Oluwasegun J Wahab1, Minkyung Kang2, Enrico Daviddi1, Marc Walker3, Patrick R Unwin1. 1. Department of Chemistry, University of Warwick, Coventry CV4 7AL, U.K. 2. Institute for Frontier Materials Deakin University, Burwood, Victoria 3125, Australia. 3. Department of Physics, University of Warwick, Coventry CV4 7AL, U.K.
Abstract
Understanding how crystallographic orientation influences the electrocatalytic performance of metal catalysts can potentially advance the design of catalysts with improved efficiency. Although single crystal electrodes are typically used for such studies, the one-at-a-time preparation procedure limits the range of secondary crystallographic orientations that can be profiled. This work employs scanning electrochemical cell microscopy (SECCM) together with co-located electron backscatter diffraction (EBSD) as a screening technique to investigate how surface crystallographic orientations on polycrystalline copper (Cu) correlate to activity under CO2 electroreduction conditions. SECCM measures spatially resolved voltammetry on polycrystalline copper covering low overpotentials of CO2 conversion to intermediates, thereby screening the different activity from low-index facets where H2 evolution is dominant to high-index facets where more reaction intermediates are expected. This approach allows the acquisition of 2500 voltammograms on approximately 60 different Cu surface facets identified with EBSD. The results show that the order of activity is (111) < (100) < (110) among the Cu primary orientations. The collection of data over a wide range of secondary orientations leads to the construction of an "electrochemical-crystallographic stereographic triangle" that provides a broad comprehension of the trends among Cu secondary surface facets rarely studied in the literature, [particularly (941) and (741)], and clearly shows that the electroreduction activity scales with the step and kink density of these surfaces. This work also reveals that the electrochemical stripping of the passive layer that is naturally formed on Cu in air is strongly grain-dependent, and the relative ease of stripping on low-index facets follows the order of (100) > (111) > (110). This allows a procedure to be implemented, whereby the oxide is removed (to an electrochemically undetectable level) prior to the kinetic analyses of electroreduction activity. SECCM screening allows for the most active surfaces to be ranked and prompts in-depth follow-up studies.
Understanding how crystallographic orientation influences the electrocatalytic performance of metal catalysts can potentially advance the design of catalysts with improved efficiency. Although single crystal electrodes are typically used for such studies, the one-at-a-time preparation procedure limits the range of secondary crystallographic orientations that can be profiled. This work employs scanning electrochemical cell microscopy (SECCM) together with co-located electron backscatter diffraction (EBSD) as a screening technique to investigate how surface crystallographic orientations on polycrystalline copper (Cu) correlate to activity under CO2 electroreduction conditions. SECCM measures spatially resolved voltammetry on polycrystalline copper covering low overpotentials of CO2 conversion to intermediates, thereby screening the different activity from low-index facets where H2 evolution is dominant to high-index facets where more reaction intermediates are expected. This approach allows the acquisition of 2500 voltammograms on approximately 60 different Cu surface facets identified with EBSD. The results show that the order of activity is (111) < (100) < (110) among the Cu primary orientations. The collection of data over a wide range of secondary orientations leads to the construction of an "electrochemical-crystallographic stereographic triangle" that provides a broad comprehension of the trends among Cu secondary surface facets rarely studied in the literature, [particularly (941) and (741)], and clearly shows that the electroreduction activity scales with the step and kink density of these surfaces. This work also reveals that the electrochemical stripping of the passive layer that is naturally formed on Cu in air is strongly grain-dependent, and the relative ease of stripping on low-index facets follows the order of (100) > (111) > (110). This allows a procedure to be implemented, whereby the oxide is removed (to an electrochemically undetectable level) prior to the kinetic analyses of electroreduction activity. SECCM screening allows for the most active surfaces to be ranked and prompts in-depth follow-up studies.
Copper (Cu) is a promising
material for electrocatalysis, especially
for the electroreduction of carbon dioxide (eCO2RR).[1,2] Cu is the only monometallic catalyst that facilitates CO2 conversion to multi-carbon products (i.e., beyond CO and formate).[1,3−7] This performance is the key to achieving the goal of carbon neutrality
and addressing the rising concern of climate change by designing effective
catalysts for CO2 conversion to useful feedstock.[3,8] An important characteristic of reactions on Cu electrodes is sensitivity
of the reaction kinetics and processes to the surface structure.[1,9,10]Cu single crystals have
been used for eCO2RR studies
to reveal surface structure–activity relationships and to aid
interpretation of results from polycrystalline Cu.[1,11−13] However, since early eCO2RR studies by
Hori and colleagues on a broad series of Cu crystals,[1,4,6,14] experimental
and theoretical studies have subsequently focused on a narrower range
of crystal orientations and mainly low-index facets.[9,15] Such streamlining is necessary for in-depth studies, considering
that single crystals require multiple steps of surface preparation
in one-at-a-time experiments, but limits the range of high-index crystallographic
orientations that can be profiled in a reasonable time span. Consequently,
the eCO2RR activity trends among the numerous high-index
Cu crystals that exist on real catalysts remain to be fully explored.Single crystal studies have produced activity and selectivity trends
for Cu grain indexes, albeit with notable disparity.[16−19] Moreover, recent reports evidence effects of electrode preparation,[19] pH,[20] electrolyte
species,[21] and in situ morphological dynamics[22,23] on eCO2RR. Herein, we propose the electrochemical screening
of a wide array of Cu surface structures under the same conditions
to identify promising structural motifs for further research and eCO2RR product analysis.To rapidly access the electrochemical
characteristics of a wide
variety of crystallographic sites, we introduced “pseudo-single
crystal” electrochemistry,[24] using
high-resolution scanning electrochemical cell microscopy (SECCM)[25−27] to map out the voltammetry (with several thousand spatially resolved
voltammograms easily achievable)[28,29] on a polycrystalline
surface, whose crystallographic structure is determined by co-located
electron backscatter diffraction (EBSD). In this way, electrochemical
analysis of multiple crystallographic orientations and grain boundaries,
found on a polycrystalline metal surface, is achieved[30,31] as demonstrated by studies of an increasing diversity of systems.[24,28,32−38] Recent studies have used the combination of SECCM and EBSD to resolve
CO2 electroreduction activity at grain boundaries of Au,[39−41] and SECCM alone has been used to study CO2 electroreduction
at tin/reduced graphene oxide interfaces.[42]In this work, we employed hopping-mode voltammetric SECCM[28] to collect spatially resolved linear sweep voltammograms
in aqueous KHCO3 on polycrystalline copper, under typical
eCO2RR conditions, with each measurement localized to a
∼ 600 nm-wide spot (defined by the diameter of the SECCM droplet
cell). The potential range studied herein is dominated by the H2 evolution reaction (HER) on Cu low-index facets[7,19] but may include eCO2RR intermediates on the stepped and
kinked high-index facets.[4,19,43] The original studies of Hori[1] and later
computational studies[44] propose a correlation
between the onset potential at 5 mA cm–2 on different
Cu surfaces and their performance for producing CH4. The
current density is in the range of the SECCM studies, so local voltammetric
analyses serve as a preliminary indicator of eCO2RR activity.
