Hadi Arjmandi-Tash1, Grégory F Schneider1. 1. Faculty of Science, Leiden Institute of Chemistry, Leiden University, Einsteinweg 55, 2333CC Leiden, The Netherlands.
Abstract
In chemical vapor deposition of graphene, crossing over the melting temperature of the bulk catalyst is an effective approach to heal the defects and thus improve the crystallinity of the lattice. Here, electromagnetic absorption (the capability of metals to absorb radiated thermal energy) yields a thin skin of liquid metal catalyst at submelting temperatures, allowing the growth of high quality graphene. In fact, a chromium film initially deposited on one side of a copper foil absorbs the thermal energy radiated from a heating stage several times more effectively than a plain copper foil. The resulting migration of the chromium grains to the other side of the foil locally melts the copper, improving the crystalline quality of the growing graphene, confirmed by Raman spectroscopy. The process duration is therefore dramatically minimized, and the crystallinity of the graphene is maximized. Remarkably, the usual annealing step is no more necessary prior to the growth which together with unlocking the direct healing of defects in the growing graphene, will unify growth strategies between a range of catalysts.
In chemical vapor deposition of graphene, crossing over the melting temperature of the bulk catalyst is an effective approach to heal the defects and thus improve the crystallinity of the lattice. Here, electromagnetic absorption (the capability of metals to absorb radiated thermal energy) yields a thin skin of liquid metal catalyst at submelting temperatures, allowing the growth of high quality graphene. In fact, a chromium film initially deposited on one side of a copper foil absorbs the thermal energy radiated from a heating stage several times more effectively than a plain copper foil. The resulting migration of the chromium grains to the other side of the foil locally melts the copper, improving the crystalline quality of the growing graphene, confirmed by Raman spectroscopy. The process duration is therefore dramatically minimized, and the crystallinity of the graphene is maximized. Remarkably, the usual annealing step is no more necessary prior to the growth which together with unlocking the direct healing of defects in the growing graphene, will unify growth strategies between a range of catalysts.
The chemical vapor
deposition (CVD) of graphene is in general performed
in tube oven (= “hot-wall”) chambers[1−5] with the heating element placed outside the chamber.
Symmetrical thermal radiation forms a uniform thermal zone in which
the specimen (e.g., a copper foil) receives a homogeneous heat flux
(= absorbed thermal energy per unit area and time) from surroundings.
The heating in “cold-wall chambers”[6−10] is heterogeneous: the heating stage is placed inside
the chamber which directly heats up the specimen via thermal conduction.
The process involves a large thermal gradient between the stage (normally
at T > 1000 °C) and the walls (normally at T ∼ 100 °C) which eventually provides a nonuniform
heating zone which can potentially lead to random growth. Although
the graphene growth in cold-wall chambers is cost effective, the directional
heating is a major drawback.Mixing (alloying) metals is an
effective approach to combine the
favorable properties of different metals for specific applications.
Particularly, nickel and molybdenum were rationally alloyed to achieve
a self-limited growth of graphene with outstanding reproducibility.[11] In fact, the precipitated carbon species form
strong and stable bonds with molybdenum and are excluded from the
growth to yield strictly single-layer graphene. Separately, monolayer
graphene has been achieved by suppressing multilayer formation via
covering the active sites on cobalt surface by a copper film.[12] The catalytic capability of copper was also
dramatically improved by alloying with nickel;[13] Indeed the nickel-mediated segregation of carbon radicals
in the copper–nickel alloy increases the growth rate by an
order of magnitude over singular copper.Growth of graphene
on liquid catalyst (e.g., copper) is advantageous:[14] Crystalline defects (including grain boundaries)
and the surface roughness, as the potential graphene nucleation sites,
are negligible when the catalyst is in liquid phase favoring monolayer
graphene growth.[15] In a special regime
in the presence of adsorbates on the liquid subphase, though, a complex
flow pattern may generate isolated and distinguished domains/cells
on liquid surface.[16] Formulated by the
Benard–Marangoni effect, this flow pattern is a result of the
solutal or thermal instabilities driven by adsorbate-related variations
in surface tension which eventually would challenge the synthesis
of continuous, uniform graphene.[17] In either
case, however, the mobile catalytic atoms on the liquefied subphase
lower the amount of defects in the graphene crystal lattice (e.g.,
voids) by driving a so-called “defect healing” process
in which pentagonal and heptagonal carbon rings convert to hexagons.[18] Indeed, by using appropriate supporting layers
to prevent the dewetting of the copper foil, epitaxial growth of single-crystal
domains of ∼200 μm has been realized above the melting
temperature of copper.[14]In this
paper, we grow graphene on a bicomponent substrate composed
of copper and chromium, respectfully with outstanding catalytic properties
and electromagnetic absorption. The backside of a copper foil is
initially covered with a thin chromium film which enables the absorption
of thermal energy radiated from the hot plate in a cold-wall chamber,
well beyond the bare copper foil. The chromium film transforms into
hot nanorodes and migrates through the foil to the other side, where
graphene is to be grown. The process includes local melting of the
copper which enables defect healing of the growing graphene. A continuous
high-quality graphene sheet is achieved in only 5 min, nominating
the protocol as one of the shortest ever reported. From the materials
science perspective, we identify an original strategy for mixing materials
which is largely distinct from conventionally known scenarios for
alloying metals.
