| Literature DB >> 20721226 |
Jonghan Jin1, Jae Wan Kim, Chu-Shik Kang, Jong-Ahn Kim, Tae Bong Eom.
Abstract
We have proposed and demonstrated a novel method that can determine both the geometrical thickness and refractive index of a silicon wafer at the same time using an optical comb. The geometrical thickness and refractive index of a silicon wafer was determined from the optical thickness using phase information obtained in the spectral domain. In a feasibility test, the geometrical thickness and refractive index of a wafer were measured to be 334.85 microm and 3.50, respectively. The measurement uncertainty for the geometrical thickness was evaluated as 0.95 microm (k = 1) using a preliminary setup.Mesh:
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Year: 2010 PMID: 20721226 DOI: 10.1364/OE.18.018339
Source DB: PubMed Journal: Opt Express ISSN: 1094-4087 Impact factor: 3.894