Rodrigo León-Guillén1, Ana Luz Muñoz-Rosas1, Jesús A Arenas-Alatorre1, Juan Carlos Alonso-Huitrón2, Ana Laura Pérez-Martínez3, Arturo Rodríguez-Gómez1. 1. Instituto de Física, Universidad Nacional Autónoma de México, Circuito de la Investigación Científica s/n, Ciudad Universitaria, A.P. 20-364, Coyoacán, Ciudad de México 04510, México. 2. Instituto de Investigaciones en Materiales, Universidad Nacional Autónoma de México, Ciudad Universitaria, A.P. 70-360, Coyoacán, Ciudad de México 04510, México. 3. Facultad de Ingeniería, División de Ciencias Básicas, Universidad Nacional Autónoma de México, Circuito Exterior s/n, Ciudad Universitaria, Coyoacán, Ciudad de México 04510, México.
Abstract
Silicon carbide (SiC) has become an extraordinary photonic material. Achieving reproducible self-formation of silicon quantum dots (SiQDs) within SiC matrices could be beneficial for producing electroluminescent devices operating at high power, high temperatures, or high voltages. In this work, we use a remote plasma-enhanced chemical vapor deposition system to grow SiC thin films. We identified that a particular combination of 20 sccm of CH4 and a range of 58-100 sccm of H2 mass flow with 600 °C annealing allows the abundant and reproducible self-formation of SiQDs within the SiC films. These SiQDs dramatically increase the photoluminescence-integrated intensity of our SiC films. The photoluminescence of our SiQDs shows a normal distribution with positive skewness and well-defined intensity maxima in blue regions of the electromagnetic spectrum (439-465 nm) and is clearly perceptible to the naked eye.
Silicon carbide (SiC) has become an extraordinary photonic material. Achieving reproducible self-formation of silicon quantum dots (SiQDs) within SiC matrices could be beneficial for producing electroluminescent devices operating at high power, high temperatures, or high voltages. In this work, we use a remote plasma-enhanced chemical vapor deposition system to grow SiC thin films. We identified that a particular combination of 20 sccm of CH4 and a range of 58-100 sccm of H2 mass flow with 600 °C annealing allows the abundant and reproducible self-formation of SiQDs within the SiC films. These SiQDs dramatically increase the photoluminescence-integrated intensity of our SiC films. The photoluminescence of our SiQDs shows a normal distribution with positive skewness and well-defined intensity maxima in blue regions of the electromagnetic spectrum (439-465 nm) and is clearly perceptible to the naked eye.
Silicon
is the second most abundant element in the earth’s
crust and the backbone of the microelectronics industry.[1,2] When silicon is reduced to sizes smaller than its exciton Bohr radius
(<4.5 nm), it exhibits intense and tunable photoluminescence (PL).
Experimental and theoretical studies have shown that quantum confinement
effects (QCEs) are largely responsible for the observed PL.[3−9] Luminescence from the nanostructured silicon has a vast number of
applications. Therefore, systems conformed by silicon quantum dots
(SiQDs) embedded in silicon-based matrixes have been of great interest
for the scientific and technological community in recent years.[10−19]On the other hand, silicon carbide (SiC), best known for its
use
in abrasives[20] and as a reinforcing material,[21] has now become an extraordinary photonic material.[22] One of the most promising applications of SiC
is the color centers generated by defects in the crystal, which are
excellent candidates for memory and quantum communication applications.[23−25] Additionally, SiC has more than 250 crystalline polytypes that have
a large number of applications, including temperature sensors, nanoelectromechanical
systems, pressure sensors, accelerometers, and gas sensors.[26] However, not only these different crystalline
polytypes of SiC are useful, attractive applications have also been
reported for amorphous SiC (a-SiC), such as the detection of Salmonella,[27] Schottky barrier modulation in Schottky diodes,[28] or the manufacture of photocathodes for solar
water splitting.[29]In this sense,
achieving reproducible self-formation of SiQDs within
SiC matrixes could increase the plethora of applications that both
systems show separately. The latter is because of the reason that
the exceptional physical characteristics of SiC (wide and tunable
band gaps, good thermal conductivity, adequate concentration of charge
carriers, and chemical inertness) could be exploited together with
the luminescent properties of SiQDs to fabricate electroluminescent
structures that could operate stably at high power, high temperatures,
or high voltages.Four main research groups have studied experimental
methodologies
to manufacture nanoarchitectures of SiQDs inlaid in a-SiC matrixes.
