Temperature rise during adhesive and resin composite polymerization with various light curing sources.

This study evaluated the temperature rise in two different adhesive (Clearfil SE Bond [CSEB] and EBS-Multi [EBSM]) and composite systems (Clearfil AP-X [CAPX,] Pertac II [PII]) by the same manufacturer when illuminated by four different light sources: Light-emitting diode (LED), Plasma arc curing (PAC), high intensity quartz tungsten halogen (HQTH) and quartz tungsten halogen (QTH). Forty dentin disks were prepared from extracted premolars. These dentin disks were placed in apparatus developed to measure temperature rise. Temperature rise during photopolymerization of adhesive resin and resin composite was then measured. The mean values of temperature increases for adhesive and resin composites did not differ significantly (p=0.769). The highest temperature rise was observed during photopolymerization of EBSM with PAC (5.16 degrees C) and HQTH (4.28 degrees C), respectively. Temperature rise values produced by QTH (1.27 degrees C - 2.83 degrees C for adhesive resin; 1.86 degrees C - 2.85 degrees C for resin composite) for both adhesive and resin composites were significantly lower than those induced by PAC and HQTH (p<0.05). However, these values were significantly higher than those produced by LED (1.16 degrees C - 2.08 degrees C for adhesive resin; 1.13 degrees C - 2.59 degrees C for resin composite). Light sources with high energy output (PAC and HQTH) caused significantly higher temperature rise than sources with low energy output (QTH and LED). However, in this study, no temperature rises beneath 1-mm dentin disk exceed the critical 5.6 degrees C value for pulpal health.