| Literature DB >> 35547990 |
Zhaohui Han1,2, Peixian Zhu3, Jianhua Liu2, Sivasankar Koppala1, Lei Xu1,2, Libo Zhang1,2, Chandrasekar Srinivasa Kannan4.
Abstract
The use of Pb/Sn/Al composite anode materials has been limited due to the thermodynamic immiscibility between Pb and Al sheets during the welding process. Thus, herein, Sn has been added between Pb and Al sheets to fabricate a Pb/Sn/Al laminated composite via vacuum hot-pressing welding (at a temperature of 230 °C for 12 h under 0.5 MPa). Furthermore, the interfacial microstructure and mechanical and electrical properties are investigated. Good metallurgical bonding has been realized due to the addition of Sn, and block α-Pb and a small amount of β-Sn solid solutions are also formed at the interface. In comparison with the Pb-Ag alloy anode, the Pb/Sn/Al laminated composite presents superior mechanical strength (73.9 MPa), and good electrical conductivity of the Pb/Sn/Al composite has been obtained due to its sandwich laminated structure. Moreover, the Pb/Sn/Al composite reduces the electrode reaction energy and improves the electrocatalytic activity of the electrode to reduce the bath voltage. This journal is © The Royal Society of Chemistry.Entities:
Year: 2018 PMID: 35547990 PMCID: PMC9084499 DOI: 10.1039/c8ra04977g
Source DB: PubMed Journal: RSC Adv ISSN: 2046-2069 Impact factor: 3.361
Fig. 1Schematic illustration of the Pb/Sn/Al laminated composite electrode material.
Fig. 2Cross-sectional morphology at different holding times: (a) 0 h, (b) 1 h, and (c) 12 h. (d) Line scanning results corresponding to (c).
EDS point analysis of the transition layer
| Location | Element (wt%) | ||
|---|---|---|---|
| Pb | Sn | Al | |
| 1 | — | — | 100 |
| 2 | 21.45 | 70.14 | 8.41 |
| 3 | 23.88 | 76.12 | — |
| 4 | 89.92 | 10.08 | — |
Diffusion coefficient, D, of Pb and Sn
| Element |
|
|
|
|---|---|---|---|
| Sn | 10.7 | 108.4 | 5.3 × 10−15 |
| Pb | 0.995 | 107.4 | 0.8 × 10−15 |
| Sn into Pb | 0.29 | 99.4 | 2.6 × 10−16 |
Relevant thermodynamic parameters used for calculation[30]
| Element |
|
|
|
|---|---|---|---|
| Sn | 1.24 | 6.43 | 4.15 |
| Pb | 1.15 | 6.94 | 4.10 |
Fig. 3The enthalpy of mixing as a function of constituent percentage.
Fig. 4XRD patterns of the interface at the (a) Pb side and (b) Al side.
Fig. 5Fracture morphology of the transition zone: (a) and (c) for the Pb side, (b) and (d) for the Al side.
Fig. 6The curves of three-point bending tests for Pb/Sn/Al composite and Pb–Ag alloys (a) and the real image of the three-point bending of the test samples (b).
Conductivity (σ) of the composite materials under different processing conditions
| No. | Pb/Sn/Al composite | Pb–Ag alloy | ||||
|---|---|---|---|---|---|---|
| Current value/A | 0.1 | 0.3 | 0.5 | 0.1 | 0.3 | 0.5 |
|
| 0.095 | 0.125 | 0.140 | 0.038 | 0.043 | 0.049 |
Fig. 7Linear scanning voltage–current curves of the Pb/Sn/Al composite and Pb–Ag alloy.