As part of our study, we also provide a local electrochemical assay
of the naturally formed (upon ambient air exposure) adlayer on different
Cu facets. The SECCM configuration is particularly attractive for
this analysis as it presents a way to acquire voltammetric measurements
immediately after the electrolyte droplet has contacted the Cu surface,
which allows analysis of the surface oxide close to the initial state.
We then advance protocols to remove the surface oxide at each pixel
in the SECCM scan in order to study the electrocatalytic activity
at clean Cu surfaces.The considerable amount of data acquired
with SECCM (up to 2500
LSVs over about 60 different grains in a single map) enabled the construction
of “electrochemical stereographic triangles”[32] in which electrocatalytic activity of individual
grains is presented with respect to their crystallographic orientations,
on a 2D projection which is qualitatively similar to an inverse pole
figure (IPF) representation, thereby offering a holistic view of structure–activity
that reveals insightful trends across the low-index grains and many
high-index crystallographic orientations. This study serves to demonstrate
the use of pseudo-single crystal SECCM–EBSD for screening and
identifying promising surface features on an electrocatalyst for further
investigation.
Materials and Methods
Preparation of the Working
Electrode and Chemical Reagents
The working electrode/substrate
was prepared by embedding a polycrystalline
Cu foil (3 mm thickness, size 10 × 10 mm, Goodfellow, U.K., 99.95%)
in a circular carbon block with a hot compression mounting machine
(SimpliMet, Buehler, USA). The exposed Cu surface was then polished
using an AutoMet 300 polishing machine (Buehler, USA), on polishing
pads (ChemoMet and TexMat C, Buehler, USA) with 9, 3, and 0.06 μm
polishing suspensions (MetaDi Supreme Diamond and MasterMet colloidal
silica suspension, Buehler, USA).In order to remove minor surface
deformation after mechanical polishing and to prepare a high-quality
flat surface for electrochemical measurements and scanning electron
microscopy (SEM), the polycrystalline Cu sample was subjected to vibratory
polishing in a non-crystallizing colloidal silica polishing suspension
(MasterMet 2, Buehler, USA) at ca. 70% vibration
amplitude using a VibroMet 2 instrument (Buehler, USA). The polished
Cu substrate was then washed with soapy water, followed by rinsing
with a copious amount of deionized water and isopropanol to remove
the polishing suspension, before being blown dry with argon. The last
stage of the sample preparation for the SECCM experiments was surface
cleaning with broad Ar+ ion beam milling (IM4000Plus, HITACHI,
Japan). Between experiments, the polycrystalline Cu substrate was
stored in a desiccator equipped with a vacuum pump at room temperature
(22 °C).Potassium chloride (KCl, Honeywell, 99.5%) and
potassium bicarbonate
(KHCO3, Sigma-Aldrich, 99.95%) were used as supplied by
the manufacturer. All solutions were prepared with deionized water
(ELGA PURELAB systems; resistivity = 18.2 MΩ cm at 25 °C).