Experimental Section
Cold-wall chambers has been continuously optimized to grow high
quality graphene. In fact, recent progresses demonstrated that, with
an optimized recipe, a cold-wall chamber is capable of producing graphene
with the quality comparable to that of the conventional hot-wall chamber.[6,10,12,19] For the purpose of this project, however, we have started with an
unsuccessful recipe, including subsequent annealing and growth phases
(detailed in the Methods section in the Supporting Information), and demonstrate that the inclusion of the chromium
to the copper foil considerably improves the outcome via an unprecedented
mechanism. The experiments are done on a copper foil (Alfa Aesar,
99.999% purity, 25 μm thickness) on which a chromium film of
50 nm was initially evaporated. We placed the sample on the hot stage
of a cold-wall CVD setup (nanoCVD-8G, Moorfield Nanotechnology) with
the chromium-deposited side facing the stage (we will refer to this
side as the “bottom side” throughout this paper; see
the schematic in the inset of Figure a). The growth temperature and the annealing duration
were varied at different experiments (explained in the following),
but the growth duration was fixed at 3 min. With an annealing duration
of 7 min at 1035 °C, chromium migrates to the top side where
the graphene grows during the growth phase. Figure a displays the top side of a copper foil
initially and partially covered with a chromium film at the bottom
left side (see the inset schematic). The right side of the sample
(with no chromium film deposited) appears shiny and smooth; the migration
of the chromium film to the top side, however, turns the sample matte
(rough) on the left side. High-resolution atomic force microscopy
(AFM, Figure b also
inset of Figure a)
and scanning electron microscopy (SEM, Figure c and d) show that the diffusion of the chromium
has induced a complex microstructure at the surface of the foil: The
surface has split into a landscape of two phases where a lath structure
with sharp edges pops out from the background layer (Figure b and c). Next, a standard
copper etching solution (ammonium persulfate) is used to dissolve
the background copper while the lath structure is dissolved in a chromium
etcher (Supporting Information). The experiment
implies that copper remains the major constituent of the background
while the lath structure mainly consists of chromium (although a trace
amounts of one element in another is possible).
Figure 1
Graphene grown on a chromium–copper
system. (a) Optical
micrograph of a test sample (2 cm × 1 cm) after the growth of
graphene: the bottom side of the copper foil (facing the heating stage)
was initially covered with a thin (∼100 nm) chromium film (demonstrated
in the inset). During the growth, chromium migrates to and makes the
top surface rough. (b) Representative atomic force micrograph featuring
chromium texture popped out from the copper background on the left
side of the sample in (a). (c, d) Representative low- and high-magnification
scanning electron micrographs of the left side of the sample in (a).
(e) Comparison of the Raman spectroscopy of the graphene grown on
the left (on Cr/Cu) and right (plain Cu) sides of the sample in (a).
Figure 3
Quality of the graphene
as a function of process duration. (a)
Raman spectra of several graphene samples grown with different process
durations, ranging from 3 min to 13 min (annealing duration ranging
from 0 min to 10 min); t* marks the optimum process
duration which provides the lowest D peak (highest crystalline quality).
The inset figures on the left show the surface morphology of the corresponding
samples, mapped by AFM. The color code ranges between 0 nm and 600
nm. (b) Optimum process duration (t*) of different
samples as a function of the growth temperature. Δt* (open rectangular markers) corresponds to the temporal window over
which the graphene quality is the highest. Filled markers correspond
to uncertain regions in between subsequent samplings. (c) Chromium
content as a function of the process duration estimated by X-ray photoelectron
spectroscopy (XPS) at the top surface of the foil.
