| Literature DB >> 35334715 |
Mengjiao Qu1, Xuying Chen1, Ke Zhu1, Xishan Guo2,3, Jin Xie1.
Abstract
Piezoelectric micromachined ultrasonic transducers (PMUTs) are a promising alternative to conventional bulk piezoelectric ceramic-based ultrasonic transducers. However, the transmitting sensitivity of the reported PMUTs is far from satisfactory. In this paper, we report a beam-membrane coupled PMUT (BM-PMUT), which enhances the transmitting sensitivity via simultaneously increasing the acoustic emission areas and maintaining the comparable vibration amplitude. Experimental results show that the center and edge transmitting sensitivities of the BM-PMUT are 108.1 and 96 nm/V at 370 kHz, which are 109.9 and 49.6 nm/V at 677 kHz for the traditional PMUT (T-PMUT). Thus, the BM-PMUT realizes piston-like mode shapes and achieves around twofold improvement in the effective acoustic emission area relative to the traditional T-PMUT of the same size. Due to the larger acoustic emission areas and comparable vibration amplitudes, the normalized far-field sound pressure level of the BM-PMUT is 8.5 dB higher than that of the T-PMUT.Entities:
Keywords: MEMS; beam-membrane coupled piezoelectric micromachined ultrasonic transducer (BM-PMUT); transmitting sensitivity; ultrasound
Year: 2022 PMID: 35334715 PMCID: PMC8954873 DOI: 10.3390/mi13030423
Source DB: PubMed Journal: Micromachines (Basel) ISSN: 2072-666X Impact factor: 2.891
Figure 1(a) Schematic of the BM-PMUT. (b) Cross-section structure of A–A’. (c) Optical micrograph of the BM-PMUT. (d) Optical micrograph of the T-PMUT.
Summary of the structure parameters.
| Symbol | Value | Description |
|---|---|---|
| r0 | 190 μm | Cavity radius |
| re | 125 μm | Top electrode radius of T-PMUT |
| rm | 125 μm | Inside membrane radius of BM-PMUT |
| wb | 55 μm | Outside beam width of BM-PMUT |
| wt | 5 μm | Trench width of BM-PMUT |
| wg | 5 μm | Girder width of BM-PMUT |
| hAl | 1 μm | Thickness of top electrode |
| hAlN | 500 nm | Thickness of piezoelectric layer |
| hSi | 10 μm | Thickness of Si structure layer |
| hSiO2 | 200 nm | Thickness of SiO2 insulating layer |
Figure 2Schematic of the equivalent models for (a) T-PMUT and (b) BM-PMUT.
Figure 3Simulated vibration mode shapes of (a) BM-PMUT and (b) T-PMUT. Simulated vibration displacement of (c) center and (d) edge in different structures.
Figure 4(a) Simulated mode shape of the T-PMUT with different radii. (b) Simulated far-field SPL of BM-PMUT and T-PMUT.
Comparison with previous works.
| This Work | Ref. [ | Ref. [ | |
|---|---|---|---|
| Method | Beam-membrane structure | Etching holes | Pinned boundary |
| Optimized objects | Acoustic emission area | Acoustic emission area | Vibration amplitude |
| Improvement in SPL (dB) | 8.5 | 5.3 | 4.65 * |
* Computative results.
Figure 5Detailed fabrication process. (a) Surface of the structure Si doped. (b) Pad oxide layer SiO2 thermally grown and wet-etched. (c) AlN piezoelectric layer sputtered and patterned. (d) Al sputtered and patterned. (e) SOI wafer etched. (f) Polyimide deposited as a protective layer. (g) Backside etching. (h) Polyimide removed.
Figure 6Sampling points on the center and edge selected for (a) BM-PMUT and (b) T-PMUT. Measured resonant frequencies and (c) center and (d) edge displacement of the BM-PMUT and T-PMUT.
Figure 7(a) The vibration amplitude at the resonant frequencies for different driving voltages of T-PMUT and BM-PMUT. (b) The time-domain vibration characteristics at resonant frequencies for T-PMUT and BM-PMUT.