Enhancement of conductive drying of sewage sludge with mechanical compression: Drying kinetics, and interfacial heat transfer behavior.

Improving sludge drying efficiency is of tremendous importance for public health, subsequent treatment, and comprehensive utilization. The interfacial thermal resistance between sludge and hot wall greatly limits the conductive drying performance. This study employed mechanical compression to decrease the interfacial thermal resistance. The drying kinetics and interfacial heat transfer behavior were investigated at mechanical loads of 25 to 200 kPa, temperatures of 120 to 210 °C, and sludge thicknesses of 1.0 to 3.0 mm, and were compared to those in the conventional drying process without mechanical load. The increase of temperature and mechanical load and the decrease of thickness improved drying rates. The drying experienced one warm-up period and two falling rate periods. The breakthrough of interfacial vapor film was responsible for the rapid rise in drying rates initially. At the thickness of 3.0 mm, 210 °C, and 100 kPa, the effective moisture diffusivity was increased by 2.5 times, and the apparent activation energy was reduced by 34% compared to the traditional process in the first falling rate period, implying that mechanical compression facilitated moisture migration and bound water desorption. The effective moisture diffusivity in the first falling rate period was increased by 35% compared to the diffusivity in the second falling rate period because of the pressure-driven flow. The decrease in drying rates was due to the transformation from the pressure-driven flow to vapor diffusion-limited flow in the first falling rate period. Additionally, this study provided essential information on developing a new sludge treatment method and establishing the drying model.