Graphene grown on a chromium–copper
system. (a) Optical
micrograph of a test sample (2 cm × 1 cm) after the growth of
graphene: the bottom side of the copper foil (facing the heating stage)
was initially covered with a thin (∼100 nm) chromium film (demonstrated
in the inset). During the growth, chromium migrates to and makes the
top surface rough. (b) Representative atomic force micrograph featuring
chromium texture popped out from the copper background on the left
side of the sample in (a). (c, d) Representative low- and high-magnification
scanning electron micrographs of the left side of the sample in (a).
(e) Comparison of the Raman spectroscopy of the graphene grown on
the left (on Cr/Cu) and right (plain Cu) sides of the sample in (a).We characterized the quality of the grown graphene
by means of
Raman spectroscopy (Figure e). In agreement with our earlier publication,[10] the unoptimized growth recipe provides poor-quality
graphene (or even amorphous carbon) on the plain copper. The graphene
grown on the Cu/Cr, however, exhibits standard Raman peaks (G peak
at ∼1580 cm–1 and 2D peak at ∼2680
cm–1) and is of superior crystalline quality, as
evidenced by a negligible D peak (at 1350 cm–1).Figure provides
an in-depth Raman characterization of the sample after the growth
of graphene. The migration of the chromium from the bottom to the
top side is evident in the optical micrograph in Figure a. We identified low-frequency
Raman spectral bands which are sensitive to the chemical constituents
of the substrate. The chromium phase manifests itself as a strong
peak centered at 85 cm–1 and is distinct from the
background copper with a low-amplitude signature at its right shoulder
(inset of Figure a,
and Figure b and c).
Two-dimensional mappings of the Raman characteristic peaks of graphene
are provided in panels (d)–(f). The narrow 2D peak (fwhm <50,
panel d) and large I2D/IG ratio (>1, panel e) are the signatures of monolayer
graphene.[20] The graphene is of pronounced
crystalline quality as evidenced by a negligible ID/IG ratio (panel f). Interestingly,
the properties of the graphene are independent of the local structure
(texture) of the underlying substrate as no correlation between the
mappings in (d, e, f) and (b) is observed. This is important evidence
to explain the migration of the chromium, and the improved quality
of the graphene which will be discussed later.
Figure 2
Raman characterization
of graphene on chromium–copper system.
(a) Optical micrograph of a selected window featuring chromium structures
migrated to the front side of the Cu foil after 10 min of growth (7
min of annealing) at 1035 °C. The inset shows a low-frequency
peak sensitive to the Cr/Cu composition in the Raman spectrum. (b)
Mapping the amplitude of the Raman signal at the narrow band centered
at 100 cm–1 (see the spectrum in (a)). The band
corresponds to the copper background. (c) Mapping the amplitude of
the Raman signal at the narrow band centered at 85 cm–1. The band corresponds to the chromium microstructures. (d) Mapping
the width of the graphene Raman 2D peak (centered at ∼2680
cm–1): The width of the 2D peak hardly exceeds 50
cm–1, manifesting that the graphene is predominantly
monolayer. (e) Mapping the relative intensity of the 2D (I2D) and G (IG, centered at
∼1580 cm–1) peaks: The I2D/IG ratio stays mainly above
one as another indication of monolayer graphene. (f) Mapping the relative
intensity of the D (ID, centered at ∼1350
cm–1) and G peaks: The ID/IG ratio stays close to zero indicating
a negligible amount of crystalline defects.
Raman characterization
of graphene on chromium–copper system.
(a) Optical micrograph of a selected window featuring chromium structures
migrated to the front side of the Cu foil after 10 min of growth (7
min of annealing) at 1035 °C. The inset shows a low-frequency
peak sensitive to the Cr/Cu composition in the Raman spectrum. (b)
Mapping the amplitude of the Raman signal at the narrow band centered
at 100 cm–1 (see the spectrum in (a)). The band
corresponds to the copper background. (c) Mapping the amplitude of
the Raman signal at the narrow band centered at 85 cm–1. The band corresponds to the chromium microstructures. (d) Mapping
the width of the graphene Raman 2D peak (centered at ∼2680
cm–1): The width of the 2D peak hardly exceeds 50
cm–1, manifesting that the graphene is predominantly
monolayer. (e) Mapping the relative intensity of the 2D (I2D) and G (IG, centered at
∼1580 cm–1) peaks: The I2D/IG ratio stays mainly above
one as another indication of monolayer graphene. (f) Mapping the relative
intensity of the D (ID, centered at ∼1350
cm–1) and G peaks: The ID/IG ratio stays close to zero indicating
a negligible amount of crystalline defects.The migration of the chromium from the bottom to the top side of
the copper foil starts during the annealing phase of the growth. Figure a correlates the Raman spectra and the surface morphology
of several samples having gone through a graphene growth cycle at
1035 °C, but with varied annealing durations. The growth duration
(after the annealing) is set to 3 min for all the experiments here.
