Amplified risk of compound heat stress-dry spells in Urban India.

Compound warm-dry spells over land, which is expected to occur more frequently and expected to cover a much larger spatial extent in a warming climate, result from the simultaneous or successive occurrence of extreme heatwaves, low precipitation, and synoptic conditions, e.g., low surface wind speeds. While changing patterns of weather and climate extremes cannot be ameliorated, effective mitigation requires an understanding of the multivariate nature of interacting drivers that influence the occurrence frequency and predictability of these extremes. However, risk assessments are often focused on univariate statistics, incorporating either extreme temperature or low precipitation; or at the most bivariate statistics considering concurrence of temperature versus precipitation, without accounting for synoptic conditions influencing their joint dependency. Based on station-based daily meteorological records from 23 urban and peri-urban locations of India, covering the 1970-2018 period, this study identifies four distinct regions that show temporal clustering of the timing of heatwaves. Further, combining joint probability distributions of interacting drivers, this analysis explored compound warm-dry potentials that result from the co-occurrence of warmer temperature, scarcer precipitation, and synoptic wind patterns. The results reveal 50-year severe heat stress solely based on the temperature at each location tends to be more frequent and is expected to become 5 to 17-year compound warm-dry events considering interdependence between attributes. Notably, considering dependence among drivers, a median 6-fold amplification (ranging from 3 to 10-fold) in compound warm-dry spell frequency is apparent relative to the expected annual number of a local (univariate) 50-year severe heatwave episode, indicating warming-induced desiccation is already underway over most of the urbanized areas of the country. Supplementary information: The online version contains supplementary material available at 10.1007/s00382-022-06324-y.