| Literature DB >> 34072789 |
Jiquan Li1,2, Jie Bei1, Wenyong Liu1, Xinxin Xia1, Bida Zhou1, Xiang Peng1,2, Shaofei Jiang1,2.
Abstract
Warpage is a typical defect for injection-molded parts, especially for crystalline parts molded by rapid heat cycle molding (RHCM). In this paper, a prediction method is proposed for predicting the warpage of crystalline parts molded by the RHCM process. Multi-layer models were established to predict warpage with the same thicknesses as the skin-core structures in the molded parts. Warpages were defined as the deformations calculated by the multi-layer models. The deformations were solved using the classical laminated plate theory by Abaqus. A model was introduced to describe the elastic modulus with the influence of temperature and crystallinity. The simulation process was divided into two procedures, before ejection and after ejection. Thermal stresses and thermal strains were simulated, respectively, in the procedure before ejection and after ejection. The prediction results were compared with the experimental results, which showed that the average errors between predicted warpage and average experimental warpage are, respectively, 7.0%, 3.5%, and 4.4% in conventional injection molding (CIM), in RHCM under a 60 °C heating mold (RHCM60), and in RHCM under a 90 °C heating mold (RHCM90).Entities:
Keywords: crystallinity; multi-layer structure; prediction; simulation; warpage
Year: 2021 PMID: 34072789 PMCID: PMC8198935 DOI: 10.3390/polym13111814
Source DB: PubMed Journal: Polymers (Basel) ISSN: 2073-4360 Impact factor: 4.329
Figure 1The RHCM process.
Figure 2Shape and dimensions of the experimental part.
Figure 3Experimental sample.
Figure 4The multi-layer model with five layers.
Figure 5Polarized micrographs of parts under different processes.
The thickness of each layer under different processes.
| Layer | CIM (μm) | RHCM60 (μm) | RHCM90 (μm) |
|---|---|---|---|
| Upper skin layer | 310 | 252 | 221 |
| Upper shear layer | 272 | 268 | 252 |
| Core layer | 1345 | 1385 | 1247 |
| Lower shear layer | 263 | 322 | 491 |
| Lower skin layer | 310 | 273 | 289 |
Figure 6Crystallinity diffraction pattern of parts with different molding conditions by WAXD: (a) CIM, (b) RHCM60, (c) RHCM90.
Crystallinity of each layer under different processes.
| Thickness Position | CIM | RHCM60 | RHCM90 |
|---|---|---|---|
| 0.1 | 35.24% | 40.28% | 42.41% |
| 0.4 | 37.34% | 42.43% | 44.83% |
| 1.2 | 43.50% | 45.56% | 47.51% |
| 2.0 | 36.96% | 40.82% | 42.93% |
| 2.4 | 35.10% | 37.60% | 38.15% |
Figure 7Simulated temperature histories in the thickness direction under different processing conditions: (a) CIM, (b) RHCM60, and (c) RHCM90.
Figure 8The total predicted warpage results of the parts (unit: m): (a–c) prediction with crystallinity; (d–f) prediction without crystallinity. (a,d) CIM; (b,e) RHCM60; (c,f) RHCM90.
Figure 9Warpage information of real parts measured by a 3D laser scanner under different molding conditions: (a) CIM, (b) RHCM60, (c) RHCM90.
Figure 10The maximum values of warpages of experiment and prediction: (a) CIM, (b) RHCM60, (c) RHCM90.