| Literature DB >> 34067006 |
Liqun Wu1, Jianlong Chen1, Linan Zhang1, Hongcheng Wang1, Chao Chen2.
Abstract
This work proposes a detailed process of micro/nano-structure surface modification in relation to temperature field. In this paper, a femtosecond laser is used to induce the surface morphology of a silicon substrate. We provide a new method for the fabrication of a micro/nano-cantilever probe by controlling the aspect ratio of the silicon surface morphology. A computational method is used to investigate the mechanical behaviors of early perturbation to late-stage structure. A diffuse interface model is employed to describe the evolution and provide a general framework. The theoretical model of femtosecond laser control surface morphology is verified by the experiments. For systematic study, the model involves the interface energy and kinetics of diffusion. This method provides an effective way to improve the sensitivity of micro/nano-cantilever sensors.Entities:
Keywords: diffuse interface model; micro/nano-cantilever sensor; micro/nano-structures; temperature field
Year: 2021 PMID: 34067006 PMCID: PMC8151701 DOI: 10.3390/mi12050528
Source DB: PubMed Journal: Micromachines (Basel) ISSN: 2072-666X Impact factor: 2.891
Figure 1Schematic drawing represents laser irradiating the top surface of the silicon substrate.
Figure 2Atomic force microscope (AFM) images of surface modification at different positions: 1–3.
Figure 3Simulated results of calculated temperature field and surface modification at different positions: 1–3.
Figure 4(A) Aspect ratio of bump with various laser powers. (B) The computational temperature gradients and morphological shape of bumps at laser powers of 75 mW and 30 mW. Higher laser power induces a distinct temperature gradient and morphological shape of the bump on the surface of the substrate.
Figure 5(A) Three different surrounding materials have been assigned at the right end of the domain. The different surrounding materials: non-conducting material (asbestos), same material (silicon), high-conductivity material (aluminum). (B) Aspect ratio of the bump with various thermal conductivities of surrounding materials (asbestos: 0 W/m-K; silicon: 150 W/m-K; aluminum: 200 W/m-K). (C) A designed structure is performed by connecting different materials (with different thermal conductivities) at the surrounding area of the substrate.