| Literature DB >> 22842049 |
Donald C Shrum1, Brent W Woodruff, Scott M Stagg.
Abstract
New instrumentation for three-dimensional electron microscopy is facilitating an increase in the throughput of data collection and reconstruction. The increase in throughput creates bottlenecks in the workflow for storing and processing the image data. Here we describe the creation and quantify the throughput of a high-throughput infrastructure supporting collection of three-dimensional data collection.Entities:
Mesh:
Year: 2012 PMID: 22842049 PMCID: PMC3466351 DOI: 10.1016/j.jsb.2012.07.009
Source DB: PubMed Journal: J Struct Biol ISSN: 1047-8477 Impact factor: 2.867