Nanopipettes, Electrolytes, and Quasi-Reference Counter Electrodes
Nanopipettes were fabricated from borosilicate capillaries (GC120F-10,
Harvard Apparatus; capillary dimensions: outer diameter, 1.2 mm; inner
diameter, 0.69 mm; and length, 100 mm) with a CO2 laser
puller (Sutter Instruments P-2000). The pulling parameters were as
follows: line 1 with HEAT 330, FIL 3, VEL 30, DEL 220, and PUL–
and line 2 with HEAT 330, FIL 3, VEL 40, DEL 180, and PUL 120. The
nanopipette tip opening was ∼200 nm in diameter.[40] The nanopipette probe was filled with the 10
mM KHCO3 electrolyte, and a silicone oil layer was added
on the top of the electrolyte solution in the tip to minimize evaporation
from the back during prolonged scanning.[45] Note that the pH of the electrolyte solution was 5.77 when saturated
with CO2 and 8.04 when purged with Ar. AgCl-coated Ag wire
was used as a quasi-reference counter electrode (QRCE), which was
fabricated by electrochemically oxidizing Ag wire (0.125 mm diameter)
in saturated KCl solution.[46] The QRCE was
calibrated routinely (before and after the SECCM measurements) in
10 mM KHCO3 with respect to a commercial leakless Ag/AgCl
electrode (3.4 M KCl, ET072, eDAQ, Australia), resulting in a stable
potential of +215 ± 5 mV compared to the standard. Hence, all
electrochemical results in this work are presented versus Ag/AgCl (3.4 M KCl), referred to as Ag/AgCl. The prepared QRCE was
inserted in the back of the nanopipette and positioned ca. 3–4
cm away from the tip end.[46]
Scanning Electrochemical
Cell Microscopy
A home-built
SECCM workstation was used for all the SECCM experiments, as detailed
in previous studies[29,47,48] and discussed in brief below. The nanopipette probe was mounted
on the z-piezoelectric stage [P-753.2 LISA, Physik Instrumente (PI),
Germany] and moved into the initial position using xy-micropositioners
(M-461-XYZ-M, Newport, US) and a stepper motor (8303 Picomotor Actuator,
Newport, US).The sample was positioned at the center of a plastic
environmental cell[49] that allowed atmospheric
control (CO2 or argon) (Figure A). The cell was made from a 6.5 cm-wide
polypropylene air-tight container (HPL 931, Lock & Lock, South
Korea) with 100 cm3 volume. A gas inlet port was made on
the side of this cell by fitting a two-way Omnifit connector (Kinesis,
UK) into a drilled hole with epoxy seal (Sigma-Aldrich, UK). CO2 or Ar was humidified to ∼60% relative humidity by
continuously flowing (80 mL min–1) through deionized
water in a threaded midget bubbler (Sigma-Aldrich, UK). The humified
gas was delivered to the inlet channel via tetrafluoroethylene tubing.
As the gas flux was maintained, the cell of 100 cm3 volume
should be theoretically filled in <2 min if airtight. However,
the cell was purged for an ample time of 1 h prior to the experiment
to ensure efficient saturation of the cell, and the flow was maintained
throughout the experiment. With the cell saturated, saturation of
the nanodroplet is facilitated by the short diffusion path (the radius
of the nano-droplet is ≈300 nm, vide infra) for the gas species. A ca. 10 mm-wide hole in
the lid of the environmental jacket allowed translation of the tip
to the appropriate position on the polycrystalline sample and gas
outflow. Part of the cell lid was cut out and replaced with a 30 mm-diameter
circular cover glass (Thermo Fisher Scientific, UK) and sealed in
place, to enable visualization of the tip position in the area of
interest on the Cu surface with a high-resolution optical camera (Pixelink,
US; CompactTL 8× telecentric lenses, Edmund Optics, UK). Further
details can be found elsewhere.[49] The entire
environmental cell was mounted on the x–y piezoelectric positioner (P-733.2 XY, PI, Germany).
Figure 1
Schematics
of the SECCM experimental setup and scanning protocol
(not to scale). (A) Nanopipette probe, filled with the 10 mM KHCO3 electrolyte and containing a QRCE, in the environmental cell
hosting the substrate (polycrystalline Cu embedded in a block of carbon,
as schematized through the displayed grain boundaries). Flow of humidified
gas (Ar or CO2) through the cell, saturating the nanodroplet
meniscus and the solution in the lower part of the nanopipette. (B)
Expanded view of the nanopipette tip region, illustrating the hopping-mode
protocol used in this work. The trajectory of the tip during the scan
is shown by the dotted lines with arrowheads, and the area wetted
by the nanodroplet (working electrode area) is shown as blue circles.
Linear sweep voltammetry (LSV) measurements were made at each hop
position by sweeping the potential, Eapp, of the QRCE and measuring the current, isurf, at the working electrode. Substrate potential, Esurf = −Eapp. (C) Stepwise
events (i–iv) at each hop of the scan, with the corresponding
plot of (D) z-displacement of the pipet meniscus
from the surface (meniscus contact defined as z =
0 μm) and (E) synchronous potential waveform. In (C–E),
(i) the tip approaches the surface with Esurf = −0.5 V upon meniscus contact; (ii) Esurf is stepped to −1.05 V for 150 ms to reduce the
native surface layer on the Cu substrate; (iii) Esurf then stepped back to −0.5 V and linearly swept
to −1.05 V (1 V/s); and (iv) Esurf stepped to −0.5 V, and the tip retracted away from the surface.
(F) Comparison of linear sweep voltammograms from the protocol described
in C–E (blue trace) to analogous LSV without the electrochemical
pre-treatment step (black trace).
Schematics
of the SECCM experimental setup and scanning protocol
(not to scale). (A) Nanopipette probe, filled with the 10 mM KHCO3 electrolyte and containing a QRCE, in the environmental cell
hosting the substrate (polycrystalline Cu embedded in a block of carbon,
as schematized through the displayed grain boundaries). Flow of humidified
gas (Ar or CO2) through the cell, saturating the nanodroplet
meniscus and the solution in the lower part of the nanopipette. (B)
Expanded view of the nanopipette tip region, illustrating the hopping-mode
protocol used in this work. The trajectory of the tip during the scan
is shown by the dotted lines with arrowheads, and the area wetted
by the nanodroplet (working electrode area) is shown as blue circles.
Linear sweep voltammetry (LSV) measurements were made at each hop
position by sweeping the potential, Eapp, of the QRCE and measuring the current, isurf, at the working electrode. Substrate potential, Esurf = −Eapp. (C) Stepwise
events (i–iv) at each hop of the scan, with the corresponding
plot of (D) z-displacement of the pipet meniscus
from the surface (meniscus contact defined as z =
0 μm) and (E) synchronous potential waveform. In (C–E),
(i) the tip approaches the surface with Esurf = −0.5 V upon meniscus contact; (ii) Esurf is stepped to −1.05 V for 150 ms to reduce the
native surface layer on the Cu substrate; (iii) Esurf then stepped back to −0.5 V and linearly swept
to −1.05 V (1 V/s); and (iv) Esurf stepped to −0.5 V, and the tip retracted away from the surface.
