| Literature DB >> 35336046 |
Ioannis Partheniadis1, Vasiliki Terzi2, Ioannis Nikolakakis1.
Abstract
Finite element analysis (FEA) is a computational method providing numerical solutions and mathematical modeling of complex physical phenomena that evolve during compression tableting of pharmaceutical powders. Since the early 2000s, FEA has been utilized together with various constitutive material models in a quest for a deeper understanding and unraveling of the complex mechanisms that govern powder compression. The objective of the present review paper is to highlight the potential and feasibility of FEA for implementation in pharmaceutical tableting in order to elucidate important aspects of the process, namely: stress and density distributions, temperature evolution, effect of punch shape on tablet formation, effect of friction, and failure of the tablet under stress. The constitutive models and theoretical background governing the above aspects of tablet compression and tablet fracture under diametral loading are also presented. In the last sections, applications of FEA in pharmaceutical tableting are demonstrated by many examples that prove its utilization and point out further potential applications.Entities:
Keywords: Drucker–Prager; compression; constitutive models; density distribution; microcrystalline cellulose; overview; pharmaceuticals; punch shape; simulation; tablet shape
Year: 2022 PMID: 35336046 PMCID: PMC8951224 DOI: 10.3390/pharmaceutics14030673
Source DB: PubMed Journal: Pharmaceutics ISSN: 1999-4923 Impact factor: 6.321
Figure 1Symmetric geometric 2D model (a) for powder compression and (b) for diametral loading test of tablet mechanical strength.
Figure 2Flowchart for the application, verification, and validation of a finite element analysis (FEA) model.
Figure 3(a) The Drucker–Prager Cap (DPC) model and its parameters and (b) family of DPC models for different levels of relative density over a range of compaction.
Figure 4Elastic stress field developed in a flat-faced tablet during diametrical compression.
Studies on the application of finite element analysis (FEA) in the tableting and mechanical strength test of pharmaceutical tablets.
| Study | Material 1 | Equipment | FEA Model | Application | References | ||
|---|---|---|---|---|---|---|---|
| Model 2 | Meshing 3 | Young’s Modulus ( | |||||
| 01 | LAC | flat-faced punches | DPC | 4-node | 4.6/0.17 * | Stress & density distribution during tableting | Michrafy et al., 2002 [ |
| 02 | MCC | 9.525 mm die, flat-faced punches | DPC | no data | Stress & density distribution/friction evolution during tableting | Cunningham et al., 2004 [ | |
| 03 | MCC | flat-faced punches | DPC & Janssen–Walker model | 4-node | Study of friction evolution during tableting | Michrafy et al., 2004 [ | |
| 04 | MCC | 25 mm die, concave-faced punches | DPC & Janssen–Walker model | 4-node | Study of friction evolution during tableting | Sinka et al., 2004 [ | |
| 05 | MCC | 11.28 mm die, flat-faced punches | DPC | 4-node | Stress & density distribution during tableting | Kadiri et al., 2005 [ | |
| 06 | LAC | 8 mm die, flat-faced punches | DPC | 4-node | 3.57/0.12 * | Study of failure mechanisms | Wu et al., 2005 [ |
| 07 | MCC | diametral compression of flat-faced tablets | Filon theory | 4-node | 1.0/0.25 | Stress & strain distributions byopposing compressive line loads | Drake et al., 2007 [ |
| 08 | MCC | 8 mm die, flat-faced punches | DPC | no data | no data | Stress & density distribution/failure mechanisms during tableting | Han et al., 2008 [ |
| 09 | MCC | 8 mm die, flat- & concave-faced punches | DPC | 4-node | 4.2 and 22.6/0.42 and 0.233 * | Stress & density distribution during tableting | Han et al., 2008 [ |
| 10 | LAC | 8 mm die, flat- & concave-faced punches | DPC | 4-node | 3.57/0.12 | Study of failure (capping) mechanisms | Wu et al., 2008 [ |
| 11 | MCC | 9.525 mm die, flat-faced punches | DPC | 4-node (T) | no data | Study of temperature evolution during tableting | Zavaliangos et al., 2008 [ |
