Literature DB >> 9983443

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.

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Abstract

Year:  1996        PMID： 9983443     DOI： 10.1103/physrevb.53.16027

Source DB:  PubMed          Journal:  Phys Rev B Condens Matter        ISSN： 0163-1829


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  3 in total

1.  Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate.

Authors:  M L Huang; F Yang
Journal:  Sci Rep       Date:  2014-11-19       Impact factor: 4.379

2.  Formation of alternating interfacial layers in Au-12Ge/Ni joints.

Authors:  Shih-kang Lin; Ming-yueh Tsai; Ping-chun Tsai; Bo-hsun Hsu
Journal:  Sci Rep       Date:  2014-04-02       Impact factor: 4.379

3.  In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy.

Authors:  Xin F Tan; Flora Somidin; Stuart D McDonald; Michael J Bermingham; Hiroshi Maeno; Syo Matsumura; Kazuhiro Nogita
Journal:  Materials (Basel)       Date:  2022-01-10       Impact factor: 3.623
  3 in total

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