| Literature DB >> 34871911 |
Taisuke Nozawa1, Keiichi Nakagawa2.
Abstract
Ultrasonic electroplating has gained attention owing to various advantages such as the promotion of mass transport to the substrate surface, improvement of the surface properties of the film, and improvement of limiting current density. However, no studies have clarified the mechanism in diffusion layer agitation caused by cavitation during ultrasonic electroplating. Here, we investigate the main factor of agitation by using a high-speed imaging technique to capture the agitation effect of shock waves and microjets generated from laser-induced cavitation on the diffusion layer of electroplating. The physical parameters of the agitation were characterized using image analysis and a micro-pressure gauge. The results revealed that only microjets affected the agitation phenomenon. The flow velocity was 21 m/s, and the water hammer pressure was low, at least below 0.05 MPa. Our results suggest that the flow velocity, and not the water hammer pressure, plays an important role in the agitation phenomenon on the substrate surface by cavitation.Entities:
Year: 2021 PMID: 34871911 PMCID: PMC8649890 DOI: 10.1016/j.ultsonch.2021.105856
Source DB: PubMed Journal: Ultrason Sonochem ISSN: 1350-4177 Impact factor: 7.491
Fig. 1Schematic of imaging system (a)Overall view of imaging system (b)Side view of focusing lane (red box of (a)) (c)Inside the EC cell (blue box of (a)). (For interpretation of the references to colour in this figure legend, the reader is referred to the web version of this article.)
Fig. 2(a) (b) Difference in behavior depending on cavitation generation location (a) 1,000 µm from substrate surface (γ = 6.25) (b) 250 µm from substrate surface (γ = 2.11) (c) Position of the microjet tip.
Fig. 3Effect of shock wave and microjet on agitation of diffuse layer (a) 700 µm from substrate surface (γ = 2.75) (b) 230 µm from substrate surface (γ = 1.18). (c) Images of shock wave and microjet acting on the probe tip and the pressure measured during the process. (γ = 1.29).