| Literature DB >> 34960938 |
Zhaoliang Xing1,2, Wenhan Chen3, Zhihui Li2, Naifan Xue2, Fei Li1, Xiying Dai1, Shaowei Guo1, Huize Cui1.
Abstract
Polyimide (PI) can be used as a cladding insulation for high frequency power transformers, and along-side discharge can lead to insulation failure, so material modification techniques are used. In this paper, different doped nano-SiO2 are introduced into polyimide for nanocomposite modification. The results of testing the life time of high-frequency electrical stress along-side discharge show that the 10% SiO2 doping has the longest life time. The results show that: for composites prone to corona, their flashover causes more damage, and both positive half-cycle and polarity reversal discharges are more violent; compared to pure PI, the positive half-cycle and overall discharge amplitude and number of modified films are smaller, but the negative half-cycle is larger; at creeping development stages, the number of discharges is smaller, and the discharge amplitude of both films fluctuates in the mid-term, with the modified films having fewer discharges and the PI films discharging more violently in the later stages. The increase in the intensity of the discharge was greater in the later stages, and the amplitude and number of discharges were much higher than those of the modified film, which led to a rapid breakdown of the pure polyimide film. Further research found that resistivity plays an important role in the structural properties of the material in the middle and late stages, light energy absorption in the modified film plays an important role, the distribution of traps also affects the discharge process, and in the late stages of the discharge, the heating of the material itself has a greater impact on the breakdown, so the pure polyimide film as a whole discharges more severely and has the shortest life.Entities:
Keywords: creeping development; high-frequency electrical stress; life time; nano-SiO2; polyimide
Year: 2021 PMID: 34960938 PMCID: PMC8705656 DOI: 10.3390/polym13244387
Source DB: PubMed Journal: Polymers (Basel) ISSN: 2073-4360 Impact factor: 4.329
Chemical reagents for preparation of Polyimide films.
| Name | Purity | Supplier |
|---|---|---|
| Pyromellitic dianhydride | 99% | Shanghai Macklin Biochemical Co., Ltd., Shanghai, China |
| 4,4′-Diaminodiphenyl ether | 98% | Shanghai Macklin Biochemical Co., Ltd., Shanghai, China |
| 4,4′-thiobisbenzenamine | 99% | Jiangxi Renming Pharmaceutical Chemical Co., Ltd., Jiangxi, China |
| N,N-Dimethylacetamide | 99% | Sinopharm Chemical Reagent Co., Ltd., Shanghai, China |
Figure 1High frequency creeping discharge platform.
Statistical life of creeping discharge.
| Type | Si0 | Si2 | Si4 | Si6 | Si8 | Si10 |
|---|---|---|---|---|---|---|
| Life/min | 23.12 | 42.40 | 45.40 | 53.50 | 69.11 | 78.11 |
Figure 2Ultraviolet-Visible Spectroscopy.
Figure 3Surface morphology before electrical aging. (a) Si0. (b) Si10.
Figure 4Surface morphology after electrical aging.
Figure 5(a–f) The scatter plots for different discharge time of Si10 film.
Figure 6Surface discharge spectrum. (a) The creeping discharge spectra of the Si0. (b) The creeping discharge spectra of the Si10.
Quantitative statistics of creeping discharge.
| Type | Si0 | Si10 | |
|---|---|---|---|
| Average | Overall | 0.399 | 0.354 |
| discharge | Positive half week | 0.407 | 0.359 |
| amplitude | Negative half week | 0.288 | 0.302 |
| Average | Overall | 267.67 | 216.35 |
| discharge | Positive half week | 249.59 | 197.35 |
| times | Negative half week | 18.08 | 19 |
Figure 7The discharge amplitude of Si0 at different stages.
Figure 8The discharge amplitude of Si10 at different stages.
Figure 9Average discharge times at different stages.
The volume resistivity and surface resistivity.
| Type | Si0 | Si10 |
|---|---|---|
| volume resistivity (1013 Ω/m) | 7.838 | 6.554 |
| surface resistivity (1010 Ω/m) | 2.613 | 2.5 |
Figure 10Relative dielectric constant.
Figure 11Dielectric loss tangent.