Literature DB >> 9900467

Copper electrodeposits in paper support.

.   

Abstract

Entities:  

Year:  1988        PMID： 9900467     DOI： 10.1103/physreva.38.1036

Source DB:  PubMed          Journal:  Phys Rev A Gen Phys        ISSN： 0556-2791


× No keyword cloud information.
  1 in total

1.  Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation.

Authors:  Chenhuinan Wei; Guoxing Wu; Sanjun Yang; Qiming Liu
Journal:  Sci Rep       Date:  2016-10-13       Impact factor: 4.379
  1 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.