Literature DB >> 3889658

Mismatch-specific post-meiotic segregation frequency in yeast suggests a heteroduplex recombination intermediate.

J H White, K Lusnak, S Fogel.   

Abstract

Post-meiotic segregation of alleles, which is seen, for example, in the 5:3 distribution of alleles in the products of a single meiosis in fungi, has been thought to be due to the non-repair of heteroduplex regions formed during genetic recombination. In current models of genetic recombination, heteroduplex DNA is formed either as the primary intermediate generated by two interacting non-sister chromatids or as a short region flanking a double-stranded gap. The frequency of post-meiotic segregation differs for different alleles, and this is presumed to reflect the varying efficiencies with which different types of mismatches in the heteroduplex are repaired. To gain some insight into this process, we have now determined the nucleotide sequences of various yeast alleles with different post-meiotic segregation frequencies and compared the mismatches predicted to occur in heteroduplexes of these alleles with wild-type DNA with those repaired with varying efficiency in bacterial systems. A striking correlation is observed, with the mismatches predicted for high post-meiotic segregation frequency alleles being similar to mismatches repaired with low efficiency in bacteria. These results support the view that postmeiotic segregation frequency reflects heteroduplex repair efficiency and the contention that meiotic gene conversion is the result of the successful repair of heteroduplex mismatches.

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Year:  1985        PMID: 3889658     DOI: 10.1038/315350a0

Source DB:  PubMed          Journal:  Nature        ISSN: 0028-0836            Impact factor:   49.962


  67 in total

1.  Analysis of a gene conversion gradient at the HIS4 locus in Saccharomyces cerevisiae.

Authors:  P Detloff; M A White; T D Petes
Journal:  Genetics       Date:  1992-09       Impact factor: 4.562

2.  DNA mismatch repair in Xenopus egg extracts: repair efficiency and DNA repair synthesis for all single base-pair mismatches.

Authors:  I Varlet; M Radman; P Brooks
Journal:  Proc Natl Acad Sci U S A       Date:  1990-10       Impact factor: 11.205

3.  Disruption of the gene for Met-tRNA(fMet) formyltransferase severely impairs growth of Escherichia coli.

Authors:  J M Guillon; Y Mechulam; J M Schmitter; S Blanquet; G Fayat
Journal:  J Bacteriol       Date:  1992-07       Impact factor: 3.490

4.  MuDR transposase increases the frequency of meiotic crossovers in the vicinity of a Mu insertion in the maize a1 gene.

Authors:  Marna D Yandeau-Nelson; Qing Zhou; Hong Yao; Xiaojie Xu; Basil J Nikolau; Patrick S Schnable
Journal:  Genetics       Date:  2004-10-16       Impact factor: 4.562

5.  Regulation of the ADE2 gene from Saccharomyces cerevisiae.

Authors:  A Stotz; P P Müller; P Linder
Journal:  Curr Genet       Date:  1993-12       Impact factor: 3.886

6.  Measurements of excision repair tracts formed during meiotic recombination in Saccharomyces cerevisiae.

Authors:  P Detloff; T D Petes
Journal:  Mol Cell Biol       Date:  1992-04       Impact factor: 4.272

7.  Formation of heteroduplex DNA during mammalian intrachromosomal gene conversion.

Authors:  R J Bollag; D R Elwood; E D Tobin; A R Godwin; R M Liskay
Journal:  Mol Cell Biol       Date:  1992-04       Impact factor: 4.272

8.  Genetic and molecular analysis of recombination events in Saccharomyces cerevisiae occurring in the presence of the hyper-recombination mutation hpr1.

Authors:  A Aguilera; H L Klein
Journal:  Genetics       Date:  1989-07       Impact factor: 4.562

9.  TEL2, an essential gene required for telomere length regulation and telomere position effect in Saccharomyces cerevisiae.

Authors:  K W Runge; V A Zakian
Journal:  Mol Cell Biol       Date:  1996-06       Impact factor: 4.272

10.  The Drosophila meiotic recombination gene mei-9 encodes a homologue of the yeast excision repair protein Rad1.

Authors:  J J Sekelsky; K S McKim; G M Chin; R S Hawley
Journal:  Genetics       Date:  1995-10       Impact factor: 4.562

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