(F) Comparison of linear sweep voltammograms from the protocol described
in C–E (blue trace) to analogous LSV without the electrochemical
pre-treatment step (black trace).All instrumentation used for tip positioning and current amplification
was enclosed within an aluminum Faraday cage, equipped with vacuum-sealed
panels (Kevothermal) and aluminum heat sinks, to minimize electrical
and mechanical noise and maintain thermal equilibrium during SECCM
scanning. The entire setup was placed on an optical breadboard with
an active vibration isolation frame (PBI52515, PFA51507, Thorlabs,
UK).SECCM was deployed in the scan hopping mode,[28,29] as shown in Figure B, to acquire spatially resolved linear sweep voltammograms on polycrystalline
Cu. The hopping mode allowed for a point-by-point interrogation of
the Cu substrate at an array of pre-defined locations within a grid.
The potential, Eapp, was applied at the
QRCE in the SECCM probe with respect to ground, and the current (isurf) flowing at the substrate at ground was
measured using a home-built electrometer. The substrate was thus at
a potential Esurf = −Eappversus the QRCE in the tip.The voltammetric protocol is illustrated in Figure C–E: (i) The tip was translated to
the surface with Esurf held at −0.5
V versus Ag/AgCl (3.4 M KCl), which was carefully
chosen to avoid the initiation of eCO2RR or other reduction/oxidation,[50,51] including HER.[52] A current change of
1.2 pA was used as a feedback parameter for stopping the nanopipette
approach (i.e., meniscus contact). (ii) Esurf was then immediately stepped to −1.05 V versus Ag/AgCl and held at that potential for 150 ms. As
discussed later, the reduction pulse served to reduce the native surface
oxides and hydroxides on the Cu surface.[53] (iii) An LSV measurement was immediately recorded by sweeping Esurf from −0.5 to −1.05 V versus Ag/AgCl (sweep rate υ = 1 V s–1). Lastly, (iv) the tip was withdrawn from the surface and moved
to the next scan position (Figure B). The tip position was recorded synchronously during
the whole scan and used to generate a complementary topographical
map, from the z position at each of the meniscus
contact coordinates. Figure F shows that LSV collected with the pulse protocol incorporated
does not show features associated with the native oxide layer on Cu.The substrate current, isurf, was measured
every 4 μs, averaged 257 times, to give a data acquisition rate
of 1028 μs per point. Data acquisition and instrument control
were carried out with an FPGA card (PCIe-7852R) controlled by a LabVIEW
2016 interface (National Instruments, USA) running on Warwick electrochemical
scanning probe microscopy (WEC-SPM) software (www.warwick.ac.uk/electrochemistry/wec-spm). The droplet footprint was imaged with field emission SEM (FE-SEM)
after scanning, and the dimensions of the wetted areas (geometric
areas of the “effective” working electrode) were used
to normalize the current measurements such that voltammograms, maps,
and movies could be presented as current density, mA cm–2.
Electron Backscatter Diffraction
EBSD measurements
were performed on the samples after SECCM analysis. A Zeiss SIGMA
FE-SEM instrument (Zeiss, Germany) with a Nordlys EBSD detector (Oxford
Instruments, U.K.) was used. EBSD images were collected at 20 keV
accelerating voltage, with the sample tilted at 70° to the detector.
Note that the penetration depth is typically ∼70 nm on Cu for
the acceleration voltage employed in this work.[54] Therefore, activity correlations in this work are with
the “bulk” orientation of the grains, which we consider
to be reasonable for the ex situ evaluation of the post-catalyst structure,
noting that Cu electrocatalysts are expected to be dynamic during
eCO2RR.[22,23] The z—normal direction
IPF (IPFz) color maps were extracted from AZtech
software linked with the instrument controls (AZtech, Oxford Instruments,
UK). Following EBSD characterization, the AZtechICE software package
(Oxford Instruments, UK) and Tango program in CHANNEL 5 software (Oxford
Instruments HKL, Denmark) were used to interrogate the acquired EBSD
data to extract the grain boundary lines and average grain parameters
(e.g., the Euler angles for deriving the average
Miller indexes) of grains that were relevant for correlation with
SECCM data.
Results and Discussion
Electroreduction Activity Versus Crystallographic
Orientation among Low-Index Facets
We consider the onset
potential region (from −0.5 to −1.05 V vs Ag/AgCl) where on low-index Cu facets, HER is dominant, while the
products HCOO– and CO account for less than 2% of
the current density.[43,53,55] Recent work evidences that only HER was observed on Cu(100) single
crystals until steps and defects were incorporated.[19] Thus, initial consideration of only low-index facets allows
us to test and confirm the SECCM screening method.Figure presents the results
of an SECCM scan (100 μm × 100 μm area) on polycrystalline
Cu, acquired under a CO2-saturated atmosphere with a 200
nm-diameter nanopipette probe
filled with the 10 mM KHCO3 electrolyte. The pulse-LSV
scanning protocol discussed in the Materials and
Methods section was used. Each pixel therefore contains an
LSV measurement made by sweeping the surface potential from −0.5
to −1.05 V versus Ag/AgCl at a voltammetric
scan rate of 2 V s–1, compiled as a sequence of
equipotential surface current density maps for the entire potential
range from −0.5 to −1.05 V (268 frames) provided in
Supporting Information, Movie S1.
Figure 2
(A) Electrochemical
image of a polycrystalline Cu surface, extracted
from the potentiodynamic SECCM movie (Supporting Information, Movie S1) at Esurf = −1.05 V vs Ag/AgCl with overlay of grain
boundaries (black solid lines) from (B) co-located EBSD map. The scan
covers a 100 by 100 μm2 area composed of 2500 pixels.
