Evaluation of a new light-cured orthodontic bonding adhesive.

The purpose of this study was to compare a new light-cured bonding system that used a hybrid adhesive containing a resin reinforced glass ionomer (Fuji Ortho LC, GC America, Inc.) with a more traditional light-cured bonding system (Transbond, 3M Unitek) that contained resin material only. Seventy-five recently extracted human molars were collected and stored in a solution of 0.1% (weight/volume) thymol. The teeth were randomly separated into five groups of 15 molars each: Group I--using Transbond adhesive system with the enamel etched and dried before bonding. Group II--using Fuji Ortho LC (FOLC) adhesive system with no etch and the enamel wet with water before bonding. Group III--using FOLC adhesive system with the enamel etched and wet with water before bonding. Group IV--using FOLC adhesive system with no etch and the enamel wet with saliva before bonding. Group V--using FOLC adhesive system with the enamel etched and wet with saliva before bonding. The shear bond strength was performed after thermal cycling between 5 degrees +/- 2 degrees C and 50 degrees +/- 2 degrees C for a total of 2000 cycles with the Zwick test machine (Zwick Gm bH & Co.). After debonding, the teeth and brackets were examined under x10 magnification to evaluate the site of bond failure and the presence of residual adhesive. The analysis of variance was used to determine whether significant differences existed between the various groups. The findings indicated that there were no statistically significant differences among the three experimental groups I, III, and V that had the enamel surface etched before bonding, regardless of the adhesive used or the enamel surface contamination with water or saliva. On the other hand, the two experimental groups that did not have the enamel etched before bonding (II and IV) had significantly lower bond strengths. In conclusion, etching the enamel surface is a critical variable that affects shear bond strength as well as bond failure location when using the new adhesive system.