| Literature DB >> 34513638 |
Hee Kyeong Oh1, Dong Hoon Shin1.
Abstract
OBJECTIVES: This study aimed to evaluate the effect of the application method of universal adhesives on the shear bond strength (SBS) of repaired composites, applied with different thicknesses.Entities:
Keywords: Composite repair; Curing; Multi-layer; Shear bond strength; Universal adhesive
Year: 2021 PMID: 34513638 PMCID: PMC8411008 DOI: 10.5395/rde.2021.46.e32
Source DB: PubMed Journal: Restor Dent Endod ISSN: 2234-7658
Materials used in this study
| Materials | Type of material | Component | Manufacturer |
|---|---|---|---|
| SU | Universal adhesive | 10-MDP, dimethacrylate resins, Vitrebond copolymer, HEMA, filler, ethanol, water, initiators, silane | 3M ESPE, St. Paul, MN, USA |
| PB | Universal adhesive | Phosphoric acid-modified acrylic resin, multifunctional acrylate, acid acrylate, bifunctional acrylate, isopranolol, water, initiators, stabilisators | Dentsply Caulk, Milford, DE, USA |
| Selection-K Etchant | Etchant | 37% phosphoric acid viscous gel, thickener | Shinhung, Seoul, Korea |
| Filtek Z350 XT Universal Restorative | Resin composite | bis-GMA, UDMA, TEGDMA, bis-EMA, PEDGMA, non-aggregated 4 to 10 nm zirconia, non-aggregated 20 nm silica and aggregated zirconia/silica cluster filler (63.3 vol%) | 3M ESPE, St. Paul, MN, USA |
SU, Single Bond Universal; PB, Prime&Bond Universal; 10-MDP, 10-methacryloyloxydecyl dihydrogen phosphate; bis-GMA, bisphenol A-glycidyl methacrylate; UDMA, urethane dimethacrylate; TEGDMA, triethylene glycol dimethacrylate; bis-EMA, ethoxylated bisphenol-A dimethacrylate; PEGDMA, poly(ethylene glycol) dimethacrylate; HEMA, 2-hydroxyethyl methacrylate.
General application protocol for direct resin restorations
| Adhesives | Application protocol |
|---|---|
| SU | 1. Apply SU to the prepared tooth and rub it for 20 sec. |
| 2. Gently air dry the adhesive for 5 sec to evaporate the solvent. | |
| 3. Light cure for 10 sec. | |
| PB | 1. Apply PB to all cavity surfaces. Avoid pooling. |
| 2. Keep PB slightly agitated for 20 sec. | |
| 3. Evaporate solvent with air for at least 5 sec. | |
| 4. Light cure for 10 sec. |
SU, Single Bond Universal; PB, Prime&Bond Universal.
Figure 1Experimental design of this study.
Figure 2Schematic representation of the shear bond strength test.
Shear bond strength values (MPa)
| Application methods | Code | Adhesive | |
|---|---|---|---|
| SU | PB | ||
| 1 coat + uncuring | UC | 9.14 ± 3.94a | 6.40 ± 1.64b |
| 1 coat + curing | 1C | 10.03 ± 2.96a | 8.05 ± 1.80b |
| 3 coats + curing | 3C | 10.12 ± 3.48a | 7.67 ± 3.43b |
| 9.76 ± 3.42a | 7.37 ± 2.47b | ||
Values are presented as mean ± SD. The p < 0.05 was considered statistically significant.
SU, Single Bond Universal; PB, Prime&Bond Universal; SD, standard deviation.
Values followed by the same letter were not significantly different.
Failure mode analysis
| Adhesives | Group | Code | Type of fracture | ||
|---|---|---|---|---|---|
| A | M | C | |||
| SU | 1 coat + uncuring | UC | 2 | 5 | 6 |
| 1 coat + curing | 1C | 0 | 1 | 12 | |
| 3 coats + curing | 3C | 0 | 2 | 11 | |
| PB | 1 coat + uncuring | UC | 3 | 3 | 7 |
| 1 coat + curing | 1C | 0 | 4 | 9 | |
| 3 coats + curing | 3C | 1 | 4 | 8 | |
SU, Single Bond Universal; PB, Prime&Bond Universal; A, adhesive fracture; M, mixed fracture; C, cohesive fracture (in old composite substrate).
Figure 3Scanning electron microscopy images of bonding interface obtained by application of Single Bond Universal (SU): (A) SU-UC, 1 coat + uncuring; (B) SU-1C, 1 coat + curing; (C) SU-3C, 3 coats + curing (×5,000).
WD, working distance; EHT, electron high tension.
Figure 4Scanning electron microscopy images of bonding interface obtained by application of Prime&Bond Universal (PB): (A) PB-UC, 1 coat + uncuring; (B) PB-1C, 1 coat + curing; (C) PB-3C, 3 coats + curing (×5,000).
WD, working distance; EHT, electron high tension.
Thickness of adhesive layer (μm)
| Adhesives | Method of application | ||
|---|---|---|---|
| UC | 1C | 3C | |
| SU | Not measurable | 4.28 | 12.87 |
| PB | Not measurable | 2.47 | 7.30 |
SU, Single Bond Universal; PB, Prime&Bond Universal; UC, 1 coat + uncuring; 1C, 1 coat + curing; 3C, 3 coats + curing.