SECCM mapping was conducted with a nanopipette filled with 10 mM KHCO3 in a CO2-purged environmental cell. (C) Average
linear sweep voltammograms obtained on grains closest to the low-index
crystallographic orientations presented in blue, red, and black for
(111), (100), and (110) respectively. ±1 standard deviation bars
for the linear sweep voltammograms are provided at 50 mV intervals.
(D) Bar chart and the current density at −1.05 V vs Ag/AgCl for the low-index grains in the electrochemical map (A),
with N = 7, 17, and 24 for (111), (100), and (110)
respectively.
(A) Electrochemical
image of a polycrystalline Cu surface, extracted
from the potentiodynamic SECCM movie (Supporting Information, Movie S1) at Esurf = −1.05 V vs Ag/AgCl with overlay of grain
boundaries (black solid lines) from (B) co-located EBSD map. The scan
covers a 100 by 100 μm2 area composed of 2500 pixels.
SECCM mapping was conducted with a nanopipette filled with 10 mM KHCO3 in a CO2-purged environmental cell. (C) Average
linear sweep voltammograms obtained on grains closest to the low-index
crystallographic orientations presented in blue, red, and black for
(111), (100), and (110) respectively. ±1 standard deviation bars
for the linear sweep voltammograms are provided at 50 mV intervals.
(D) Bar chart and the current density at −1.05 V vs Ag/AgCl for the low-index grains in the electrochemical map (A),
with N = 7, 17, and 24 for (111), (100), and (110)
respectively.From the current density map at Esurf = −1.05 V (Figure A), clear and consistent grain-to-grain contrast
can be observed.
The activity reflects closely the crystallographic orientation shown
by the IPFz color map from the EBSD analysis in Figure B. The SEM image
(Supporting Information, Figure S1B), collected
alongside the EBSD map, shows that the droplet footprints are uniform
(with mean ± standard deviation of the diameter = 605 ±
61 nm). Topography maps obtained synchronously with the SECCM measurements
(Supporting Information, Figure S1C,D)
indicate an overall variation of topography of the order of tens of
nanometers, which is on the scale expected from the dimension of the
suspension employed in the last stage of the polishing procedure (0.06
μm), as described in the Materials and Methods section (vide supra). The substantial difference
in electroreduction activity among the low-index grains, herein defined
as the grains within 10° of the projection coordinates[33] (vide infra) of (100), (110),
and (111) orientations, is clear from the average linear sweep voltammograms
in Figure C and the
bar chart in Figure D. The selection of these grains is discussed in the next section.
Also, the precise Euler angles, hkl indexes, and
measures of deviation from the ideal low-index poles are supplied
in Supporting Information, Table S1A, line
1–3.The eCO2RR activity for the low-index
planes is in the
order of (110) > (100) > (111) (Figure D), with values of current density at Esurf = −1.05 V of 4.49 ± 0.21, 3.00
±
0.68, and 2.15 ± 0.13 mA cm–2, respectively.
As the overwhelmingly dominant reaction is HER, the trend of activity
in neutral/alkaline media can be considered to be a subtle balance
between the hydrogen binding energy and the energetics of water dissociation.[52,56−58] The order of the reported adsorption energies of
H on preferred sites on low-index Cu facets using a six-slab model[59] agrees with the order of electroreduction activity
of Cu(110) > (100) > (111) in accordance with the position of
Cu on
the ascending side of the volcano plot (Figure C, D). On the basis of water dissociation,
the decreasing order of water dissociation activity on clean low-index
Cu facets is (110) > (100) > (111),[60] with
Cu(110) having the lowest activation energy barrier among the low-index
facets.[52,60−62]
Electroreduction Activity Versus Grain Orientation
among High-Index Facets
We now extend our data analysis to
secondary orientations within the SECCM scan area in Figure , where there are approximately
60 different grains identified at the spatial scale of EBSD. Compared
to low-index facets, there is an increased proportion of eCO2RR intermediates on high-index facets in the onset potential region,
which is robustly justified by computational[44] and experimental[63] reports and is consistent
throughout the literature.[2,7,44,53,64−66]To visualize differences in orientation between
such grains, a two-dimensional projection was employed, representing
the grains with a conformation analogous to the IPFz. Full details of the method development and calculation are published
elsewhere.[32] Data from Figure A are plotted in Figure , according to the surface
crystallography, with the low-index grains in the face-centered cubic
(fcc) crystal system, (100), (110), and (111), discussed in the previous
section, shown, respectively, in red, green, and blue in the corners
of the plot. The average Euler angles, hkl index,
coordinates on the two-dimensional projection, electroreduction current
density, and number of linear sweep voltammograms collected on each
grain with SECCM are detailed in Supporting Information, Section S4, Table S1. Figure is essentially a scatter plot in which each point
represents average electroreduction activity at individual grains.
The x–y coordinate of each
point corresponds to the crystal orientation, the size is determined
by the number of LSV measurements (pixels) collected on the grain,
and the color of the point scales with electrochemical activity, that
is, the measured current density at E = −1.05
V versus Ag/AgCl.
Figure 3
Two-dimensional projection of Cu grain
orientations in an fcc crystal
system correlated with electrochemical data from SECCM. Grain-resolved
electroreduction current density measurements at Esurf = −1.05 V vs Ag/AgCl (extracted
from the SECCM scan in Figure and Movie S1) plotted vs the corresponding average grain orientation relative
to the low-index orientation poles. The size of each data point is
proportional to the number of SECCM pixels of that orientation according
to the displayed scale. Further details of each grain within the plot
can be found in Supporting Information,
Table S1 (Section S4). Arrows point to the data points closest to
the three low-index facets that were chosen to represent (100), (111),
and (110) grains in Figure . Dashed lines at the boundaries and the bisecting path across
the triangle cover various high-index crystallographic structures.
