Literature DB >> 25139815

Effects of solvent evaporation time on immediate adhesive properties of universal adhesives to dentin.

Issis V Luque-Martinez1, Jorge Perdigão2, Miguel A Muñoz3, Ana Sezinando4, Alessandra Reis1, Alessandro D Loguercio1.   

Abstract

OBJECTIVE: To evaluate the microtensile bond strengths (μTBS) and nanoleakage (NL) of three universal or multi-mode adhesives, applied with increasing solvent evaporation times.
METHODS: One-hundred and forty caries-free extracted third molars were divided into 20 groups for bond strength testing, according to three factors: (1) Adhesive - All-Bond Universal (ABU, Bisco, Inc.), Prime&Bond Elect (PBE, Dentsply), and Scotchbond Universal Adhesive (SBU, 3M ESPE); (2) Bonding strategy - self-etch (SE) or etch-and-rinse (ER); and (3) Adhesive solvent evaporation time - 5s, 15s, and 25s. Two extra groups were prepared with ABU because the respective manufacturer recommends a solvent evaporation time of 10s. After restorations were constructed, specimens were stored in water (37°C/24h). Resin-dentin beams (0.8mm(2)) were tested at 0.5mm/min (μTBS). For NL, forty extracted molars were randomly assigned to each of the 20 groups. Dentin disks were restored, immersed in ammoniacal silver nitrate, sectioned and processed for evaluation under a FESEM in backscattered mode. Data from μTBS were analyzed using two-way ANOVA (adhesive vs. drying time) for each strategy, and Tukey's test (α=0.05). NL data were computed with non-parametric tests (Kruskal-Wallis and Mann-Whitney tests, α=0.05).
RESULTS: Increasing solvent evaporation time from 5s to 25s resulted in statistically higher mean μTBS for all adhesives when used in ER mode. Regarding NL, ER resulted in greater NL than SE for each of the evaporation times regardless of the adhesive used. A solvent evaporation time of 25s resulted in the lowest NL for SBU-ER. SIGNIFICANCE: Residual water and/or solvent may compromise the performance of universal adhesives, which may be improved with extended evaporation times.
Copyright © 2014 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

Entities:  

Keywords:  Dentin; Etch-and-rinse; Microtensile bond strength; Nanoleakage; Self-etch; Solvent evaporation; Universal simplified adhesive systems

Mesh:

Substances:

Year:  2014        PMID: 25139815     DOI: 10.1016/j.dental.2014.07.002

Source DB:  PubMed          Journal:  Dent Mater        ISSN: 0109-5641            Impact factor:   5.304


  19 in total

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4.  Bonding performance and ultramorphology of the resin-dentine interface of contemporary universal adhesives.

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Review 8.  Bond Strength of Universal Adhesives to Dentin: A Systematic Review and Meta-Analysis.

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9.  Exposed Dentin: Influence of Cleaning Procedures and Simulated Pulpal Pressure on Bond Strength of a Universal Adhesive System.

Authors:  Simon Flury; Anne Peutzfeldt; Patrick R Schmidlin; Adrian Lussi
Journal:  PLoS One       Date:  2017-01-12       Impact factor: 3.240

Review 10.  Current perspectives on dental adhesion: (1) Dentin adhesion - not there yet.

Authors:  Jorge Perdigão
Journal:  Jpn Dent Sci Rev       Date:  2020-09-23
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