| Literature DB >> 21970658 |
Krishnamurthy Nemani1, Joonbum Kwon, Krutarth Trivedi, Walter Hu, Jeong-Bong Lee, Barjor Gimi.
Abstract
Mechanically robust, cell encapsulating microdevices fabricated using photolithographic methods can lead to more efficient immunoisolation in comparison to cell encapsulating hydrogels. There is a need to develop adhesive bonding methods which can seal such microdevices under physiologically friendly conditions. We report the bonding of SU-8 based substrates through (i) magnetic self assembly, (ii) using medical grade photocured adhesive and (iii) moisture and photochemical cured polymerization. Magnetic self-assembly, carried out in biofriendly aqueous buffers, provides weak bonding not suitable for long term applications. Moisture cured bonding of covalently modified SU-8 substrates, based on silanol condensation, resulted in weak and inconsistent bonding. Photocured bonding using a medical grade adhesive and of acrylate modified substrates provided stable bonding. Of the methods evaluated, photocured adhesion provided the strongest and most stable adhesion.Entities:
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Year: 2011 PMID: 21970658 PMCID: PMC3792795 DOI: 10.3109/02652048.2011.621552
Source DB: PubMed Journal: J Microencapsul ISSN: 0265-2048 Impact factor: 3.142