| Literature DB >> 26744240 |
Chen Wei Shih1, Albert Chin1, Chun Fu Lu2, Wei Fang Su2.
Abstract
High mobility channel thin-film-transistor (TFT) is crucial for both display and future generation integrated circuit. We report a new metal-oxide TFT that has an ultra-thin 4.5 nm SnO2 thickness for both active channel and source-drain regions, very high 147 cm(2)/Vs field-effect mobility, high ION/IOFF of 2.3 × 10(7), small 110 mV/dec sub-threshold slope, and a low VD of 2.5 V for low power operation. This mobility is already better than chemical-vapor-deposition grown multi-layers MoS2 TFT. From first principle quantum-mechanical calculation, the high mobility TFT is due to strongly overlapped orbitals.Entities:
Year: 2016 PMID: 26744240 PMCID: PMC4705631 DOI: 10.1038/srep19023
Source DB: PubMed Journal: Sci Rep ISSN: 2045-2322 Impact factor: 4.379
Figure 1(a) I-V and C-V characteristics of gate capacitor, (b) I-Vcharacteristics of Al/SnO2/HfO2/n+-Si TFTs with 20 ~ 3.5 nm SnO2 layers, (c) I-V and (d) I-V, μ-V and Sqrt(I)-V characteristics of Al/SnO2/HfO2/n+-Si TFTs at 4.5 nm SnO2 thickness. The gate length is 50 μm.
Figure 2(a) XPS, (b) XRD, and (c) TEM analysis of SnO2 formed on HfO2/n+-Si. The SnO2 thickness is 20 nm for XPS and XRD analysis, while 4.5 nm for TEM.
Figure 3(a) DOS of (i) O, and (ii) Sn in SnO2, and (b) DOS of (i) O, and (ii) Zn in ZnO.