Along these lines, the projected coordinates for specific high-index
orientations are identified with black circles of a diameter of 3.0°
in the projection coordinates. Hence, a data point in or on a drawn
circle is considered to represent grains identical to (or within ±1.5
degrees of) the indicated orientation, with the Miller index written
next to the circle. Cu(941) and Cu(741) facets are emphasized in blue.
The inset shows the relationship between measured current density
on the 60 grains and density of broken bonds. Detail of the calculation
is provided in Supporting Information,
Section S5.
Two-dimensional projection of Cu grain
orientations in an fcc crystal
system correlated with electrochemical data from SECCM. Grain-resolved
electroreduction current density measurements at Esurf = −1.05 V vs Ag/AgCl (extracted
from the SECCM scan in Figure and Movie S1) plotted vs the corresponding average grain orientation relative
to the low-index orientation poles. The size of each data point is
proportional to the number of SECCM pixels of that orientation according
to the displayed scale. Further details of each grain within the plot
can be found in Supporting Information,
Table S1 (Section S4). Arrows point to the data points closest to
the three low-index facets that were chosen to represent (100), (111),
and (110) grains in Figure . Dashed lines at the boundaries and the bisecting path across
the triangle cover various high-index crystallographic structures.
Along these lines, the projected coordinates for specific high-index
orientations are identified with black circles of a diameter of 3.0°
in the projection coordinates. Hence, a data point in or on a drawn
circle is considered to represent grains identical to (or within ±1.5
degrees of) the indicated orientation, with the Miller index written
next to the circle. Cu(941) and Cu(741) facets are emphasized in blue.
The inset shows the relationship between measured current density
on the 60 grains and density of broken bonds. Detail of the calculation
is provided in Supporting Information,
Section S5.A significant observation in Figure is that grains within
5° deviation from the low-index
poles—(100) and (111), especially—show comparable electroreduction
activity to the nearby low-index orientation. Outside of these regions,
much larger electroreduction current densities are generally recorded
on the high-index orientations. In a control scan, collected under
Ar, where the reaction is restricted to the HER (Supporting Information, Figure S2, Movie S2, and Table S1B), less current
was observed on the secondary facets within the triangular projection
compared to surfaces closer to the (100) and (111) poles (see further
details in Supporting Information, section
S6). The latter two orientations had the lowest activity of all the
surfaces assessed under CO2. Note further that the points
on the bisection line in Figure S2 have
the lowest activity, whereas under eCO2RR conditions, this
is the region of the highest activity. Also, the overall lower current
density observed in the CO2 scan (<10 mA cm–2, Figure ) compared
to Ar (up to 20 mA cm–2, Figure S2) is due to the inhibition of HER in CO2 atmospheres.[63,67] Thus, it is reasonable to conclude that the trend observed under
CO2 for the high-index facets shown in Figure is mainly attributable to
the generation of eCO2RR products in line with the original
work of Hori[68] and more recent work, which
has shown that such high-index structures can readily transform in operando to produce highly active stepped surfaces.[19] As emphasized below, a key feature of the SECCM
screening method is the possibility of assessing unusual surface indexes
present on polycrystalline Cu which have not been assessed before.The inset of Figure also established the correlation of the measured electroreduction
current density with the density of broken bonds estimated for the
grains in the triangular projection. See Section S5 of the Supporting Information for the details of the
calculation. To delve more deeply into the surface structure–electrochemical
activity, we identified significant points on the plot (each marked
with a circle) and associated them with corresponding model crystal
structures (shown in brackets beside the selected point), as displayed
in Figure . Figure A shows the measured
electroreduction current density of the grains between (100) and (111),
which are characterized by Miller indices (m11),
where 1 < m. Upon transiting from (111) toward
(100), first, an increasing number of (100) steps are added to the
(111) terraces.[1,4,69] This
holds up to (311), after which the structure inverts, and (111) steps
on (100) terraces are observed.[69] Electroreduction
activity can be seen to rise with increasing (111)-step density, that
is, from (100) to (511) and also with increasing (100)-step density:
from (111) to (522). This suggests that the most stepped high-index
grains are most active for electroreduction. Specifically, Cu(511),
which is identified as the orientation with the highest reduction
current density on this path (Figure A), has one (111) step every three atoms along the
(100) terrace {i.e., analogous to Cu[S]—[3
(100) × (111)]}. Interestingly, Cu(511) is about 50% more active
than its counterpart, Cu(211), which has similar step density but
with (100) steps on (111) terraces {i.e., Cu[S]—[3
(111) × (100)]}. This suggests that (100) steps are more active
compared to (111) steps. This trend is consistent with the variation
in electrode potential and C2 product yield in current-controlled
experiments at −5 mA cm–2 current density
in a series of single crystal electrodes.[68]
Figure 4
Trends
of electroreduction activity on high-index Cu orientations
along the two-dimensional projection of grain orientation in Figure . The current densities
at the end of LSV (V = −1.05 V vs Ag/AgCl) are shown for (A) (100)–(111) axis, (B) (100)–(110)
axis, and (C) bisecting path between (100) and (441). Rigid ball models
of the crystallographic orientations identified in the bar charts
are presented alongside the respective graphs from (A–C).
Trends
of electroreduction activity on high-index Cu orientations
along the two-dimensional projection of grain orientation in Figure . The current densities
at the end of LSV (V = −1.05 V vs Ag/AgCl) are shown for (A) (100)–(111) axis, (B) (100)–(110)
axis, and (C) bisecting path between (100) and (441). Rigid ball models
of the crystallographic orientations identified in the bar charts
are presented alongside the respective graphs from (A–C).In Figure B, the
trend of activity from (100) to (110), with Miller indices (0n1), where 0 < 1 < n, is presented.