The group headed by Jiang and Tan studied the influence of the silane
flow rate for the in situ formation of SiQDs inlaid in a-SiC films
using the plasma-enhanced chemical vapor deposition (PECVD) technique.[30,31] The group of Zeng and Wen, also using the PECVD technique, conducted
studies on the influence of annealing temperature on the formation
of SiQDs embedded in hydrogenated amorphous Si-rich SiC thin films.[32,33] Kole and Chaudhuri used a PECVD system to study the influence of
argon dilution and subsequent heat treatments for the formation of
SiQDs on a-SiC nanoarchitecture.[34,35] Finally, Kurokawa
et al. used the PECVD method to study the effect of oxygen on the
electrical and photoluminescent properties of superlattices based
on SiQDs embedded in a-SiC thin films.[36,37]It should
be noted that, in all the aforementioned studies, the
authors use the PECVD equipment. This type of system has been shown
to be very reliable for obtaining SiQDs embedded in high-quality SiC
thin films. However, PECVD systems have the disadvantage of gas dissociation
reactions in the same area where the desired nanoarchitecture grows.
Hence, much plasma-induced damage occurs in the final thin film. The
plasma location also induces a more significant correlation between
the deposition parameters [flow of source gases, radio frequency (RF)
source power, deposition chamber pressure, substrate temperature,
and deposition time]. The higher the correlation in the deposition
parameters, the more difficult it is to study each parameter’s
influence on creating the desired nanoarchitecture and, therefore,
less reproducibility.In this regard, remote PECVD (RPECVD)
systems are a convenient
modification of PECVD systems.[38,39] Unlike PECVD, in the
RPECVD, the gas dissociations occur in a region far from where the
thin film grows. Consequently, nanostructures grown in RPECVD systems
show much less plasma-induced damage. RPECVD also exhibits less correlation
between deposition parameters; therefore, these systems allow the
deposition of very high-quality thin films. In RPECVD systems, it
is also possible to achieve excellent control of the final physical
properties of the manufactured nanoarchitecture by slight adjustments
of the growth parameters.[40,41] The use of RPECVD systems
for depositing SiC thin films has been poorly explored.[42−45] In fact, to the best of our knowledge, to date, there is no research
reporting the conformation of SiQDs embedded in SiC matrixes employing
RPECVD systems. Likewise, based on the work of Matsuda[46] on the control of the formation of silicon microcrystals
via plasma glow discharge, we explore in our RPECVD system the effect
that different amounts of H2 have on the luminescent properties
of the deposited films, as well as in the formation of silicon nanocrystals
embedded in SiC matrices.In this work, we use an RPECVD system
to grow SiC thin films on
the surface of monocrystalline silicon and fused silica substrates.
As a precursor gas source of silicon, we use silicon tetrachloride,
a compound of complex dissociation.[47] Through
complete characterization by Fourier transform infrared (FTIR) spectrophotometry,
transmission and scanning electron microscopy (TEM and SEM), ultraviolet–visible
(UV–vis) spectrophotometry, and spectrofluorometry (PL), we
were able to determine the necessary flow of CH4 to obtain
SiC films. Likewise, we identified that a particular combination of
CH4 and H2 mass flow allows abundant and reproducible
self-formation of SiQDs within the SiC films. We observed that the
PL of our SiQDs shows a normal distribution with positive skewness
and well-defined intensity maxima in blue regions of the electromagnetic
spectrum (439–465 nm). We consider our films to be promising
for the fabrication of diverse experimental electroluminescent devices.
Experimental Details
Substrate Preparation
The thin films
were deposited on (200 Ω cm) single-crystalline silicon n-type
wafers (100) and fused silica substrates; both substrates were purchased
from UniversityWafer, Inc. Before deposition, the silicon wafers were
cleaned by submerging them for 5 min in a “p-etch solution”
made up of 300:15:10 of H2O/HNO3/HF, to remove
impurities from the silicon surface. Additionally, quartz substrates
were subject to four cycles of ultrasonic baths while immersed in
(1) trichloroethylene, (2) methanol, (3) acetone, and (4) methanol,
with 5 min per cycle. Both types of substrates need to be kept in
the chamber for 30 min before the deposition to adequately match the
sample holder temperature.
