| Literature DB >> 36188266 |
Jonathan Tersur Orasugh1,2, Suprakas Sinha Ray1,2.
Abstract
As a result of advancements in electronics/telecommunications, electromagnetic interference (EMI) pollution has gotten worse. Hence, fabrication/investigation of EMI shields having outstanding EMI shielding performance is necessary. Electrospinning (ES) has recently been established in several niches where 1D nanofibers (NFs) fabricated by ES can provide the shielding of EM waves, owing to their exceptional benefits. This review presents the basic correlations of ES technology and EMI shielding. Diverse graphene (GP)-based fibrous materials directly spun via ES as EMI shields are discussed. Electrospun EMI shields as composites through diverse post-treatments are reviewed, and then different factors influencing their EMI shielding characteristics are critically summarized. Finally, deductions and forthcoming outlooks are given. This review provides up to date knowledge on the advancement of the application of graphene-based electrospun fibers/composite materials as EMI shields and the outlook for high-performance electrospun fibers/composite-based EMI shielding materials.Entities:
Year: 2022 PMID: 36188266 PMCID: PMC9520699 DOI: 10.1021/acsomega.2c03579
Source DB: PubMed Journal: ACS Omega ISSN: 2470-1343
Figure 1(a) Overview of graphene-based electrospun fibrous materials as EMI shields, with different corresponding influencing factors. (b) Schematic presentation of EM wave sheltering mechanism of graphene-based polymeric nanocomposites/fibers as well as (c) electromagnetic spectrum wavelength and frequency.
Figure 2Schematic presentation of the electrospinning technique.
Figure 3(a) Graphical presentation of electromagnetic wave and (b) A segment of traveling EM wave with in-phase mutually orthogonal E and B. Reproduced with permission from ref (30). Copyright 2022 Elsevier Science Ltd.
Figure 4Morphology and element analysis (a–c) of the hybrid nanowires. Microwave RL for the samples of (d) S1300, (e) S1400, (f) S1500, and (g) S1600. Reproduced with permission from ref (52). Copyright 2018 Elsevier Science Ltd.
Figure 5(a) Schematic presentation of the preparation of flexible networks and CNF–GN–CNF heterojunctions via ES. SEM images of virgin CNF networks (b) and GN/CNF composite networks with 17.2 and 31.9 wt % GN (c,d). (e) EC of the samples with different GN loadings. (f) Absolute SE of the GN/CNF nanocomposite networks with 17.2 wt % GN calculated based on its performance in virgin CNF networks. Reproduced from ref (57). Copyright 2014 American Chemical Society.
Figure 6Thermal conductivities of the (Ag/rGO)/PI nanocomposites. (a) Mass fraction of Ag/rGO and rGO influencing the λ values of the (Ag/rGO)/PI and rGO/PI nanocomposites, respectively. (b) Infrared thermal images of (Ag/rGO)/PI nanocomposites. Reproduced from ref (60). Copyright 2019 American Chemical Society.
Figure 7Scheme showing diverse deposition approaches.
Figure 8Schematic presentation of the dip-coating method.
Figure 9Schematic illustration of equipment used in electroless coating studies depicted in its most basic form.
Figure 10(a) Schematic representation of basic spray deposition technique for the deposition of metallic particles upon a substrate and (b) experimental procedure for ESD illustrated schematically.
Figure 11Scheme representing the vacuum filtration deposition technique.
