Literature DB >> 8831754

Comparative molecular field analysis of haptens docked to the multispecific antibody IgE(Lb4)

A M Gamper1, R H Winger, K R Liedl, C A Sotriffer, J M Varga, R T Kroemer, B M Rode.   

Abstract

Using comparative molecular field analysis (CoMFA), three-dimensional quantitative structure-activity relationships were developed for 27 haptens which bind to the monoclonal antibody IgE(Lb4). In order to obtain an alignment for these structurally very diverse antigens, the compounds were docked to a previously modeled receptor structure using the automated docking program AUTODOCK (Goodsell, D.S.; Olson, A.J. Proteins: Struct., Funct., Genet. 1990, 8, 195-202). Remarkably, this alignment method yielded highly consistent QSAR models, as indicated by the corresponding cross-validated r2 values (0.809 for a model with carbon as probe atom, 0.773 for a model with hydrogen as probe atom). Conventional alignment failed in providing a basis for self-consistent CoMFAs. Amino acids Tyr H 50, Tyr H 52, and Trp H 95 of the receptor appeared to be of crucial importance for binding of various antigens. These findings are consistent with earlier considerations of aromatic residues being responsible for the multispecificity of certain immunoglobulins.

Entities:  

Mesh:

Substances:

Year:  1996        PMID: 8831754     DOI: 10.1021/jm960229i

Source DB:  PubMed          Journal:  J Med Chem        ISSN: 0022-2623            Impact factor:   7.446


  2 in total

1.  Alignment of flexible molecules at their receptor site using 3D descriptors and Hi-PCA.

Authors:  A Berglund; M C De Rosa; S Wold
Journal:  J Comput Aided Mol Des       Date:  1997-11       Impact factor: 3.686

2.  Automated docking of ligands to an artificial active site: augmenting crystallographic analysis with computer modeling.

Authors:  Robin J Rosenfeld; David S Goodsell; Rabi A Musah; Garrett M Morris; David B Goodin; Arthur J Olson
Journal:  J Comput Aided Mol Des       Date:  2003-08       Impact factor: 3.686

  2 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.