Deposition Parameters
The deposition
of SiC thin films was carried out in a custom-made RPECVD system,
whose detailed description can be found elsewhere.[48] The gases used in the deposition were methane (CH4), silicon tetrachloride (SiCl4), and argon (Ar). The
flow rates of SiCl4 and Ar were fixed at 25 and 150 sccm,
respectively, while the CH4 flow rate ranged from 12 to
20 sccm. A substrate temperature of 200 °C, a total pressure
of 300 mTorr, and a RF power of 300 W were the remaining deposition
parameters. In the remainder of the text, samples deposited with these
parameters shall be labeled as B samples. Furthermore, another set
of samples were deposited where hydrogen (H2) was introduced
to the gas mixture. In this set, the flow rates of SiCl4, CH4, and Ar were 20, 20, and 150 sccm, respectively,
as the H2 flow rate was varied from 58 to 100 sccm. The
other parameters remained as follows: a substrate temperature of 480
°C, a total pressure of 400 mTorr, and an RF power of 310 W (which
had to go up to 370 W for 100 sccm of H2). These will be
categorized as C samples (Table ). After deposition, some of the samples in each set
were annealed for 30 min at temperatures of 350 °C (B samples)
and 600 °C (C samples).[47]
Table 1
Deposition Parameters for B and C
Samples
sample
T (°C)
power (W)
pressure (mTorr)
CH4 flow rate (sccm)
SiCl4 flow rate (sccm)
Ar flow rate (sccm)
H2 flow rate (sccm)
B1
200
300
300
20
25
150
0
B2
200
300
300
16
25
150
0
B3
200
300
300
12
25
150
0
C1
480
310
400
20
20
150
58
C2
480
310
400
20
20
150
75
C3
480
370
400
20
20
150
100
Sample Characterization
Each sample
was characterized after every deposition. UV–vis transmission
measurements were performed in a range of 300 to 1100 nm using a double
beam PerkinElmer Lambda 35 UV–vis spectrophotometer. Chemical
bonds were identified using a FTIR spectrophotometer, Nicolet 210,
in the region of 4000 to 350 cm–1. PL measurements
were obtained in a dark room at room temperature, using a Kimmon helium–cadmium
laser beam operating with a wavelength of 325 nm and a power of 25
mW. The PL spectra were recorded with a Fluoromax-Spex spectrofluorometer.
The laser had an incidence angle of 45° to the thin film, while
the angle of detection of the emitted light was normal to the film
surface. The thickness of SiC thin films was measured using a scanning
electron microscope JSM-7800F. SEM micrographs were captured at an
accelerating voltage of 5 keV to limit the nonconductive SiC coating
charging effects and a magnification of ×80,000. High-resolution
transmission electron microscopy (HRTEM) analysis was performed using
a JEOL JEM-2010F FasTEM microscope, which was operated at an acceleration
voltage of 200 kV.
Results and Discussion
The thickness and deposition rate values for B samples are shown
in Table , in which
we can appreciate that the deposition rate increases with the flow
rate of methane. Meanwhile, the FTIR spectra for samples B1, B2, and
B3 before and after annealing are shown in Figure . One can identify that all samples have
three prominent peaks, with the first one being centered at around
3400 cm–1, attributed to the vibration of N–H
stretching bonds.[49] The peak centered at
around 1035 cm–1 corresponds to an sp3 CH2 bonded to Si, but it can also be attributed to oxygen
vibrational modes such as Si–O–Si and Si–O–C
stretching.[50] Then, the peaks at 846 cm–1 for the as-grown sample and at 795 cm–1 for the cured sample could correspond to Si–C stretching
bonds.[51] As the methane flux increases,
the growth of this type of bond in the as-grown B-group films may
be related to the increase in the deposition rate observed previously.
Additionally, the as-grown sample B3 presents a peak at 2326 cm–1 consistent with the vibration of the Si–H
bond,[52] which, together with the N–H
bond, is predominant at low deposition rates. As we could have expected,
when the CH4 flow rate diminished, the C–H peak
decreases significantly. The samples that were annealed at 350 °C
had an increment in the peak centered at 1035 cm–1 with respect to the other two peaks (at around 3430 and 795 cm–1), possibly due to the incorporation of oxygen when
the samples were annealed.
Table 2
Thicknesses and Deposition Rates of
Samples as the Methane Flow Rate Is Varied from 12 to 20 sccm
sample
thickness (nm)
deposition
rate (nm/min)
CH4 flow rate (sccm)
B1
336.3 ± 7.7
22.4 ± 0.5
20
B2
238.3 ± 4.7
15.8 ± 0.3
16
B3
63.8 ± 4.2
4.2 ± 0.3
12
Figure 1
. FTIR absorbance spectrum of samples B1, B2,
and B3 before (left)
and after (right) annealing at 350 °C for 30 min. The vertical
lines correspond to the wavenumber that is centered at each peak.
