| Literature DB >> 21711498 |
Mohd Abdul Majeed Khan1, Sushil Kumar, Maqusood Ahamed, Salman A Alrokayan, Mohammad Saleh Alsalhi.
Abstract
This work reports the preparation and characterization of silver nanoparticles synthesized through wet chemical solution method and of silver films deposited by dip-coating method. X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), field emission transmission electron microscopy (FETEM), high-resolution transmission electron microscopy (HRTEM), selected area electron diffraction (SAED), and energy dispersive spectroscopy (EDX) have been used to characterize the prepared silver nanoparticles and thin film. The morphology and crystal structure of silver nanoparticles have been determined by FESEM, HRTEM, and FETEM. The average grain size of silver nanoparticles is found to be 17.5 nm. The peaks in XRD pattern are in good agreement with that of face-centered-cubic form of metallic silver. TGA/DTA results confirmed the weight loss and the exothermic reaction due to desorption of chemisorbed water. The temperature dependence of resistivity of silver thin film, determined in the temperature range of 100-300 K, exhibit semiconducting behavior of the sample. The sample shows the activated variable range hopping in the localized states near the Fermi level.Entities:
Year: 2011 PMID: 21711498 PMCID: PMC3211852 DOI: 10.1186/1556-276X-6-434
Source DB: PubMed Journal: Nanoscale Res Lett ISSN: 1556-276X Impact factor: 4.703
Figure 1XRD pattern of silver nanoparticles and inset shows Williamson-Hall plot for the same.
Figure 2FESEM image of silver nanoparticles and inset shows EDX profile for the same.
Figure 3FETEM and HRTEM images of silver nanoparticles. (a) FETEM image of silver nanoparticles. (b) High-resolution image of a single silver nanoparticle and inset shows SAED pattern for the same.
Figure 4DTA-TGA themogram of silver nanoparticles.
Figure 5Resistivity as function of temperature for thin film of silver nanoparticles. Inset shows the plot of ln ρ vs T-1/4.