Annealing durations below 6 min (i.e., the total process duration
of less than 9 min) have negligible effect on the surface corrugations
of the foil and are insufficient to have the chromium migrated to
the top side. Here, the growth process is similar to conventional
approaches with an insufficient (too short) copper annealing phase
leading to a poor graphene quality, manifested by a considerably large-amplitude
D peak. Chromium traces start to appear in the sample with the total
process duration of 10 min (referred to as the optimized process duration, t*). Graphene quality is the highest in a tight “temporal
window” (Δt* ∼ 1 min at 1035
°C) close to t*. Longer process (annealing)
durations, however, degrade the graphene.Quality of the graphene
as a function of process duration. (a)
Raman spectra of several graphene samples grown with different process
durations, ranging from 3 min to 13 min (annealing duration ranging
from 0 min to 10 min); t* marks the optimum process
duration which provides the lowest D peak (highest crystalline quality).
The inset figures on the left show the surface morphology of the corresponding
samples, mapped by AFM. The color code ranges between 0 nm and 600
nm. (b) Optimum process duration (t*) of different
samples as a function of the growth temperature. Δt* (open rectangular markers) corresponds to the temporal window over
which the graphene quality is the highest. Filled markers correspond
to uncertain regions in between subsequent samplings. (c) Chromium
content as a function of the process duration estimated by X-ray photoelectron
spectroscopy (XPS) at the top surface of the foil.The optimized process duration depends on how fast chromium
migrates
to the top side of the copper foil which itself is a strong function
of the process temperature. Figure b plots t* at various growth temperatures,
depicting a linear correlation between 1005 °C and 1045 °C.
Interestingly, while a minimum total process duration of t* > 20 min (with Δt* = 6 min) minimizes
the
crystalline defects at 1005 °C, the process could be as short
as 5 min (2 min of annealing followed by 3 min of the growth) to achieve
a decent graphene quality at 1045 °C. The allowed temporal window
is tighter at elevated temperatures. Increasing the growth temperature
above 1045 °C does not affect t* and Δt* considerably. The minimum growth duration of 5 min is
one of the shortest ever reported to achieve a continuous graphene
layer.[12]Two unexpected observations
were identified in this work, namely,
(a) the migration of the chromium from the back to the front side
of the copper foil and (b) the improved quality of the graphene in
the presence of the chromium. The rest of this paper seeks appropriate
mechanisms to explain these observations. Few mechanisms might be
considered to explain the chromium migration: (i) Mixing of the chromium
and copper to form a conventional binary alloy is a potential scenario.
The operation temperature of the CVD setup, however, remains below
the solidus line in the chromium–copper phase diagram (1076
°C[21]), illustrating that the conventional
alloying process, including mixing of molten components, is irrelevant
here. (ii) Random thermal motion of the materials, formulated by the
Fick’s law of diffusion[22] (including
grain boundary and lattice diffusion[23]),
on the other hand, should be independent of the placement of the sample
with respect to the heating stage and would eventually result in a
uniform concentration across the foil. The chromium film in our experiments,
however, migrates through the copper solely when it initially faces
the heating stage and is specific to cold-wall chambers: Indeed similar
thermal processes with flipped samples (chromium film initially facing
up) or inside a tube-oven chamber (instead of a cold-wall chamber)
did not cause the migration of the chromium (Supporting Information). X-ray photoelectron spectroscopy (XPS) analysis
of the samples, furthermore, revealed that the concentration of the
chromium in the top side of the foil exceeds 40% right after t* (Figure c); in fact, the governing mechanism in our system shifts a high
concentrated chromium region from one side to the other side of the
foil. (iii) Thermal diffusion of solids in which a temperature gradient
energizes a material of a certain thermodiffusion coefficient to diffuse,
might explain the directionality of the observation: in contrast to
the tube-oven chambers which provide a uniform heating zone, there
is a large thermal gradient between the heating stage (T > 1000 °C) and the walls (∼100 °C) in cold-wall
reaction chambers. A naive hypothesis may consider that the foil “feels”
