Literature DB >> 9278039

Genomic stability. Silencing and DNA repair connect.

S P Jackson.   

Abstract

Mesh:

Substances:

Year:  1997        PMID: 9278039     DOI: 10.1038/42136

Source DB:  PubMed          Journal:  Nature        ISSN: 0028-0836            Impact factor:   49.962


× No keyword cloud information.
  7 in total

1.  SIR functions are required for the toleration of an unrepaired double-strand break in a dispensable yeast chromosome.

Authors:  C B Bennett; J R Snipe; J W Westmoreland; M A Resnick
Journal:  Mol Cell Biol       Date:  2001-08       Impact factor: 4.272

2.  Cdc13 cooperates with the yeast Ku proteins and Stn1 to regulate telomerase recruitment.

Authors:  N Grandin; C Damon; M Charbonneau
Journal:  Mol Cell Biol       Date:  2000-11       Impact factor: 4.272

3.  Phenotypic analysis and virulence of Candida albicans LIG4 mutants.

Authors:  E Andaluz; R Calderone; G Reyes; G Larriba
Journal:  Infect Immun       Date:  2001-01       Impact factor: 3.441

Review 4.  Interaction of Ku protein and DNA-dependent protein kinase catalytic subunit with nucleic acids.

Authors:  W S Dynan; S Yoo
Journal:  Nucleic Acids Res       Date:  1998-04-01       Impact factor: 16.971

5.  Host genes that affect the target-site distribution of the yeast retrotransposon Ty1.

Authors:  H Huang; J Y Hong; C L Burck; S W Liebman
Journal:  Genetics       Date:  1999-04       Impact factor: 4.562

6.  Components of the Ku-dependent non-homologous end-joining pathway are involved in telomeric length maintenance and telomeric silencing.

Authors:  S J Boulton; S P Jackson
Journal:  EMBO J       Date:  1998-03-16       Impact factor: 11.598

7.  Telomere length kinetics assay (TELKA) sorts the telomere length maintenance (tlm) mutants into functional groups.

Authors:  Linda Rubinstein; Lior Ungar; Yaniv Harari; Vera Babin; Shay Ben-Aroya; Gabor Merenyi; Lisette Marjavaara; Andrei Chabes; Martin Kupiec
Journal:  Nucleic Acids Res       Date:  2014-04-11       Impact factor: 16.971

  7 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.