| 12 | MCC | 9.525 mm die, concave-faced punches | DPC | 8-node (T) | Study of temperature evolution during tableting | Klinzing et al., 2010 [ | |
| 13 | LAC | flat-faced punches | DPC | 4-node (R) | no data | Stress & density distribution during tableting | Sinha et al., 2010 [ |
| 14 | MCC | flat-faced punches | DPC | 4-node | 2.207/0.14 * | Stress & density distribution during tableting | Sinha et al., 2010 [ |
| 15 | LAC | 5.6 mm die, flat-faced punches | DPC | 4-node | 4.86/0.12 * | Stress & density distribution during tableting | Si and Lan, 2012 [ |
| 16 | MCC | flat-faced punches | DPC & creep behavior model | no data | no data | Study of the viscoelastic behavior during tableting | Diarra et al., 2013 [ |
| 17 | LAC, CS & MCC | 8 mm die, flat-faced punches | DPC | no data | 3–4/0.1–0.2 | Stress & density distribution during tableting | Hayashi et al., 2013 [ |
| 18 | MCC | 11.28 mm die, flat & concave-faced punches | DPC | 4-node (R) | Study of failure (capping) mechanisms | Kadiri and Michrafy, 2013 [ | |
| 19 | not applicable/theoretical study | diametral compression of elongated tablets | Elastic stresses model | 3-node | 0.002/no data | Stress & strain distributions during diametral compression | Pitt and Heasley, 2013 [ |
| 20 | Anhydrous dextrose | diametral compression of flat-faced tablets | Elastic stresses model | 20-node (R) | 2.58 and 9/0.35 and 0.3 | Stress & strain distributions during diametral compression | Podczeck et al., 2013 [ |
| 21 | MCC | diametral compression of flat-faced and biconvex tablets | DPC & Elastic model | 8-node | Stress & strain distributions during diametral compression | Shang et al., 2013 [ | |
| 22 | MCC | 9.525 mm die, flat-faced punches | Griffith & Irwin models | 4-node | no data | Study of failure (cracking) mechanisms during decompression & ejection | Garner et al., 2014 [ |
| 23 | TEO, LAC, CS, MCC, MgSt | 8 mm die, flat-faced punches | DPC | no data | 6.51–9.84/0.1164–0.1282 | Stress & density distribution during tableting | Hayashi et al., 2014 [ |
| 24 | MCC | 5.25 mm die, flat- & convex-faced punches | DPC | 8-node | Stress & density distribution during tableting | Krok et al., 2014 [ | |
| 25 | ACP | three point bending test of flat-faced tablets | Elastic stresses model | 4-node | 3.4/0.23 | Stress & strain distribution during three point bending test | Mazel et al., 2014 [ |
| 26 | not applicable/theoretical study | diametral compression of flat, round, bevel-edged tablets | Elastic stresses model | 4-node | 2.58/0.35 | Stress & strain distributions during diametral compression | Podczeck et al., 2014 [ |
| 27 | ACP & MCC | 11.28 mm die, flat- & concave-faced punches | DPC | no data | no data | Stress & density distribution during tableting | Diarra et al., 2015 [ |
| 28 | MCC | diametral compression of biconvex tablets | DPC | no data | Study of failure (capping) mechanisms | Furukawa et al., 2015 [ | |
| 29 | ACP | 11.28 mm die, concave-faced punches | DPC | no data | no data | Stress & density distribution/friction evolution during tableting | Mazel et al., 2015 [ |
| 30 | ACT, LAC, CS, MCC, L-HPC, MgSt | 12 mm die, concave-faced punches | DPC | no data | 2.96–6.51/0.0742–0.0943 | Stress & density distribution during tableting | Otoguro et al., 2015 [ |
| 31 | LAC, ASA | three point bending test of flat, round, bevel-edged tablets | Elastic & brittle-cracking model | 10-node | 2.99 for LAC & 1.51 for ASS/0.3 | Stress & strain distributions during three point bending test | Podczeck et al., 2015 [ |
| 32 | MCC | 8 mm die, flat- & convex-faced punches | DPC | 4-node (T) | Study of temperature evolution during tableting | Krok et al., 2016 [ | |
| 33 | ACP, CPD, SD-LAC, G-LAC & SD-MAN | 3.8 mm die, flat-faced punches | DPC | no data | Stress & density distribution during tableting | Mazel et al., 2016 [ | |
| diametral compression of flat-faced tablets | Elastic stresses model | no data | 4.2/0.25 | Stress & strain distributions during diametral compression | |||