Comparison of Deposition Techniques
| deposition techniques | advantages | disadvantages | ref |
|---|---|---|---|
| dip deposition technique | method is inexpensive | difficult to control coating thickness | ( |
| multiple dip deposition could be used to achieve thicker films | the annealing temperature, precursor concentration, as well as solvents or additives, used all participate directly in film surface quality | ||
| parallel preparation of multilayers of different materials is possible | |||
| electroless deposition | there are no issues with the current network | as the solution ages, byproducts may react, affecting the fabrication | ( |
| nanosheets of metals, alloys, and compounds could be coated on insulators such as glass, ceramics, and polymers | nontargeted nucleation as well as failure to nucleate or grow films on selected regions due to contamination or other challenges only with the catalyst surface | ||
| it is a simple deposition tool | the procedure takes a long time | ||
| has a low temperature when compared to other vacuum deposition procedures | the deposition rate is relatively low | ||
| less expensive method | obtaining a film thickness greater than 1 m in a single-dip deposition is difficult | ||
| there is no need for a vacuum environment | |||
| produces uniform films of high quality | |||
| less expensive than the traditional vacuum deposition, spray pyrolysis method | |||
| chemically deposited materials, such as CdS film deposition, have the lowest energy consumption per unit area of film produced | |||
| spray deposition | a fairly large area film can be easily obtained | generally designed for the inclusion of fibers as well as whiskers, and also the matrix alloy options are limited | ( |
| less expensive than the traditional vacuum deposition, spray pyrolysis method | the recovery of solvents is a problem | ||
| there is extensive material utilization | |||
| scalable | |||
| low-temperature process, meaning less energy is required | |||
| other factors affecting solution-based deposition processes are avoided herewith | |||
| vacuum deposition | increased deposition frequency | requires more understanding and research; for example, the relationships between electron density, pulse length, encasing density, as well as microstructural parameters for high-power pulsed plasma deposition microstructure as well as properties in the thickness range of 10–10,000 nm, especially for low-dimensional structures, sub-microelectronics, nanocomposites, tribological coatings, corrosion-resistant materials, reflective surfaces, and thermoelectrics | ( |
| diverse material properties could only be created using vacuum deposition techniques, such as coatings with properties independent of thermodynamic configurational restrictions due to the extreme versatility of the range and variety of deposited materials applied ability to vary defect concentration across a broad range, tends to result in characteristics equivalent to or far excluded from traditional bulk counterparts | ion energy impact as well as ion flux on coated material characteristics is not fully understood | ||
| amorphous materials can be deposited at a high quench rate | depositing species energy effect on interfacial interaction, nucleation, as well as development of the deposit is not fully understood | ||
| controllable generation of microstructures that differ from conventionally materials, such as ultrafine (superlattice, nanostructures) to single-crystalline films | |||
| enables the manufacturing of fine free-standing shapes, from brittle materials, with environmental benefits | there is also a lack of understanding on the mechanical characteristics of the deposit as well as their impact by control factors on residual stress sculpted thin films as well as highly porous membranes | ||
| technique costlier than atmospheric deposition technique |
Figure 12Selected facets toward enhancing the EM wave sheltering function of graphene-based electrospun fibrous materials.
Performances of Graphene-Based Electrospun Nanofibrous EMI Shields per the Literature
| graphene/graphite-based EMI shield | cross-sectional thickness (mm) | electrical conductivity (S/cm) | EMI shielding (dB) | ref |
|---|---|---|---|---|
| GN/CNF composite networks | 0.22–0.27 | 8 | 25–28 | ( |
| TiO2/SiO2/PPy/rGo film | 0.26 | 30 | ( | |
| GO (r-GO)/WPU composites | 1 | 0.168 | 34 | ( |
| Fe3O4@SiO2@PPy@Go film | 0.27 | 0.71 | 32 | ( |
| PANI@PP/GPNF film | 0.26 | 6.84 | 42 | ( |
| GNP/PS composite fibers | 3 | 1 | 33 | ( |
| PP/GPNF-EG film | 0.26 | 9.13 | 40 | ( |
| PP/GPNF/Ag film | 0.33 | 59.199 | 55 | ( |
| PP/GPNF film | 0.26 | 1.7 | 30 | ( |
| graphite/SiC hybrid nanowires | 1.7 | 22 | ( | |
| Ni@graphene-PVDF | 0.5–0.7 | 76.8 | 51.4 | ( |
| TiO2/SiO2@PPy@rGO | 0.26 | 0.39 | 30–38 | ( |
| SiC/rGO | 1.9 | 56.3 | ( | |
| 3D PAN NFs reinforced GO nanocomposite films | 0.012 | 172000 | 55–57 | ( |
| PAN-CNF reinforced bismaleimide (BMI) | 2.2 | 23.9 | ( | |
| rGO/PEDOT@PSS/PVA films | 0.15 | 1.7 | predicted to be high | ( |
| PAN/PVP/Co, core–shell | 4 | RL < −10 | ( | |
| PAN/PVP/ZIF-67 | 4 | RL < −10 | ( | |
| NC@Co/NC-800 | 4 | RLmin = −43.58 | ( | |
| NC@Co/NC-900 | 4 | RLmin = −55.82 | ( | |
| NC@Co/NC-1000 | 4 | RLmin = −41.12 | ( | |
| PVDF/TiO2–Fe3O4–GO NFs | 0.3 | RLmin = −3.5 to −7.5 | ( |