| Literature DB >> 26331081 |
Ryan Jin-Young Kim1, Jung-Soo Woo2, In-Bog Lee1, Young-Ah Yi3, Ji-Yun Hwang4, Deog-Gyu Seo1.
Abstract
BACKGROUND: This study aimed to investigate the microshear bond strength of universal bonding adhesives to leucite-reinforced glass-ceramic.Entities:
Keywords: Leucite-reinforced ceramic; Microshear bond strength; Resin cement; Thermocycling; Universal adhesive
Year: 2015 PMID: 26331081 PMCID: PMC4552369 DOI: 10.1186/s40824-015-0035-1
Source DB: PubMed Journal: Biomater Res ISSN: 1226-4601
Materials used in this study
|
|
|
|
|---|---|---|
| IPS Empress CAD (R04751) | Silicon dioxide, aluminum oxide, potassium oxide, sodium oxide, other oxides, pigments (Leucite-reinforced glass-ceramic) | Ivoclar Vivadent, Schaan, Liechtenstein |
| Porcelain etchant (9.5%) (120006991) | Hydrofluoric acid, polysulfonic acid | Bisco, Schaumburg, IL, USA |
| Single Bond Universal (539321) | MDP, Bis-GMA, HEMA, decamethylene DMA, ethanol, water, silane treated silica, 2-propenoic acid, −methyl-, reaction products with 1,10-decanediol and phosphorous oxide, copolymer of acrylic and itaconic acid, dimethylaminobenzoate(−4), camphorquinone, (dimethylamino)ethyl methacrylate, methyl ethyl ketone | 3M ESPE, St. Paul, MN, USA |
| ALL-BOND Universal (1400002645) | MDP, Bis-GMA, HEMA, ethanol, water, initiators | Bisco, Schaumburg, IL, USA |
| RelyX Ceramic primer (N526043) | Ethyl alcohol, water, methacryloxypropyl-trimethoxysilane | 3M ESPE, St. Paul, MN, USA |
| Adper Scotchbond Multi-Purpose Adhesive (N530683) | Bis-GMA, HEMA, triphenylantimony | 3M ESPE, St. Paul, MN, USA |
| RelyX Ultimate (545247) |
| 3M ESPE, St. Paul, MN, USA |
Abbreviations: Bis-GMA, bisphenol-A diglycidyl ether dimethacrylate; DMA, dimethacrylate; HEMA, hydroxyethyl methacrylate; MDP, 10-methacryloyloxydecyl dihydrogen phosphate; TEGDMA, triethylene glycol dimethacrylate.
Figure 1Experimental design of the study.
Mean and standard deviation (SD) of micro-shear bond strength (in MPa)
|
|
|
|
|---|---|---|
| NC | 22.71 (2.22)c | 16.60 (4.37)c,* |
| SBU | 27.99 (3.89)b | 23.89 (2.00)b,* |
| ABU | 27.22 (2.06)b | 22.76 (3.90)b,* |
| PC | 32.92 (3.41)a | 27.91 (3.05)a,* |
Within the same column, values with different superscript lower case letters are statistically significantly different (Tukey HSD, P < 0.05).
*indicates significant reduction in bond strength of each group after 10,000 thermocycles (Paired T-test, where P < 0.05).
Abbreviations: NC, negative control; SBU, Single Bond Universal; ABU, ALL-BOND Universal; PC, positive control.
Figure 2Percentage distribution of failure modes after 24 h and 10,000 thermocycles. Abbreviations: NC, negative control; SBU, Single Bond Universal; ABU, ALL-BOND Universal; PC, positive control.
Figure 3Representative SEM images of the fractured ceramic specimens. (A) Within the cemented area in NC (negative control), (B-D) At the interface between the initial cemented surface (area above the dashed lines) and uncemented surface of the ceramic in SBU (Single Bond Universal), ABU (ALL-BOND Universal), and PC (positive control), respectively. Arrowheads (A-C) indicate the junction between the resin cement (RC) and fractured ceramic (FC). Magnification x200.