| 34 | LAC, CS, MCC, L-HPC | diametral compression of flat-faced scored tablets | Elastic stresses model | no data | 2.35/0.08 | Stress & strain distributions during diametral compression | Okada et al., 2016 [ |
| 35 | MCC | 12 mm die, flat-faced punches | DPC | 4-node (R) | Stress & density distribution during tableting | Baroutaji et al., 2017 [ | |
| 36 | ACP, SD-LAC | diametral compression of flat-faced tablets | Elastic stresses model | no data | 4.4/0.25 for ACP & 3.7/0.23 for SD-LAC | Stress & strain distributions during diametral compression | Croquelois et al., 2017 [ |
| 37 | ACP | 12 mm die, concave-faced punches | DPC | no data | no data | Study of failure (lamination) mechanisms | Mazel et al., 2018 [ |
| 38 | MCC | 12 mm die, concave-faced punches | DPC | 4-node (R) | no data | Study of failure (capping & chipping) mechanisms | Baroutaji et al., 2019 [ |
| 39 | PCZ, MCC & ACP | 9.525 mm die, concave-faced punches | DPC | 4-node | no data | Stress & density distribution during tableting | Huang et al., 2019 [ |
| 40 | MCC | 11.28 mm die, flat- & concave-faced punches | DPC & Janssen–Walker model | no data | no data | Study of friction evolution during tableting | Mazel et al., 2019 [ |
| 41 | MCC, LAC, CS | 12 mm die, concave-faced punches | DPC | no data | 1.803–3.321/0.1363–0.1774 | Stress & density distribution during tableting | Takayama et al., 2019 [ |
| 42 | LAC, ACP, MCC, CS | 11.28 mm die, flat-faced punches | Linear viscoelastic | no data | no data | Study of the viscoelastic behavior during tableting | Desbois et al., 2020 [ |
| 43 | MCC, LAC, ACT, MgSt | 8.3 mm die, flat-faced punches | DPC & Perzyna model | no data | no data | Study of the viscoelastic behavior during tableting | Ohsaki et al., 2020 [ |
| 44 | MCC, MgSt, LAC, NaCl | diametral compression of flat-faced tablets | Elastic stresses model | 8-node | 10.0/0.3 | Stress & strain distributions during diametral compression | Radojevic et al., 2021 [ |
| 45 | not applicable/theoretical study | diametral compression of various shape tablets | Elastic stresses model | 20-node | no data | Stress & strain distributions during diametral compression | Yohannes and Abebe, 2021 [ |
1 Material abbreviations: LAC: Lactose monohydrate, MCC: Microcrystalline cellulose, CS: Corn starch, TEO: Theophylline, MgSt: Magnesium stearate, ACT: Acetaminophen, L-HPC: low-substituted hydroxy-propyl-cellulose, ASA: Acetyl salicylic acid, ACP: anhydrous calcium phosphate, SD: spray—dried, G: granulated, MAN: Mannitol, PCZ: Posaconazole, CPD: calcium phosphate dihydrate; 2 Model abbreviations: DPC: Drucker—Prager—Cap model; 3 Meshing: 4-node: four-node bilinear axisymmetric first order solid elements, 4-node (T): 4-node bilinear coupled displacement-temperature solid element, 8-node (T): 8-node trilinear coupled displacement-temperature solid element, 4-node (R): four-node axisymmetric first-order solid element with reduced integration, 3-node: 3-node linear axisymmetric triangular solid element, 20-node (R): 20-node “brick” element with reduced integration, 8-node: 8-node linear “brick” solid element, 10-node: 10-node tetrahedral solid element, 20-node: 20-node “brick” solid element; * E and ν values refer to the material at the end of compaction at its maximum relative density.
Figure 5Comparison of flat- and optimal convex-faced tablets: (a) relative density (RD) distribution, (b) shear stress distribution within the tablets as they eject from the die, and (c) plot of radial pressure vs. compaction pressure (Adapted with permission from Ref. [96]).
Figure 6Microcomputed tomopraphy relative density cross-sections (left column) and correlating simulation cross-sections (right column) of a convex tablet (color contour scales represent relative density values). Reprinted with permission from Ref. [106].
Figure 73D model of circular tablet under compression showing positive and negative tensile stress in the x direction. Reprinted with permission from Ref. [65].
Figure 8x-axial stress distribution in elastic tablets with breaking (“score”) line (Adapted with permission from Ref. [90]).