Literature DB >> 19848138

Life-cycle energy demand and global warming potential of computational logic.

Sarah B Boyd1, Arpad Horvath, David Dornfeld.   

Abstract

Computational logic, in the form of semiconductor chips of the complementary metal oxide semiconductor (CMOS) transistor structure, is used in personal computers, wireless devices, IT network infrastructure, and nearly all modem electronics. This study provides a life-cycle energy analysis for CMOS chips over 7 technology generations with the purpose of comparing energy demand and global warming potential (GWP) impacts of the life-cycle stages, examining trends in these impacts over time and evaluating their sensitivity to data uncertainty and changes in production metrics such as yield. A hybrid life-cycle assessment (LCA) model is used. While life-cycle energy and GWP of emissions have increased on the basis of a wafer or die, these impacts have been reducing per unit of computational power. Sensitivity analysis of the model shows that impacts have the highest relative sensitivity to wafer yield, line yield, and die size and largest absolute sensitivity to the use-phase power demand of the chip.

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Year:  2009        PMID: 19848138     DOI: 10.1021/es901514n

Source DB:  PubMed          Journal:  Environ Sci Technol        ISSN: 0013-936X            Impact factor:   9.028


  3 in total

1.  Environmental effects of information and communications technologies.

Authors:  Eric Williams
Journal:  Nature       Date:  2011-11-16       Impact factor: 49.962

Review 2.  Green Nanofabrication Opportunities in the Semiconductor Industry: A Life Cycle Perspective.

Authors:  Eleanor Mullen; Michael A Morris
Journal:  Nanomaterials (Basel)       Date:  2021-04-22       Impact factor: 5.076

3.  Disassembly-based bill of materials data for consumer electronic products.

Authors:  Callie W Babbitt; Hema Madaka; Shahana Althaf; Barbara Kasulaitis; Erinn G Ryen
Journal:  Sci Data       Date:  2020-07-30       Impact factor: 6.444

  3 in total

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