| Literature DB >> 36081127 |
Toshihiko Noda1,2, Sylvia Mei Lin Loo2, Yoshiko Noda1, Daisuke Akai3, Takeshi Hizawa3, Yong-Joon Choi2, Kazuhiro Takahashi1,2, Kazuaki Sawada1,2.
Abstract
We examined the possibility of measuring dissolved oxygen by using a potentiometric solid-state semiconductor sensor. Thin films of tin (IV) oxide (SnO2) are widely used in oxygen gas sensors. However, their ability to detect dissolved oxygen (DO) in solutions is still unknown. In this paper, we present a method for investigating the dissolved oxygen-sensing properties of SnO2 thin films in solutions by fabricating a SnO2-gate field-effect transistor (FET). A similarly structured hydrogen ion-sensitive silicon nitride (Si3N4)-gate FET was fabricated using the same method. The transfer characteristics and sensitivities were experimentally obtained and compared. The transfer characteristics of the FET show a shift in threshold voltage in response to a decrease in DO concentration. The SnO2-gate FET exhibited a sensitivity of 4 mV/ppm, whereas the Si3N4-gate FET showed no response to DO. Although the SnO2-gate FET responds to pH changes in the solution, this sensitivity issue can be eliminated by using a Si3N4-gate FET, which is capable of selectively sensing hydrogen ions without DO sensitivity. The experimental results indicate the promising properties of SnO2 thin films for multimodal sensing applications.Entities:
Keywords: ISFET; dissolved oxygen; hydrogen ion; multimodal sensing; potentiometric sensing; solid-state sensor
Year: 2022 PMID: 36081127 PMCID: PMC9460281 DOI: 10.3390/s22176669
Source DB: PubMed Journal: Sensors (Basel) ISSN: 1424-8220 Impact factor: 3.847
Figure 1Schematic diagram of the proposed DO-/hydrogen ion-sensitive FET.
Figure 2Cross-section diagram showing the fabrication process of the proposed device. (a) Sacrificial oxide formation and channel stopper ion implantation. (b) Source/drain ion implantation. (c) A new layer of gate oxide (SiO2) is formed. (d) Deposition of Si3N4, and source/drain contact opening. (e) Aluminum contact sputtering. (f) Deposition of SnO2 on top of a photoresist mask. (g) Lift-off of photoresist mask.
Figure 3Optical microscope photo of the fabricated FET. (a) SnO2-gate FET; (b) Si3N4-gate FET.
Figure 4Schematic illustration of the cross-section of the device during measurement.
Figure 5Schematic illustration of the experimental setup for DO measurement.
Figure 6Id–Vg of SnO2-gate FET in various pH solutions.
Figure 7Id–Vg of Si3N4-gate ISFET in various pH solutions.
Figure 8Output voltage of FET in response to pH change.
Figure 9Output voltage of FET in response to DO change.