during pulsed electrodeposition. (c) Elemental compositions of PHED-deposited CZTS thin films prior to the sulfurization process with different complexation durations. (d) An optical image illustrating the change of color of the electrolytic solution after the addition of Na2S2O3.
Figure 2(a) TEM image (b) SAED pattern and (c) XRD spectra of polycrystalline Cu2−xS (CuS and Cu2S) nanoparticle precipitate prepared in electrolyte solution showing an average diameter of ~10 nm and (c) top and cross section (inset) SEM image of PHED-deposited CZTS thin films prior to the sulfurization process.
Elemental composition of Cu2−xS nanoparticle precipitate in electrolytic solution.
| Cu (at%) | Zn (at%) | Sn (at%) | S (at%) |
|---|---|---|---|
| 48.74 | 3.12 | 5.60 | 42.54 |
Figure 3(a) Flow diagram illustrations showing (top) evolution of C2–xS nanoparticle precipitate formation and (bottom) effect of the duration of complexation reaction between citrate and Sn2+ on deposition rate, (b) schematic illustration of the sulfurization process timing and (c) overall process flow showing PHED film deposition and sulfurization step for the formation of CZTS absorber.
Figure 4(a) XRD and (b) Raman spectra of CZTS thin films fabricated using sulfurization process temperatures between 450 °C and 600 °C.
XRD FWHM of CZTS (112) plane under varied sulfurization temperatures.
| Sulfurization temperature | (112)FWHM (deg.) |
|---|---|
| 450 °C | 0.545 |
| 500 °C | 0.408 |
| 550 °C | 0.406 |
| 600 °C | 0.402 |
Elemental composition of PHED CZTS thin-films before and after sulfurization at an optimized temperature of 550 °C.
| Cu(at%) | Zn(at%) | Sn(at%) | S (at%) | [Cu]/([Zn]+[Sn]) | [Zn]/[Sn] | S/metal | |
|---|---|---|---|---|---|---|---|
| As-deposited | 25.33 | 19.44 | 14.56 | 40.67 | 0.75 | 1.34 | 0.69 |
| Sulfurized | 27.18 | 14.44 | 12.13 | 46.25 | 1.02 | 1.19 | 0.86 |
Figure 5Top view SEM images showing morphologies of CZTS films after the sulfurization processes at (a) 600 °C, (b) 550 °C, (c) 500 °C and (d) 450 °C. (e) plots of (αhυ)2 versus different photon energies with extracted optical band-gaps for the CZTS absorber thin-films.
Figure 6J-V characteristics of PHED CZTS solar cells fabricated using the sulfurization process temperatures between 450 °C and 600 °C measured under air mass 1.5 illumination.
Inset shows the device configuration.
Photovoltaic performance results for CZTS at different sulfurized temperatures
| Sulfurization temperature | Voc (mV) | Jsc (mA/cm2) | FF | η (%) | Rs (Ω cm2) | Rsh (Ω cm2) |
|---|---|---|---|---|---|---|
| 450 °C | 90 | 1.83 | 0.27 | 0.04 | 42.25 | 13.37 |
| 500 °C | 170 | 2.03 | 0.31 | 0.11 | 67.98 | 55.36 |
| 550 °C | 350 | 3.90 | 0.43 | 0.59 | 51.10 | 385.30 |
| 600 °C | 230 | 3.70 | 0.33 | 0.28 | 46.52 | 90.67 |
Comparison of quaternary electrodeposition of CZTS thin-films.
| Publishedyear | Method | Sulfurizationtemperature (°C) | Efficiency(%) | Ref. |
|---|---|---|---|---|
| 2010 | Electroplating | 550 °C | N/A | |
| 2011 | Electroplating | 550 °C | N/A | |
| 2011 | Electroplating | 500 °C | N/A | |
| 2011 | Electroplating | 550 °C | N/A | |
| 2012 | Electroplating | 550 °C | 1.21 | |
| 2013 | Electroplating | 200-600 °C | N/A | |
| 2013 | Electroplating | 500 °C | N/A | |
| 2013 | electrophoretic deposition | Not mentioned | N/A | |
| 2014 | Electroplating | 450–580 °C | N/A | |
| 2014 | Electroplating | 300–500 °C | N/A | |
| 2014 | Electroplating | 550 °C | N/A | |
| 2014 | Electroplating | 580 °C | 1.66 | |
| 2014 | Electroplating | 590 °C | 5.53 | |
| 2015 | Hybrid electrodeposition | 450–600 °C | 0.59 | This work |