Upon moving from (100) toward (110), steps of (110) are gradually
added to the (100) terraces. This (110) step is unique as it is composed
of kinks, unlike steps of (111) and (100), up to a maximum kink density
of the (210) surface.[4,68,69] Electroreduction activity can be seen to increase in the same manner
as described above. In contrast, structures between (210) and (110)
have (100) steps and (110) terraces. Cu(740) is in this category and
is where we observed the highest electroreduction current density
within the grain selection considered. For all three boundary axes,
the two contributing low-index planes have the lowest activity, except
for orientations on the (111)–(110) axis for which (110) is
most active. We deduce that enhanced electroreduction activity is
observed at high-index facets and scales with the step density and
surface roughness.The grains with the overall highest electroreduction
current density
are Cu(941) and Cu(741) (identified with blue circles in Figure ), which are about
7–8° shifted from the middle of the (100)–(110)
axis toward the center of the triangle. A dashed line that originates
from (100) and bisects the (111)–(110) axis at point (441)
is drawn on the grain orientation projection in Figure . With reference to Figure C, starting from the stepped (441) index,
the kink density increases gradually along this line such that the
points in the middle of the stereographic triangle, in the vicinity
of (741) and (941) orientations, present complex atomic arrangements.[69] The 3D rigid ball models of the two orientations
show the most closely packed arrangement of the kink atoms. Further
along the zone axis, the surface becomes smoother, approaching the
(100) surface. Thus, introducing kinks to stepped surfaces is critical
to their catalytic performance, in agreement with a previous report
on eCO2RR for a series of high-index single crystal platinum
electrodes.[70] Interestingly, Cu surfaces
similar to (741) and (941) have received little attention in experimental
and density functional theory studies, although the data presented
herein suggest that they are worthy of further analysis as high-activity
surfaces.
Fingerprinting the Native Surface Layer on Polycrystalline Cu
with Voltammetric SECCM
In this section, we clarify the importance
of the pulse phase in the SECCM protocol detailed in the Materials and Methods section for stripping the
native passive layer on the Cu surface. This work also illustrates
how SECCM can be used to assay the electrochemical properties of surface
layers on electrodes. Presented in Figure are the results of a 100 × 100 μm2 SECCM LSV scan in a CO2 environmental cell for
which the potential pulse phase was omitted. Figure A shows isurf at Esurf = −1.05 V versus Ag/AgCl, taken from a potentiodynamic movie for the entire potential
range of Esurf = −0.45 to −1.05
V versus Ag/AgCl (Supporting Information, Movie S3). A corresponding co-located EBSD map
is presented in Figure B. By comparing Figure A with Figure B,
surface grain dependency of the electrochemical response is evidenced.
Figure 5
(A) Electrochemical
image of the measured current density on a
polycrystalline Cu surface, extracted from the potentiodynamic SECCM
movie (Movie S3) at E =
−1.05 V vs Ag/AgCl. (B) Co-located EBSD map.
The scan covers a 100 × 100 μm2 area comprising
2500 pixels. SECCM mapping was conducted with a nanopipette filled
with 10 mM KHCO3 in a CO2 environmental cell.
(C) Averaged linear sweep voltammograms collected on low-index grains
[(100), (111), and (110)] which are identified as (i, ii, and iii)
in (A) and (B). Shown on linear sweep voltammograms are the average
current density–voltage curves (solid lines) ± one standard
deviation (dotted lines), obtained from 13, 78, and 39 independent
linear sweep voltammograms selected from grains (100), (111), and
(110), respectively. (D) Histograms of peak position values for the
Cu(111) and (100) LSV data from (C). (E) Spatially resolved peak potential
map, extracted from individual linear sweep voltammograms. In this
map, pixels with peakless linear sweep voltammograms are colored gray.
(A) Electrochemical
image of the measured current density on a
polycrystalline Cu surface, extracted from the potentiodynamic SECCM
movie (Movie S3) at E =
−1.05 V vs Ag/AgCl. (B) Co-located EBSD map.
The scan covers a 100 × 100 μm2 area comprising
2500 pixels. SECCM mapping was conducted with a nanopipette filled
with 10 mM KHCO3 in a CO2 environmental cell.
(C) Averaged linear sweep voltammograms collected on low-index grains
[(100), (111), and (110)] which are identified as (i, ii, and iii)
in (A) and (B). Shown on linear sweep voltammograms are the average
current density–voltage curves (solid lines) ± one standard
deviation (dotted lines), obtained from 13, 78, and 39 independent
linear sweep voltammograms selected from grains (100), (111), and
(110), respectively. (D) Histograms of peak position values for the
Cu(111) and (100) LSV data from (C). (E) Spatially resolved peak potential
map, extracted from individual linear sweep voltammograms. In this
map, pixels with peakless linear sweep voltammograms are colored gray.Figure C shows
the average linear sweep voltammograms (N = 13, 78,
and 39) selected from the grains closest to the primary low-index
orientations, (100), (111), and (110), marked as i, ii, and iii, respectively,
in Figure A,B. It
is clear from Figure C that the entire voltammetric profiles are unique for each low-index
grain. Distinct reduction peaks attributable to the stripping of the
native hydroxide layer of Cu (vide infra) are observed on the linear
sweep voltammograms for Cu(100) and Cu(111) at −0.78 and −0.88
V versus Ag/AgCl, respectively (Figure C,D). However, a reduction
peak is not observed on grain (110); the reduction current density
magnitude continues to increase within the potential range studied.