this thermal gradient, causing the chromium atoms to diffuse from
the hotter side (facing the heater) to the colder side (facing the
cold wall, in contact with the fresh operation gases) of the copper
foil, but not in the reverse direction. Our finite element simulations,
however, rules out this scenario, as the high thermal conductivity
of copper results in a negligible temperature gradient between its
faces (Supporting Information).The
observation of improving graphene quality in the presence of
the chromium is also unprecedented. Basic scenarios including chromium
assisting to scavenge oxygen from possible leaks in the system are
irrelevant as in the same setup, the growth of graphene with decent
quality on bare copper foil (no chromium) is possible, albeit with
some structural modifications.[10] Separately,
no catalytic property of chromium in the CVD of graphene has been
reported so far; instead chromium has been used to block the graphene
growth on copper foil[24] to achieve patterned
graphene. Furthermore, the degradation of the graphene quality after t* (Figure a) with saturated chromium density (Figure c) rules out any possible cocatalytic activity
of chromium (as was reported for the CVD of carbon nanotubes[25]).Any successful scenario explaining our
observations has to be built
up based on two important facts. First, at the elevated operation
temperature, the heating stage acts as a (semi-) blackbody radiator,
emitting electromagnetic waves in the near-infrared spectrum (inset Figure a). Copper is a reflective
material in this spectral range, exhibiting a negligible electromagnetic
absorption of 7% at elevated temperatures.[26] Chromium, however, exhibits an electromagnetic absorption of ∼40%.[27] In other words, while uncoated copper reflects
back some 93% of incoming radiation, chromium coating dramatically
improves radiative heat transfer by almost 6 folds. Thermal conduction
remains a parallel heat transfer mechanism yet. We modeled the heat
flow inside the oven considering thermal convection (by the process
gases) and radiation to the cold walls (Figure a; see the Supporting Information for the details of modeling). Interestingly, by
powering up the heater, the temperature of the uncoated copper foil
falls below that of the stage by ∼100 °C. Note that the
quality of chemically synthesized graphene is highly sensitive to
the reaction temperature as insufficient heating fails to provide
the necessary activation energy to decompose the precursors.[28] Indeed this temperature difference between the
foil and the stage explains the typically seen poor quality of graphene
in cold-wall chambers.[3,10] The improved thermal energy absorption,
however, drives the chromium-coated copper foil to follow the temperature
of the heating stage closely. The higher “effective”
growth temperature, however, is not the solitary origin of the increased
graphene quality on the chromium-coated copper foil.
Figure 4
Potential scenario explaining
the migration of the chromium accompanied
by improved graphene quality. (a) Simulation of the temperature of
the heating stage, chromium-coated and plain copper foil upon powering
up the resistive heater. Inset: blackbody radiation spectrum at 1035
°C, formulated by Planck’s equation.[34] (b) Optical micrograph focusing at the border of the Cr/Cu
and plain Cu sides after 10 min of the growth process at 1035 °C.
A groove appears and splits the two sides, marked by white arrows.
(c) Representative surface profiles over the Cr/Cu (corresponding
to the dashed line in Figure b) and plain Cu sides; horizontal axis shows the distance
on the samples over which that AFM data is measured. (d) Our proposed
mechanism explaining the migration of the chromium from the bottom
to the top sides of the copper foil: The chromium film absorbs electromagnetic
energy radiated by the hot stage at the elevated temperatures and
partially melts the neighboring layers of the copper foil. The chromium
film moves up through the molten copper; with an appropriate timing,
the growth of the graphene occurs on the molten copper layers, with
an improved crystalline quality.
Potential scenario explaining
the migration of the chromium accompanied
by improved graphene quality. (a) Simulation of the temperature of
the heating stage, chromium-coated and plain copper foil upon powering
up the resistive heater. Inset: blackbody radiation spectrum at 1035
°C, formulated by Planck’s equation.[34] (b) Optical micrograph focusing at the border of the Cr/Cu
and plain Cu sides after 10 min of the growth process at 1035 °C.
A groove appears and splits the two sides, marked by white arrows.
