Literature DB >> 34859580

Designable Integration of Silicide Nanowire Springs as Ultra-Compact and Stretchable Electronic Interconnections.

Rongrong Yuan1, Wentao Qian1, Zongguang Liu1, Junzhuan Wang1, Jun Xu1, Kunji Chen1, Linwei Yu1.   

Abstract

Stretchable electronics are finding widespread applications in bio-sensing, skin-mimetic electronics, and flexible displays, where high-density integration of elastic and durable interconnections is a key capability. Instead of forming a randomly crossed nanowire (NW) network, here, a large-scale and precise integration of highly conductive nickel silicide nanospring (SiNix -NS) arrays are demonstrated, which are fabricated out of an in-plane solid-liquid-solid guided growth of planar Si nanowires (SiNWs), and subsequent alloy-forming process that boosts the channel conductivity over 4 orders of magnitude (to 2 × 104 S cm-1 ). Thanks to the narrow diameter of the serpentine SiNix -NS channels, the elastic geometry engineering can be accomplished within a very short interconnection distance (down to ≈3 µm), which is crucial for integrating high-density displays or logic units in a rigid-island and elastic-interconnection configuration. Deployed over soft polydimethylsiloxane thin film substrate, the SiNix -NS array demonstrates an excellent stretchability that can sustain up to 50% stretching and for 10 000 cycles (at 15%). This approach paves the way to integrate high-density inorganic electronics and interconnections for high-performance health monitoring, displays, and on-skin electronic applications, based on the mature and rather reliable Si thin film technology.
© 2021 Wiley-VCH GmbH.

Entities:  

Keywords:  high-density integration; inorganic stretchable interconnections; silicide nanowires; silicon nanosprings

Mesh:

Year:  2021        PMID: 34859580     DOI: 10.1002/smll.202104690

Source DB:  PubMed          Journal:  Small        ISSN: 1613-6810            Impact factor:   13.281


  1 in total

1.  Highly Stretchable High-Performance Silicon Nanowire Field Effect Transistors Integrated on Elastomer Substrates.

Authors:  Xiaopan Song; Ting Zhang; Lei Wu; Ruijin Hu; Wentao Qian; Zongguang Liu; Junzhuan Wang; Yi Shi; Jun Xu; Kunji Chen; Linwei Yu
Journal:  Adv Sci (Weinh)       Date:  2022-01-29       Impact factor: 16.806

  1 in total

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