| Literature DB >> 35806832 |
Weikan Jin1,2, Zhiheng Yu3, Guohong Hu2, Hui Zhang2, Fengli Huang2, Jinmei Gu2.
Abstract
Three-dimensional microstructures play a key role in the fabrication of flexible electronic products. However, the development of flexible electronics is limited in further applications due to low positioning accuracy, the complex process, and low production efficiency. In this study, a novel method for fabricating three-dimensional circular truncated cone microstructures via low-frequency ultrasonic resonance printing is proposed. Simultaneously, to simplify the manufacturing process of flexible sensors, the microstructure and printed interdigital electrodes were fabricated into an integrated structure, and a flexible pressure sensor with microstructures was fabricated. Additionally, the effects of flexible pressure sensors with and without microstructures on performance were studied. The results show that the overall performance of the designed sensor with microstructures could be effectively improved by 69%. Moreover, the sensitivity of the flexible pressure sensor with microstructures was 0.042 kPa-1 in the working range of pressure from 2.5 to 10 kPa, and the sensitivity was as low as 0.013 kPa-1 within the pressure range of 10 to 30 kPa. Meanwhile, the sensor showed a fast response time, which was 112 ms. The stability remained good after the 100 cycles of testing. The performance was better than that of the flexible sensor fabricated by the traditional inverted mold method. This lays a foundation for the development of flexible electronic technology in the future.Entities:
Keywords: flexible pressure sensor; low-frequency ultrasonic resonance printing; microstructures; response time; sensitivity
Year: 2022 PMID: 35806832 PMCID: PMC9267525 DOI: 10.3390/ma15134708
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.748
Figure 1Diagram of the structure and working principles of the flexible pressure sensor.
Figure 2Flowchart of CNT/PDMS film preparation.
Figure 3Structural diagram of the printing equipment.
Figure 4Physical layout of the electrode layer.
Figure 5SEM images of the microstructure and CNT/PDMS film. (a) Surface morphology of the microstructure (b) Surface morphology of the thin CNT/PDMS films.
Figure 6Sensitivity testing device used for the sensor.
Figure 7Relationship between the rate of change in the resistance and pressure of sensors with and without microstructured electrodes.
Figure 8The curve of the sensor’s response time.
Figure 9Results of the sensor repeatability test.