| Literature DB >> 34286280 |
Long Zhou1, Jie Su1, Zhenhua Lin1, Xing Guo1, Jing Ma1, Tao Li2, Jincheng Zhang1,3, Jingjing Chang1,3, Yue Hao1,3.
Abstract
Large-size organic halide passivation has been considered an efficient approach to enhance the perovskite solar cell (PSC) efficiency and stability. Herein, a facile posttreatment strategy was demonstrated, wherein trifluoromethyl-phenethylamine hydrobromide (CF3-PEABr) is firstly used to passivate the perovskite film surface. The CF3-PEABr surface posttreatment could coordinate with halide dangling bonds that exist at the perovskite crystal surface. Moreover, the surface treatment with CF3-PEABr could efficiently passivate the defects in the perovskite film and suppress the nonradiative carrier recombination. As a result, a high efficiency of 21.3% is obtained, and an increment of 80 mV in V oc (a large V oc of 1.15 V, with a 0.42 V voltage deficit) occurs, compared to the control device. To relieve the hydrophobic nature properties of the -CF3 functional group and the dewetting problem of PCBM layer deposition, a surfactant Triton X-100 is used to modify the PCBM layer. Furthermore, the devices with CF3-PEABr posttreatment exhibit better operational, thermal (85°C), and long storage stabilities without any encapsulation.Entities:
Year: 2021 PMID: 34286280 PMCID: PMC8261667 DOI: 10.34133/2021/9836752
Source DB: PubMed Journal: Research (Wash D C) ISSN: 2639-5274
Figure 1Perovskite material characterization and passivation schematic. (a) XRD spectra of conventional and CF3-PEABr-treated perovskite films. (b) Absorption spectra of conventional and CF3-PEABr-treated perovskite films. (c, d) SEM images of conventional and CF3-PEABr-treated perovskite films. Inset shows the water contact angle images. (e) Schematic model of the perovskite solar cell with CF3-PEABr passivation. (f, g) XPS curves of perovskite films with or without CF3-PEABr passivation.
Figure 2DFT calculation for CF3-PEABr passivation. (a–c) Density of states and charge density difference of the CF3-PEABr-passivated MAI surface with (a) Ii and (b) VI and the (c) PbI surface with VPb. (d) Formation energies of Ii, VI, and VPb at the perovskite surface. (e) The diffusion energy curves of iodide ion in the MAI surface with and without CF3-PEABr passivation, where the migration energy is marked by the arrows. The inserts are the diffusion paths in the perovskite.
Figure 3Carrier dynamics for perovskite films. (a) PL and (b) TRPL spectra of perovskite films with or without CF3-PEABr treatment. (c) PL and (d) TRPL spectra of perovskite films with PCBM or PCBM (Triton X-100) layers.
Figure 4Device performance of PSCs for different conditions. (a) J-V curves of perovskite devices with different conditions. (b) Hysteresis behaviors of perovskite devices based on perovskite (CF3-PEABr)/PCBM (Triton X-100). (c) Distribution of device performance with different conditions. P/P: perovskite/PCBM; P/PT: perovskite/PCBM (Triton X-100); PC/PT: perovskite (CF3-PEABr)/PCBM (Triton X-100). (d) Steady-state output of current density and PCE at the maximum power point.
Average device performance parameters for perovskite solar cells with different modifications. The average PCE data were calculated from at least 36 devices.
| Condition |
|
| FF (%) | PCE (%) (best device) |
|
|
|---|---|---|---|---|---|---|
| Perovskite/PCBM | 1.07 ± 0.04 | 22.2 ± 0.6 | 76.5 ± 3.2 | 18.5 (19.6) | 3.13 | 1.51 |
| Perovskite/PCBM (Triton X-100) | 1.11 ± 0.02 | 23.3 ± 0.5 | 80.7 ± 2.5 | 21.0 (21.5) | 2.68 | 3.45 |
| Perovskite (CF3-PEABr)/PCBM (Triton X-100) | 1.15 ± 0.02 | 22.7 ± 0.3 | 81.4 ± 2.8 | 21.3 (21.9) | 2.94 | 2.78 |
Figure 5Device-level characterization for different conditions. (a) Transient photocurrent and (b) transient photovoltage measurements of the conventional device and the device with Triton X-100. (c) Voc as a function of light intensity. (d) EIS of the devices with or without CF3-PEABr treatment. (e) I-V curves for electron-only devices. (f) tDOS curves of perovskite solar cells with or without CF3-PEABr passivation.
Figure 6Film and device stability for different conditions. (a) Operational stability of the device with epoxy encapsulation. (b) Continuous heating at 85°C in ambient air. (c) Moisture stability under RH ~ 35% condition.