| Literature DB >> 36014279 |
Trieu Nguyen1,2, Tanoy Sarkar1, Tuan Tran1, Sakib M Moinuddin1,2, Dipongkor Saha1, Fakhrul Ahsan1,2,3.
Abstract
We present a robust, low-cost fabrication method for implementation in multilayer soft photolithography to create a PDMS microfluidic chip with features possessing multiple height levels. This fabrication method requires neither a cleanroom facility nor an expensive UV exposure machine. The central part of the method stays on the alignment of numerous PDMS slabs on a wafer-scale instead of applying an alignment for a photomask positioned right above a prior exposure layer using a sophisticated mask aligner. We used a manual XYZR stage attached to a vacuum tweezer to manipulate the top PDMS slab. The bottom PDMS slab sat on a rotational stage to conveniently align with the top part. The movement of the two slabs was observed by a monocular scope with a coaxial light source. As an illustration of the potential of this system for fast and low-cost multilayer microfluidic device production, we demonstrate the microfabrication of a 3D microfluidic chaotic mixer. A discussion on another alternative method for the fabrication of multiple height levels is also presented, namely the micromilling approach.Entities:
Keywords: PDMS; aligner; microfluidics; multiplayer; photolithography; photomask; wafer-scale
Year: 2022 PMID: 36014279 PMCID: PMC9412704 DOI: 10.3390/mi13081357
Source DB: PubMed Journal: Micromachines (Basel) ISSN: 2072-666X Impact factor: 3.523
Figure 1Schematics showing the process flows of fabricating: (A) the multilayer photolithography approach using a mask aligner to align the photomask number 2 to the marks on the previous exposure photoresist layer (created from photomask number 1); (B) a multilayer PDMS chip by alignment of two PDMS slabs. Both methods result in the same PDMS structures in the final chip. Figures were drawn by Dr. Nguyen.
Figure 2Digital picture of the alignment station for chips and wafer-scale PDMS slabs aligner.
Figure 3Digital pictures of (a) UV-protected films (durXtreme GmbH, Germany); (b) lab’s ceiling before and (c) after covering with UV-protected films; (d) covered lab window; (e,f) lab space after implementing UV-protected films.
Figure 4Schematic of the arrangement of the PDMS slabs (wafer-scale) alignment. The innovations stay on (i) usting the electrostatics for binding the top slab to a glass plate and (ii) using the vacuum tweezer connected to a XYZR stage to manipulate the movement glass plate, hence the top slab. The bottom slab sits on a rotational stage, which gives us the freedom to also adjust the alignment angle.
Figure 5Microscope image of the microstructures inside the microfluidic chips after alignment and bonding. The alignment accuracy is up to 3 microns, which is much more precise compared to other reported experiments (shown in Table 1).
Comparison of our alignment settings and other reports.
| Reference on Other Works | Budget | Other Remarks | |||
|---|---|---|---|---|---|
| Expensive | Cost | Detailed Protocol Published | Accuracy | ||
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| Used two cameras and back light stages. | No | 30–50 µm | |
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| Used expensive motorized stages and expensive cameras. | No | 20 µm | |
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| Used only one camera and robust, manual alignment stages. | This manuscript contains details on setup and operation steps. | 3 µm | |
Figure 6Digital pictures of the successful filling chips with a single channel (a) and (b) dual channels after alignment and bonding. Video S2 in the Supplementary Material shows the filling step.