| Literature DB >> 35539088 |
Sukjin Jang1,2, Daehwan Choi1,2, Suk Yang1,2, Jang-Yeon Kwon1,2.
Abstract
Recently, electronic skin that mimics human skin in measuring tactile stimuli, temperature, and humidity and having a self-healing function was developed. Furthermore, with the advances in the field of artificial intelligence and health monitoring, various materials and methods have been studied for e-skin. The limitations to work on actual human skin include device flexibility and large-area applications through array structures, and many studies are underway to overcome these problems. Polymeric materials containing ionic liquids can be used to easily fabricate devices in the solid state. They are highly sensitive to both pressure and temperature, making them suitable for multi-sensing devices. Resistive and capacitive sensors have the advantage of having a simple structure, which makes them easy to fabricate. In a single device, both types work well. For resistive sensors, the temperature sensitivity (1.1/°C) is relatively high. Conversely, capacitive sensors have a low temperature sensitivity (0.3/°C). However, they have the advantage of being uniformly variable under each condition and having a smaller error range. In the array structure, independent flex and thermo sensors are arranged repeatedly. The resistive type shows changes in temperature and bending, but in the capacitive type, it is difficult to obtain results from the pixels due to parasitic capacitance. This journal is © The Royal Society of Chemistry.Entities:
Year: 2019 PMID: 35539088 PMCID: PMC9075219 DOI: 10.1039/c9ra08188g
Source DB: PubMed Journal: RSC Adv ISSN: 2046-2069 Impact factor: 3.361
Fig. 1(a) Chemical structure of the thermoplastic polyurethane and the [EMIM]+[TFSI]− ionic liquid (b) schematic of side view image of thermo flex multi-functional array sensor having i-TPU pixels on the PI substrate.
Fig. 2(a) Current and relative change of single i-TPU device as a function of temperature. (b) Capacitance and relative change of single i-TPU device as a function of temperature. (c) Current in terms of bending radius under 3 conditions of h (which is the height ratio). (d) Capacitance in terms of bending radius when h is 0.9. (e) Summary of average capacitance when h is 0.7, 0.8, and 0.9.
Fig. 3(a) Schematic of array with PI sandwich structure. (b) Mapping the position of each pixel. (c) Optical image of the actual fabricated flexible device. (d) Initial mapping data of a resistive type array sensor. (e) Initial mapping data of a capacitance type array sensor.
Fig. 4(a) Mapping of current with temperature on flat devices. (b) Summarizing current ITP data as relative change. (c) Mapping of capacitance with temperature on flat devices. (d) Summarizing capacitance ITP data as relative change.
Fig. 5(a) Optical images under 3 conditions of angle of wrist flexion. (b) Mapping data of angle of wrist flexion.
Fig. 6(a) Current of IMP and ITP under repeated flexion. (b) Durability test of IMP.