| Literature DB >> 36014638 |
Il-Ho Ahn1, Deuk Young Kim1,2, Woochul Yang1,2.
Abstract
Mobility spectrum analysis (MSA) is a method that enables the carrier density (and mobility) separation of the majority and minority carriers in multicarrier semiconductors, respectively. In this paper, we use the p-GaAs layer in order to demonstrate that the MSA can perform unique facilities for the defect analysis by using its resolvable features for the carriers. Using two proven methods, we reveal that the defect state can be anticipated at the characteristic temperature Tdeep, in which the ratio (RNn/Nh) that is associated with the density of the minority carrier Nn, to the density of the majority carrier Nh, exceeds 50%. (1) Using a p-GaAs Schottky diode in a reverse bias regime, the position of the deep level transient spectroscopy (DLTS) peak is shown directly as the defect signal. (2) Furthermore, by examining the current-voltage-temperature (I-V-T) characteristics in the forward bias regime, this peak position has been indirectly revealed as the generation-recombination center. The DLTS signals are dominant around the Tdeep, according to the window rate, and it has been shown that the peak variation range is consistent with the temperature range of the temperature-dependent generation-recombination peak. The Tdeep is also consistent with the temperature-dependent thermionic emission peak position. By having only RNn/Nh through the MSA, it is possible to intuitively determine the existence and the peak position of the DLTS signal, and the majority carrier's density enables a more accurate extraction of the deep trap density in the DLTS analysis.Entities:
Keywords: deep level transient spectroscopy; mobility spectrum analysis; temperature-dependent minority carrier density; thermally stimulated capacitance
Year: 2022 PMID: 36014638 PMCID: PMC9412662 DOI: 10.3390/nano12162773
Source DB: PubMed Journal: Nanomaterials (Basel) ISSN: 2079-4991 Impact factor: 5.719
Figure 1(a) Conventional Hall measurement data at 0.9 T. (b) Carrier density of the electron and holes at 90 K. (c) Temperature-dependent electron and hole density from ME-MSA. (d) The ratio of the electron and hole densities from Figure 1c. Note that the temperature position of the maximum ratio above approximately 50% is comparable with the temperature of the DLTS signal found (see Figure 2b,c).
Figure 2(a) Schematic structure of the p-GaAs Schottky diode. (b) DLTS signals were obtained using the variation in the and when . The inset shows the associated Arrhenius plot. (c) Trap densities calculated from the DLTS method using the majority carrier density obtained from the MSA. (d) The slope of the temperature-dependent ratio of the electron and hole conductivity vs. 1/T is similar to obtained from the DLTS method near the .
Figure 3(a) TSCAP data in the time and s. The dashed guideline indicates the expected capacitance in the case of the majority carrier. Capacitance decrease with the temperature in the case of means that the minority carrier generation is dominant, which correctly coincides with the case of the majority carrier emission (i.e., hole emission) at the deep trap level. Note that here a TSCAP-like measurement was considered at the specific time of the capacitance transient process after the pulse edge time at (b). , and are within 10−4 s at the filling pulse time = 50 m sec in our test.
Figure 4(a) I–V–T plot of the Schottky diode from 80 to 300 K. (b) I–V fitting with various transport mechanisms. (c) The temperature of the maximum peak of the temperature-dependent thermionic emission coefficient also coincides well with that of the DLTS signal found. (d) Note that after 250 K, deep traps act as generation–recombination centers. Inset in (c,d) indicates the generation process when Temperature elevates.
Physical mechanisms of the electrical conduction of the p-GaAs Schottky diode. We obtained the current–transport components by adopting all of the detailed fitting methods in Ref. [52].
| Transport Mechanism | Current Model | |
|---|---|---|
| Characteristic Component | I–V Model | |
| Thermionic emission |
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| Generation–recombination |
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| tunnelling |
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| leakage | - |
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Figure 5Plot of (a) versus and (b) versus .