Literature DB >> 9856872

A new technique applicable to pediatric laparoscopic surgery: abdominal wall 'area lifting' with subcutaneous wiring.

K Yokomori1, K Terawaki, Y Kamii, K Obana, K Hashizume, T Hoshino, D Hashimoto.   

Abstract

BACKGROUND: Recently, the authors developed a unique method of laparoscopic surgery without pneumoperitoneum: "area lifting of the abdominal wall with subcutaneous wiring."
METHODS: In this gasless procedure, the anterior abdominal wall is pulled upward by a pair of wires placed subcutaneously and held by thick sutures for "hanger lifting." Simultaneous lifting of a pair of subcutaneous wires across the abdomen, produces a wide, roof-shaped intraabdominal space sufficient for laparoscopic surgical procedures. The practical aspects of this gasless technique, as well as the authors' limited experience with this method in 24 children, ranging from 8 days to 15 years of age is presented. These children have had various pathologies including splenomegaly, rectal prolapse, ovarian cyst, gall stone, adrenal neuroblastoma, and abdominal wall abscess.
CONCLUSIONS: Gasless laparoscopic surgery with double subcutaneous wiring is safe for children including neonates and those with respiratory compromise because all operative procedures are performed under normal abdominal pressure. Because of the highly elastic abdominal wall musculature inherent in children, this selective area lifting of abdominal wall creates a relatively larger peritoneal volume than in adults.

Entities:  

Mesh:

Year:  1998        PMID: 9856872     DOI: 10.1016/s0022-3468(98)90586-3

Source DB:  PubMed          Journal:  J Pediatr Surg        ISSN: 0022-3468            Impact factor:   2.545


  2 in total

Review 1.  Laparoscopic surgery in children.

Authors:  P K Tam
Journal:  Arch Dis Child       Date:  2000-03       Impact factor: 3.791

Review 2.  Laparoscopy in pediatric urology.

Authors:  J I Telsey; A A Caldamone
Journal:  Curr Urol Rep       Date:  2001-04       Impact factor: 3.092

  2 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.