This is because the potential region for native hydroxide stripping
on Cu(110) overlaps with the voltammetric onset of CO2 reduction/hydrogen
evolution.[12,71] The grain dependency of the peak
position is consistent for the whole scan and can be supported by
maps of the peak potential (Figure E) and crystallographic orientations obtained from
EBSD (Figure B).To further understand the reduction, we studied the native layer
stripping in an argon atmosphere with four sequential cyclic voltammetry
(CV) cycles at a single point on the Cu surface (Figure ).[33] In the first cycle, a characteristic
reduction peak at −0.78 V was observed, similar to the average
curve on Cu(100) (Figure C). On the second and subsequent cycles, the reduction peak
disappeared, and (quasi-)reversible Cu surface redox processes occurred
between −0.25 and −0.40 V.[12] This rules out the possible correlation of the reduction peak at
−0.78 V with reduction processes of electrochemically formed
CuO and Cu2O. Moreover, the reduction peak at −0.78
V is related to the initial state of the surface rather than a reversible
adsorption/desorption of electrolyte species (e.g., HCO3–, SO42–, etc.).[11,72,73] It is also noteworthy that the
peak is observed in a CO2 (Figure ) and argon (Figure ) environment.
Figure 6
Cyclic voltammograms
on polycrystalline Cu from a single-point
SECCM measurement. The experiment was performed with a nanopipette
filled with 10 mM KHCO3 in an Ar environmental cell. The
potential was swept from 0.5 to −1.05 V vs Ag/AgCl at a scan rate of 1 V s−1 for four consecutive
cycles. The direction of potential sweeps is noted with dashed arrows
on the first cycle.
Cyclic voltammograms
on polycrystalline Cu from a single-point
SECCM measurement. The experiment was performed with a nanopipette
filled with 10 mM KHCO3 in an Ar environmental cell. The
potential was swept from 0.5 to −1.05 V vs Ag/AgCl at a scan rate of 1 V s−1 for four consecutive
cycles. The direction of potential sweeps is noted with dashed arrows
on the first cycle.The reduction process
from −0.78 to −0.88 V has been
identified as the reduction of soluble precursors, namely, Cu(OH)2, on Cu surfaces.[53,74−76] Cu(OH)2, together with Cu2O and CuO, is the
product of native oxidation of Cu in an ambient atmosphere.[51] Up to 2.5 nm-thick Cu2O and Cu(OH)2 can be formed on Cu surfaces within 1 h when exposed to ambient
air, while CuO formation is much slower.[51] The charge density of the peak in the first CV cycle in Figure is about 657 μC
cm–2 which corresponds to ∼few monolayers
of the native oxide. The presence of Cu(OH)2 on as-prepared
Cu and its removal by electrochemical reduction potential were further
corroborated with X-ray photoelectron spectroscopy (XPS) measurement
(See Supporting Information, Section S7).As seen from the results of Figure and the surface composition characterization, the
maps shown in Figure reveal the crystallographic orientation dependence of the reduction
potential of the native Cu(OH)2 adlayer on low-index Cu
surfaces: (100) > (111) > (110). The surface oxides are removed
at
potentials more positive than the onset of HER and eCO2RR on Cu, especially on Cu(100) and Cu(111). There is debate as to
whether the product selectivity for eCO2RR reduction (at
more negative potentials than in this work) is from participation
of remnant oxide species[16,77] or from structural/morphological
transformations that accompany the reduction of the oxide layers.[17,53,78] Our electrochemical results lend
credence to the latter hypothesis, as the oxide signal is not observed
after the first cycle. If the oxide does remain, it is at an electrochemically
undetectable level.
Conclusions
We have implemented
a pseudo-single crystal screening approach,
engaging co-located voltammetric SECCM and EBSD, to reveal surface
structure–activity correlations for eCO2RR at multiple
sites across a polycrystalline Cu surface. Focusing on the onset potential
region, we observed the activity trend to be (111) < (100) <
(110) among the low-index facets, under CO2 electroreduction
conditions. However, product analysis from past studies suggests that
H2 evolution is the dominant process on the primary orientations
of Cu. For high-index facets, eCO2RR is more significant,
and analyses of ca. 60 different grains across the
secondary orientations, collectively visualized on a stereographic
triangle, unambiguously reveal that the density and nature of steps
and kinks introduced to the Cu catalyst surface are critical to achieving
enhanced eCO2RR activity. The electroreduction current
scales with the density of broken bonds of the surfaces. The overall
activity trend is as follows: (111) < (100) < Cu(S)—[n (111) × (111)] < (110) < Cu(S)—[n (111) × (100)] < Cu(S)—[n (100) × (111)] < Cu(S)—[n (100)
× (110)] < Cu(S)—[n (441) × (100)].
The most active orientations among the grains studied in this work
are Cu(941) and Cu(741), which are highly kinked step surfaces located
in the middle of the stereographic triangle. These Cu(941) and Cu(741)
surfaces, derived from stepped Cu(441)—a member of the Cu(S)—[n (111) × (111)] category and rarely studied for electroreduction
performance, may be crucial to achieving improved electroreduction
activity on Cu and are worth further study. Lastly, the electrochemical
stripping of the native Cu(OH)2 passive layer was shown
to be facet-controlled, and the order of relative ease of stripping
from easiest is (100) > (111) > (110). This fingerprinting phenomenon
further presents evidence of the important role played by crystallographic
facets in the electrochemical behavior of Cu electrocatalysts.Altogether, this study enables the screening and analysis of a
large number of surface structures, identifying candidate surfaces
for further study and providing information that could be used to
aid the rational design of improved catalysts for CO2 reduction.
This study motivates a broader exploration of structural engineering
as a method to improve electrocatalytic performance. A further direction
will be the implementation of on-line product analysis and instrumental
coupling of SECCM with in situ surface spectroscopy techniques to
enable selectivity measurements in the study of complex reaction systems
like eCO2RR.
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