(c) Representative surface profiles over the Cr/Cu (corresponding
to the dashed line in Figure b) and plain Cu sides; horizontal axis shows the distance
on the samples over which that AFM data is measured. (d) Our proposed
mechanism explaining the migration of the chromium from the bottom
to the top sides of the copper foil: The chromium film absorbs electromagnetic
energy radiated by the hot stage at the elevated temperatures and
partially melts the neighboring layers of the copper foil. The chromium
film moves up through the molten copper; with an appropriate timing,
the growth of the graphene occurs on the molten copper layers, with
an improved crystalline quality.As another important fact, two observations demonstrate that the
migration of the chromium is accompanied by the local melting of the
copper foil. Generation of grooves between the Cr/Cu and plain Cu
sides (Figure b) is
the first evidence, which could be explained by considering a molten
phase in contact with the solid copper phase during the operation:
indeed the transformation of the melt (lower density, thus higher
volume) to solid (higher density, thus lower volume) during the cool
down period comes with a shrinkage in the volume, causing a groove.[29] It is worth noting that similar grooves are
typically seen at the melt/mold interface after solidifying a molten
metal in casting processes.[30] The second
evidence appears by comparing the morphology of the foils with and
without chromium (Figure c): The plain copper side features gradual undulations of
the surface which is a result of the specific fabrication process
of the foil.[31] Migrated chromium, on the
other hand, forms evident mesas of ∼80 nm amplitude. Interestingly,
the surface of the copper between the chromium mesas has been flattened,
which would be possible only after a melting process.Chromium-assisted
melting of copper is the major cause of the improvement
in graphene crystalline quality in our experiments: In fact the higher
mobility and longer surface-diffusion range of the molten copper atoms
drive a “defect healing” process in which the structural
defects (e.g., pentagons and heptagons) transform into perfect hexagonal
rings, as observed by quantum-chemical molecular dynamics simulations.[18] The effect would be amplified by the improved
diffusive mobility of the carbon species on the surface. Experimentally,
defect-free graphene achieved by CVD has already been demonstrated
on molten copper foils.[14,15,32]We now propose a potential mechanism to explain our observations:
Chromium deposited on the bottom side of the copper absorbs electromagnetic
radiation, well beyond the plain copper, and starts melting neighboring
layers of the copper foil (Figure d, left). Melting the copper opens up pathways for
the migration of chromium species to the top surface (Figure d, middle). With optimized
timing, the growth of graphene would start when a thin layer on the
surface of the copper foil is in the molten state but chromium has
not reached the surface yet (Figure d, right). In this case, the chromium reaches the top
surface close to the end of the growth process and thus the local
quality of graphene (e.g., Raman signatures) is independent of the
features on the foil (refer to the discussion in Figure ). In a delayed process (t* > 10 min in Figure a), however, the presence of the noncatalyst chromium
on the surface degrades the graphene quality. The rate of advancing
the chromium front scales inversely with the temperature, explaining
the longer t* and Δt* measured
at lower temperatures (Figure b).We note that the improved radiation absorption by
the chromium
cannot directly cause the melting of the copper foil as the temperature
of the heating stage remains below the melting point of copper. In
particular, we noticed the migration of the chromium at temperatures
as low as 870 °C (∼200 °C below the melting point
of copper). The surface melting phenomenon[18,29] in which a thin layer (typically of few nanometer thickness) at
the surface melts below the melting point of the bulk is an important
consideration. In fact, the reduced coordination degree of surface
atoms is behind this advanced melting: Expressed by the Lindemann
criterion,[33] cohesive energy associated
with the bonding between the atoms in a crystalline state determines
the melting temperature of a solid. This energy is lower for the atoms
close to the surface, as a result of the fewer bonds they can make
with neighboring atoms, causing a lowered melting temperature. Note
that a reduction of 25% in the melting temperature (compared to bulk
melting temperature) has been observed at the surface of a lead specimen.[29] The same phenomenon could occur at the Cu/Cr
interface in this work, though in the absence of a robust experimental/theoretical
demonstration, this scenario yet remains a potential hypothesis.
Conclusions
We introduce an unprecedented approach in the chemical vapor deposition
of graphene in which the migration of a chromium film—initially
deposited on the back side of a copper foil—to the front side
causes the local melting of the foil and eventually improves the quality
of the growing graphene. A continuous graphene sheet now is grown
in less than 5 min, as in the presence of the molten phase, the thermal
annealing step in conventional CVD recipes is no longer required.
We investigate the mechanism driving the chromium species through
the copper. Our report introduces the electromagnetic absorption as
an efficient knob in the scalable CVD growth of high-quality graphene.
The findings in this report promote the science of metal mixing.
Authors: A C Ferrari; J C Meyer; V Scardaci; C Casiraghi; M Lazzeri; F Mauri; S Piscanec; D Jiang; K S Novoselov; S Roth; A K Geim Journal: Phys Rev Lett Date: 2006-10-30 Impact factor: 9.161