| Literature DB >> 34902068 |
Xuan Yang1, Yuping Duan2, Shuqing Li3, Huifang Pang1, Lingxi Huang1, Yuanyuan Fu1, Tongmin Wang4.
Abstract
High-temperature electromagnetic (EM) protection materials integrated of multiple EM protection mechanisms and functions are regarded as desirable candidates for solving EM interference over a wide temperature range. In this work, a novel microwave modulator is fabricated by introducing carbonyl iron particles (CIP)/resin into channels of carbonized wood (C-wood). Innovatively, the spaced arrangement of two microwave absorbents not only achieves a synergistic enhancement of magnetic and dielectric losses, but also breaks the translational invariance of EM characteristics in the horizontal direction to obtain multiple phase discontinuities in the frequency range of 8.2-18.0 GHz achieving modulation of reflected wave radiation direction. Accordingly, CIP/C-wood microwave modulator demonstrates the maximum effective bandwidth of 5.2 GHz and the maximum EM protection efficiency over 97% with a thickness of only 1.5 mm in the temperature range 298-673 K. Besides, CIP/C-wood microwave modulator shows stable and low thermal conductivities, as well as monotonic electrical conductivity-temperature characteristics, therefore it can also achieve thermal infrared stealth and working temperature monitoring in wide temperature ranges. This work provides an inspiration for the design of high-temperature EM protection materials with multiple EM protection mechanisms and functions.Entities:
Keywords: Carbonized wood; Electromagnetic protection; High temperatures; Microwave modulator; Temperature monitoring
Year: 2021 PMID: 34902068 PMCID: PMC8669058 DOI: 10.1007/s40820-021-00776-3
Source DB: PubMed Journal: Nanomicro Lett ISSN: 2150-5551
Fig. 1a Digital images for elytra color varying with environmental humidity. b A schematic of elytra structure. c SEM image of epicuticle. d SEM image of spongy layer. e SEM image of endocuticle. f Schematic diagram for humidity changing the path of light transmission in elytra
Fig. 2a Schematic of the preparation of CIP/C-wood. b Cross-sectional SEM image of original wood (basswood). c Cross-sectional SEM image of C-wood. d SEM image of original wood in the longitudinal direction. e SEM image of C-wood in the longitudinal direction. The inset is a scattering pattern of transmitted laser through C-wood. f Cross-sectional SEM image of CIP/C-wood. g SEM image of CIP/C-wood in the longitudinal direction. h Elemental mappings of CIP/C-wood. i A digital image of CIP/C-wood. j Schematic of CIP/C-wood microwave modulator. k Schematic of point-to-point repair
Fig. 3a Reflection loss of CIP/C-wood at different temperatures. b Comparison of thickness and effective bandwidth to those of previously reported high-temperature microwave absorbing materials. c Effective bandwidth and maximum EM protection efficiency (MEPE) of C-wood, CIP/C-wood without spatial configuration and CIP/C-wood. d EMW volume loss density of C-wood. e EMW volume loss density of structure template for CIP/C-wood. f EMW volume loss density of CIP/resin. g 3D far-field radiation map of C-wood. h 3D far-field radiation map of CIP/C-wood. i Phase diagram of C-wood. j Phase diagram of CIP/C-wood
Fig. 4a Thermal conductivity of CIP/C-wood microwave modulator at different temperatures. a1 Thermal infrared image of CIP/C-wood microwave modulator in low-temperature environment. a2–a4 Thermal infrared images of CIP/C-wood microwave modulator in high-temperature environments. b Electrical conductivity of CIP/C-wood microwave modulator at different temperatures. c CIP/C-wood as a temperature sensor for monitoring operating temperatures and over-temperature alarm