| Literature DB >> 7641893 |
Abstract
Vesicle budding from the endoplasmic reticulum (ER) has been reconstituted with washed membranes and three soluble proteins: Sec13 complex, Sec23 complex and the small GTPase Sar1p. The proteins that drive this cell-free vesicle budding reaction form an approximately 10 nm thick electron dense coat on ER-derived vesicles. Although the overall mechanism of membrane budding driven by various cytoplasmic coats appears similar, the constituents of this new membrane coat are molecularly distinct from the non-clathrin coat (COP) involved in intra-Golgi transport and the clathrin-containing coats. The new vesicle coat has been termed COPII.Entities:
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Year: 1995 PMID: 7641893 DOI: 10.1016/0014-5793(95)00618-j
Source DB: PubMed Journal: FEBS Lett ISSN: 0014-5793 Impact factor: 4.124