| Literature DB >> 33808832 |
Filipa G Cunha1, Telmo G Santos1, José Xavier1.
Abstract
This paper is a critical review of in situ full-field measurements provided by digital image correlation (DIC) for inspecting and enhancing additive manufacturing (AM) processes. The principle of DIC is firstly recalled and its applicability during different AM processes systematically addressed. Relevant customisations of DIC in AM processes are highlighted regarding optical system, lighting and speckled pattern procedures. A perspective is given in view of the impact of in situ monitoring regarding AM processes based on target subjects concerning defect characterisation, evaluation of residual stresses, geometric distortions, strain measurements, numerical modelling validation and material characterisation. Finally, a case study on in situ measurements with DIC for wire and arc additive manufacturing (WAAM) is presented emphasizing opportunities, challenges and solutions.Entities:
Keywords: additive manufacturing; digital image correlation; in situ; monitoring
Year: 2021 PMID: 33808832 PMCID: PMC8003672 DOI: 10.3390/ma14061511
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Figure 1Number of publications in Scopus for different full-field optical techniques coupled with the searching keyword in situ measurements (units: %).
Figure 2Number of publications for the different optical techniques with in situ measurements.
Figure 3Applications of in situ measurements using DIC.
Summary of main difficulties in applying DIC to the different AM variants.
| AM Technology | AM Variant | Radiation | Projected | Camera | Speckled | Curved | Closed | Relative | Related |
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| DMD |
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| DED | DLD/LMD/LENS |
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| WAAM |
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| SLS |
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| PBF | SLM/DMLS |
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| Vat |
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| Binder |
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Difficulty is verified. Difficulty is not verified. Difficulty is verified with exceptions. Difficulty is not verified with exceptions.
Optical system, lighting and speckled pattern employed during AM variants.
| AM Variant | Optical System | Lighting System | DIC Software | Speckled Pattern | References |
|---|---|---|---|---|---|
| SLM | Two 5-Mpx CCD cameras | LED | Vic-3D | Natural pattern | [ |
| LMD | Two CMOS cameras | DILAS Compact | GOM Aramis 3D DIC | Painted stochastic | [ |
| DMD | Two CCD cameras | LED | GOM Aramis 3D DIC | Painted pattern | [ |
| FFF/FDM | Two 5-Mpx CCD cameras | LED | Vic-3D | Natural pattern (using | [ |
| LENS | CMOS HS-UX50 160K | Fixed light | Vic-2D | Natural pattern | [ |
Figure 4WAAM and DIC set-ups.
Figure 5Acquired original image of the WAAM process for DIC purposes.
Figure 6Strain in the horizontal direction calculated from the original image of Figure 4.
Figure 7Acquired original image of the WAAM process for DIC purposes. In this case, a metallic bulkhead was used for radiation shield and to reduce the projections.
Figure 8Principal strain calculated from the original image of Figure 6.