| Literature DB >> 36013631 |
Yuandong Xiong1, Ying Li1, Huiting Chen1, Dejin Qiu1, Shiyu Wei1, Henrik Saxén2, Yaowei Yu1.
Abstract
Silicon nitride (Si3N4) and silicon powder (Si) are two kinds of harmful solid waste in industrial production. As an environmental and low-consumption method, the cold-bonding technique is a novel method to utilize the problem of powder resource cycling. In this experiment, mechanical and high-temperature properties of Si and Si3N4 briquettes were studied after cold bonding. The results are as follows: (1) The compressive strength of the Si and Si3N4 briquettes increased with the improvement of molding pressure. With the same binder (1 wt.%) and water (10 wt.%) addition, the compressive strength of the Si3N4 briquette arrived at 12,023.53 N under 40 Mpa molding pressure, which is much higher than that of the Si briquette (942.40 N). The Si particles are uneven and irregular, which leads to an intense arch bridge effect in the Si briquette and the compressive strength decrease. Compared with Si powder, the particle size and shape of Si3N4 is small, uniform, and regular. The influence of the arch bridge effect is smaller than that in the Si briquette. (2) After being treated at 1473 K for 1 h, the compressive strength of the Si briquette increased to 5049.83 N, and the compressive strength of the Si3N4 briquette had a slight change. The surface of the briquettes was contacted with oxygen and reacted to form an outer shell which mainly contains SiO2 in the high-temperature treatment. FT-IR results have shown there were no extra impurities in cold-bonded briquettes when using the organic binder. (3) The microstructure of the cross section of the Si and Si3N4 briquettes after high-temperature treatment presented that oxygen entered the briquette through the pores and continued to react with the Si and Si3N4. The outer shell of the Si briquette grew and thickened continuously with the oxygen spreading in the Si briquette. However, because of the smaller particle size and regular shape, little oxygen diffused in the Si3N4 briquette. The outer shell of the Si3N4 briquette is fairly thin, so the compressive strength did not change too much.Entities:
Keywords: cold bonding; compressive strength; high-temperature properties; silicon; silicon nitride
Year: 2022 PMID: 36013631 PMCID: PMC9410509 DOI: 10.3390/ma15165496
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.748
The chemical compositions of Si and Si3N4 powders (wt.%).
| Si | Fe | O | Cl | Cu | Ca | Al | N | Ti | Cr | Mn | Sr | Else | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Si | 61.34 | 20.59 | 5.83 | 3.09 | 2.71 | 2.15 | 0.93 | - | 0.71 | 0.29 | 0.23 | 0.20 | 1.90 |
| Si3N4 | 38.51 | 23.32 | 2.85 | - | - | 1.24 | 0.80 | 16.05 | 0.12 | 0.15 | 16.83 | 0.14 | - |
Figure 1Schematic of the process for making cold-bonded briquettes.
The compressive strength of different briquettes under various pressures.
| Molding Pressure/Mpa | Compressive Strength/N | |
|---|---|---|
| Si | Si3N4 | |
| 5 | 444.13 | 4207.73 |
| 10 | 474.21 | 5807.40 |
| 20 | 505.35 | 7579.59 |
| 30 | 592.41 | 9064.51 |
| 40 | 942.40 | 12,023.53 |
Figure 2Microstructure of (a) Si particles and (b) Si3N4 particles.
Figure 3Compressive-displacement curves of the briquettes under various pressures (a) Si, (b) Si3N4.
Figure 4Cross-sectional photographs of (a) Si briquette; (b) Si briquette after being treated at 1473 K for 1 h; (c) Si3N4 briquette; (d) Si3N4 briquette after being treated at 1473 K for 1 h.
Figure 5Variation of compressive-displacement curves after being treated at 1473 K for 1 h: (a) Si briquette, (b) Si3N4 briquette.
Figure 6XRD patterns of briquette and outer shell: (a) Si; (b) Si3N4.
Figure 7Formation of SiO2 layer on the surface of briquettes after heating under an oxygen atmosphere.
Figure 8FTIR spectra of powder, briquette, and outer shell (a) Si and (b) Si3N4.
Figure 9SEM of the cross section of Si and Si3N4 briquette: (a) Si briquette, (b) Si3N4 briquette; EDS image of outer shell: (c) Si briquette, (d) Si3N4 briquette.