Literature DB >> 19824002

Optimized structural designs for stretchable silicon integrated circuits.

Dae-Hyeong Kim1, Zhuangjian Liu, Yun-Soung Kim, Jian Wu, Jizhou Song, Hoon-Sik Kim, Yonggang Huang, Keh-Chih Hwang, Yongwei Zhang, John A Rogers.   

Abstract

Materials and design strategies for stretchable silicon integrated circuits that use non-coplanar mesh layouts and elastomeric substrates are presented. Detailed experimental and theoretical studies reveal many of the key underlying aspects of these systems. The results shpw, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to approximately 90%. Simple circuits, including complementary metal-oxide-semiconductor inverters and n-type metal-oxide-semiconductor differential amplifiers, validate these designs. The results suggest practical routes to high-performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies.

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Year:  2009        PMID: 19824002     DOI: 10.1002/smll.200900853

Source DB:  PubMed          Journal:  Small        ISSN: 1613-6810            Impact factor:   13.281


  16 in total

1.  Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing.

Authors:  Seok Kim; Jian Wu; Andrew Carlson; Sung Hun Jin; Anton Kovalsky; Paul Glass; Zhuangjian Liu; Numair Ahmed; Steven L Elgan; Weiqiu Chen; Placid M Ferreira; Metin Sitti; Yonggang Huang; John A Rogers
Journal:  Proc Natl Acad Sci U S A       Date:  2010-09-21       Impact factor: 11.205

2.  Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards.

Authors:  Qiao Li; Xiao Ming Tao
Journal:  Proc Math Phys Eng Sci       Date:  2014-11-08       Impact factor: 2.704

3.  Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

Authors:  Dae Seung Wie; Yue Zhang; Min Ku Kim; Bongjoong Kim; Sangwook Park; Young-Joon Kim; Pedro P Irazoqui; Xiaolin Zheng; Baoxing Xu; Chi Hwan Lee
Journal:  Proc Natl Acad Sci U S A       Date:  2018-07-16       Impact factor: 11.205

4.  Materials for multifunctional balloon catheters with capabilities in cardiac electrophysiological mapping and ablation therapy.

Authors:  Dae-Hyeong Kim; Nanshu Lu; Roozbeh Ghaffari; Yun-Soung Kim; Stephen P Lee; Lizhi Xu; Jian Wu; Rak-Hwan Kim; Jizhou Song; Zhuangjian Liu; Jonathan Viventi; Bassel de Graff; Brian Elolampi; Moussa Mansour; Marvin J Slepian; Sukwon Hwang; Joshua D Moss; Sang-Min Won; Younggang Huang; Brian Litt; John A Rogers
Journal:  Nat Mater       Date:  2011-03-06       Impact factor: 43.841

5.  Waterproof AlInGaP optoelectronics on stretchable substrates with applications in biomedicine and robotics.

Authors:  Rak-Hwan Kim; Dae-Hyeong Kim; Jianliang Xiao; Bong Hoon Kim; Sang-Il Park; Bruce Panilaitis; Roozbeh Ghaffari; Jimin Yao; Ming Li; Zhuangjian Liu; Viktor Malyarchuk; Dae Gon Kim; An-Phong Le; Ralph G Nuzzo; David L Kaplan; Fiorenzo G Omenetto; Yonggang Huang; Zhan Kang; John A Rogers
Journal:  Nat Mater       Date:  2010-10-17       Impact factor: 43.841

6.  A finite deformation model of planar serpentine interconnects for stretchable electronics.

Authors:  Zhichao Fan; Yihui Zhang; Qiang Ma; Fan Zhang; Haoran Fu; Keh-Chih Hwang; Yonggang Huang
Journal:  Int J Solids Struct       Date:  2016-04-27       Impact factor: 3.900

7.  Buckling in serpentine microstructures and applications in elastomer-supported ultra-stretchable electronics with high areal coverage.

Authors:  Yihui Zhang; Sheng Xu; Haoran Fu; Juhwan Lee; Jessica Su; Keh-Chih Hwang; John A Rogers; Yonggang Huang
Journal:  Soft Matter       Date:  2013       Impact factor: 3.679

8.  Stretchable electronics based on Ag-PDMS composites.

Authors:  Alexandre Larmagnac; Samuel Eggenberger; Hanna Janossy; Janos Vörös
Journal:  Sci Rep       Date:  2014-12-01       Impact factor: 4.379

9.  Peel-and-stick: mechanism study for efficient fabrication of flexible/transparent thin-film electronics.

Authors:  Chi Hwan Lee; Jae-Han Kim; Chenyu Zou; In Sun Cho; Jeffery M Weisse; William Nemeth; Qi Wang; Adri C T van Duin; Taek-Soo Kim; Xiaolin Zheng
Journal:  Sci Rep       Date:  2013-10-10       Impact factor: 4.379

10.  Design, fabrication and failure analysis of stretchable electrical routings.

Authors:  Hong Hocheng; Chao-Ming Chen
Journal:  Sensors (Basel)       Date:  2014-07-04       Impact factor: 3.576

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