| Literature DB >> 35481076 |
Xianzhu Zhong1, Aniruddha Nag1,2, Jiabei Zhou1, Kenji Takada1, Fitri Adila Amat Yusof3, Tetsu Mitsumata3, Kenji Oqmhula1, Kenta Hongo1, Ryo Maezono1, Tatsuo Kaneko1.
Abstract
Bio-based polymer materials having great potential due to the depletion of fossil-fuel resources have been applied as single-use and medicinal materials but their low thermomechanical resistance have limited wider applications. Here, ultrahigh thermoresistant bio-based terpolymers with a low dielectric constant, comprising polybenzimidazole and poly(benzoxazole-random-aramid), were prepared by a method involving stepwise polycondensation of three monomers, 3,4-diaminobenzoic acid for benzimidazoles, 3-amino-4-hydroxylbenzoic acid for benzoxazoles, and 4-aminobenzoic acid for aramids. For optimized monomer compositions, the obtained terpolymers exhibited dielectric constants lower than 3, and a 10% mass loss at approximately 760 °C which is a temperature higher than that for any other polymer material reported so far. The high thermal degradation temperatures of the prepared terpolymers were a result of the high interaction enthalpies of hydrogen bonding between imidazole rings in the polymer chains, which were obtained from density functional theory calculations using trimer models. Furthermore, the applicability of the prepared terpolymers as a wire-coating material for a simple motor insulation was demonstrated, indicating that it has significant potential to be used as a thermostable material with a low dielectric constant (k). This journal is © The Royal Society of Chemistry.Entities:
Year: 2022 PMID: 35481076 PMCID: PMC9016846 DOI: 10.1039/d2ra01488b
Source DB: PubMed Journal: RSC Adv ISSN: 2046-2069 Impact factor: 4.036
Scheme 1Synthetic pathway of terpolymers from three aminobenzoic acid derivatives through simple polymerization. Inset: picture of cast film.
Scheme 2Synthetic pathway of P(BI-b-BO-A) from three aminobenzoic acid derivatives through stepwise polymerization.
Fig. 1Images of the solution casted film of terpolymer. (a) Pristine, (b) origami-folded, and (c) unfolded films.
Fig. 2Solid-state 13C CP/TOSS NMR spectra of terpolymers in 70–21–9 (mol%) prepared by a one-pot polymerization and a stepwise polymerization method.
Thermal and mechanical properties of bio-based terpolymers
| Polymer |
|
|
|
|
|
|
|---|---|---|---|---|---|---|
| 70–30–0 | 638 | 703 | 80 ± 1.5 | 2.3 ± 0.1 | 3.48 | 1.89 (0.84) |
| 70–27–3 | 634 | 701 | 76 ± 3.2 | 3.2 ± 0.2 | 2.38 | 1.75 (0.78) |
| 70–21–9 | 624 | 707 | 76 ± 1.0 | 5.1 ± 0.1 | 1.49 | 1.65 (0.77) |
| 70–15–15 | 637 | 716 | 74 ± 1.4 | 6.7 ± 0.1 | 1.23 | 1.38 (0.78) |
| 70–9–21 | 658 | 736 | 72 ± 1.2 | 8.6 ± 0.1 | 0.84 | 1.30 (0.75) |
| 70–3–27 | 675 | 758 | 63 ± 1.7 | 10.3 ± 0.1 | 0.61 | 1.28 (0.74) |
| 70–0–30 | 686 | 763 | 48 ± 1.6 | 12.0 ± 0.2 | 0.40 | 1.24 (0.64) |
Terpolymers in varying compositions of PBO and PA, in which PBO varied from 30% to 0 while PA composition varied from 0 to 30%. PBI composition were fixed at 70%.
Thermal property indices, measured by TGA at nitrogen atmosphere. 5% and 10% weight loss thermal decomposition temperatures (Td5 and Td10).
Mechanical properties σ, γ, and E measured by stress–strain tensile test refer to tensile strength at break, strain at beak, and Young's modulus, respectively.
η inh1 refers to inherent viscosity of terpolymer synthesized by stepwise polymerization, while ηinh2 shown in parentheses refers to inherent viscosity of terpolymer synthesized via one-pot polymerization.
Fig. 3Thermal characterization of terpolymers. (a) TGA curves of terpolymers with various compositions. (b) Td5 and Td10 of terpolymers of different compositions.
Fig. 4Burning photographs depicting the burning terpolymer (left) and polyethylene (right).
Interaction enthalpy values of H-bond in various models
| Entry | Monomer 1 (H-donor) | Monomer 2 (H-acceptor) | Interaction enthalpy (kcal mol−1) |
|---|---|---|---|
| 1 | BI | BI | −13.32 |
| 2 | BI | BO | −9.23 |
| 3 | BI | BA | −10.24 |
| 4 | BA | BO | −9.23 |
| 5 | BA | BA | −6.85 |
| 6 | BI-BI-BI | BI-BI-BI | −4.77 |
| 7 | BA-BI-BI | BI-BI-BI | −10.58 |
| 8 | BI-BI-BI | BA-BI-BI | −10.01 |
| 9 | BI-BI-BA | BI-BI-BI | −12.46 |
| 10 | BI-BI-BI | BI-BI-BA | −12.68 |
| 11 | BA-BI-BA | BA-BI-BA | −14.13 |
| 12 | BO-BI-BO | BO-BI-BO | −13.57 |
| 13 | BO-BI-BA | BO-BI-BA | −13.80 |
H-bonding enthalpy calculated via DFT theory.
H-bonding enthalpy calculated via DFT theory in previous work.
Fig. 5Mechanical properties of terpolymers. (a) Stress–strain curves of terpolymers. (b) Tensile stress and strain values in different PA compositions.
Dielectric property indices of the terpolymers having various compositions
| Polymers (PBI–PBO–PA %) |
|
|
|
|---|---|---|---|
| 70–30–0 | 7.0 | 2.6 | 6.22 × 1011 |
| 70–27–3 | 8.0 | 2.4 | 6.63 × 1011 |
| 70–21–9 | 10.0 | 3.0 | 1.24 × 1014 |
| 70–15–15 | 6.0 | 2.6 | 2.67 × 109 |
| 70–9–21 | 7.0 | 2.8 | 3.67 × 1010 |
| 70–3–27 | 8.0 | 2.9 | 5.12 × 1010 |
| 70–0–30 | 9.0 | 3.2 | 4.09 × 1010 |
Thickness.
Dielectric constant.
Volume resistivity.
Fig. 6Plot of dielectric constant versus 1% thermal degradation temperature (Td1) for the terpolymer and other common commercial polymer materials:polypropylene (PP),[24,25] poly(butyl methacrylate) (PBMA),[26,27] polystyrene (PS),[28,29] Nylon 6,[30,31] polycarbonate (PC),[32] Kapton™,[33,34] polyphenylene sulfide (PPS)[35], polyether ether ketone (PEEK)[36,37] and Zylon.[38]
Fig. 7a) Process of coating copper wire with terpolymer P(BI-b-BO-A). (b) Running experiment of motor, where the coil was assembled by a P(BI-b-BO-A) coated copper wire. (c) Voltage applied across the copper wires in direct current mode (upper: commercially available copper wire, lower: terpolymer coated copper wire). (d) SEM image of commercially available copper wire after applying voltage. (e) SEM image of terpolymer coated copper wire after applying voltage.