. FTIR absorbance spectrum of samples B1, B2,
and B3 before (left)
and after (right) annealing at 350 °C for 30 min. The vertical
lines correspond to the wavenumber that is centered at each peak.Figure shows the
PL spectra of samples B1, B2, and B3 before (black line) and after
annealing at 350 °C (red line). All samples present an emission
band from 390 to 450 nm. Likewise, it is possible to identify in the
as-grown samples that as the CH4 flux increases the maximum
emission peak moves toward the green region (∼500 nm), which
could be attributed to the increase in Si–C and/or N–H
bonds with respect to the increase in methane flux (attributable to
the Si–C or N–H bonds present in the film). It is also
interesting to note that this green shift peak in the samples with
the highest CH4 flux increases after annealing, which could
be related to the increase in Si–CH2 and Si–C
bonds observed in the infrared spectra, as well as to the probable
presence of oxygen in the sample, mentioned above when discussing Figure .
Figure 2
PL spectra of samples
B1, B2, and B3 before (black line) and after
annealing (red line) at 350 °C for 30 min. The vertical lines
indicate the wavelengths at the center of the peaks.
PL spectra of samples
B1, B2, and B3 before (black line) and after
annealing (red line) at 350 °C for 30 min. The vertical lines
indicate the wavelengths at the center of the peaks.Various studies have shown that H2 gas promotes
crystallization
in silicon-based films; this is achieved, thanks to the hydrogen terminations
on the surface of the substrate, which causes the silicon atoms to
migrate to the surface. This process places the silicon atoms in favorable
places for crystallization.[46,53] With this knowledge,
we added hydrogen to our gas mixture with the motivation to explore
the degree of crystallization we would achieve in our final structures
with different amounts of H2. Table shows the thickness of the C samples, where
we can appreciate an increase in the deposition rate as the H2 flow augments.
Table 3
Thicknesses and Deposition
Rates of
the Samples When the Hydrogen Flow Rate Is Varied from 58 to 100 sccm
sample
thickness (nm)
deposition
rate (nm/min)
H2 flow rate (sccm)
C1
34.7 ± 5.2
2.31 ± 0.34
58
C2
123.2 ± 3.6
8.2 ± 0.24
75
C3
250.4 ± 4.2
10.0 ± 0.16
100
Figure shows the
FTIR absorbance spectra of samples C1, C2, and C3 before and after
annealing at 600 °C for 30 min. The signal-to-noise ratio is
low due to the thickness of the sample. Nevertheless, the principal
peaks can still be identified. Before annealing, all the samples had
the most prominent peaks from the Si–C bond vibration (803
cm–1), indicating that most of the bonds were of
Si–C. The latter could also be corroborated qualitatively,
as the film did not get scratches from the tweezers, proving the hardness
of the film (which is a quality of SiC films). Additionally, it is
worth noticing that the N–H peaks were not present in this
set of samples, in contrast with group B samples. The latter may be
due to the passivation of the surface achieved with H2,
unlike the samples of group B, whose terminations can bind to ambient
nitrogen and oxygen.[54,55] With thermal annealing, Si–CH2 (1024 cm–1) bonds grew compared to the
other peaks.
Figure 3
FTIR absorbance spectrum of samples C1, C2, and C3 before
and after
annealing at 600 °C for 30 min. The vertical lines show the wavenumber
at the center of each peak and its corresponding bond tag.
FTIR absorbance spectrum of samples C1, C2, and C3 before
and after
annealing at 600 °C for 30 min. The vertical lines show the wavenumber
at the center of each peak and its corresponding bond tag.The SiC thin film’s band gaps as a function of methane
and
hydrogen were calculated from the data collected from the UV–vis
transmission spectra of the annealed films using Tauc’s method
and are shown in Figure . There is a clear tendency in which the band gap increases as both
the methane and hydrogen flow increases. As the methane flow increases,
so does the film’s carbon content, meaning that the band gap
tends to be that of a carbon thin film, which is higher than the band
gap of amorphous silicon thin films. Thus, explaining the increase
in the band gap as the carbon content augments.[56] On the other hand, the increase in the band gap as the
hydrogen flow increases can be attributed to replacing the Si–Si
bonds (as they are the weaker ones) with the Si–H bonds (which
can be seen in Figure ). As the Si–H bonds have a more stable bond, a higher energy
will be required to remove an electron, thus creating a higher band
gap.[57] Other publications attribute this
increase in the band gap to the reduction of the relative concentration
of sp2-bonded carbon.[58] It is
also worth noting that the band gap values were considerably larger
(from 3.83 to 4.3 eV) with these conditions as opposed to the previous
ones (1.73 to 3.1 eV).
Figure 4
Band gaps of group B samples (left) and group C samples
(right),
in function of the methane and hydrogen flow rate, respectively.
Band gaps of group B samples (left) and group C samples
(right),
in function of the methane and hydrogen flow rate, respectively.Furthermore, PL spectra for samples C1, C2, and
C3 are shown in Figure . All samples exhibit
a peak in the blue region, unlike the group B samples, where there
was another peak present (Figure ). This could be related to the passivation achieved
in these C samples, unlike group B samples. Absence of N–H
bonds or increase in the peaks located at around 1035 cm–1 was observed, also related to Si–O–Si bonds in IR
spectra. However, it can also be attributed to the lack of N–H
bonds in group C samples. Another difference that can be highlighted
is that the annealing of the samples implied an increase of nearly
1 order of magnitude in the PL (with PL perceptible to the naked eye),
which could be related to the crystallization of the films at this
high temperature (600 °C) by reducing grain effects and, therefore,
non-radiative recombination. However, further work is required to
determine the origin of this increase in PL after annealing. The change
in hydrogen flow did not affect the PL spectra as both the annealed
and as-deposited samples exhibited the same behavior.
Figure 5
PL spectra of samples
C1, C2, and C3 before (black line) and after
annealing (red line) at 600 °C for 30 min. The vertical lines
show that the center of the peaks are at 439 and 465 nm for as-grown
and annealed samples, respectively.
PL spectra of samples
C1, C2, and C3 before (black line) and after
annealing (red line) at 600 °C for 30 min. The vertical lines
show that the center of the peaks are at 439 and 465 nm for as-grown
and annealed samples, respectively.Finally, Figure shows
TEM micrographs of the annealed samples C1, C2, and C3 to
study the microstructure of the SiC thin films. As previously mentioned,
hydrogen assists the crystallization of the film. However, not only
hydrogen but also a heat treatment is necessary for the formation
of nanoclusters, which can be appreciated as the darker spots in the
micrographs. As greater magnification is applied, the orientation
of the planes in the lattice can be visible (Figure c). An electron diffraction pattern confirms
the formation of a crystalline phase, as shown in Figure d. H2 flow influenced
the size of the nanocluster, as can be seen in Table because the average particle size decreases
as the hydrogen flow increases. Moreover, the band gap also increases
as the particle size reduces. The latter is congruent to the particle
in a box model where the energy levels permitted have an inversely
proportional dependency on the size of the box, where, in this case,
the box is the nanocluster.[59]
Figure 6
TEM micrographs
for samples (a) C1, (b) C2, and (c) C3 showing
the presence of nanoclusters, where the orientation of the planes
can also be appreciated. (d) Selected area diffraction pattern of
a SiQD.
Table 4
Average Particle
Size and Band Gap
as a Function of Hydrogen Flow
sample
particle average
size (nm)
band gap (eV)
hydrogen flow rate (sccm)
C1
10.54 ± 0.78
3.83
58
C2
9.76 ± 0.56
4.04
75
C3
7.97 ± 0.64
4.3
100
TEM micrographs
for samples (a) C1, (b) C2, and (c) C3 showing
the presence of nanoclusters, where the orientation of the planes
can also be appreciated. (d) Selected area diffraction pattern of
a SiQD.
Conclusions
We achieved a reproducible growth of a-SiC films
using a custom-made
RPECVD system. We employed a gas mixture of methane, argon, and silicon
tetrachloride. We identified that by increasing the methane gas flux,
a PL shift is obtained toward the green zone of the electromagnetic
spectrum (526 nm). Likewise, the annealing of these films at a relatively
low temperature (350 °C) caused the increase in their PL-integrated
intensity, probably due to the oxygen incorporation after the thermal
treatment in a conventional furnace, as observed in the IR spectra.Once the SiC films were obtained, we proceeded to add different
amounts of H2 to the original gas mixture to explore the
effect this gas has on the physical properties of the films (group
C samples). All group C samples exhibit a PL peak in the blue region,
which can be attributed to the passivation achieved in C samples,
due to the presence of H2. Likewise, we have observed that
annealing at 600 °C in the films grown with H2 promotes
the formation of silicon nanocrystals embedded in the SiC film, as
observed in TEM images. These SiQDs dramatically increase the integrated
intensity of PL, which may be caused by the crystallization achieved
after heat treatment of the films. The maximum spectral intensity
of these films is located in the blue region of the electromagnetic
spectrum (between 439 and 465 nm) and is perceptible to the naked
eye.