Literature DB >> 33807901

Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W-Cu Composite Coatings.

Yuchao Zhao1, Nan Ye1, Haiou Zhuo1, Chaolong Wei1, Weiwei Zhou1, Jie Mao1, Jiancheng Tang1.   

Abstract

Tungsten-copper (W-Cu) composites are widely used as electrical contact materials, resistance welding, electrical discharge machining (EDM), and plasma electrode materials due to their excellent arc erosion resistance, fusion welding resistance, high strength, and superior hardness. However, the traditional preparation methods pay little attention to the compactness and microstructural uniformity of W-Cu composites. Herein, W-Cu composite coatings are prepared by pulse electroplating using nano-W powder as raw material and the influence of forward-reverse duty cycle of pulse current on the structure and mechanical properties is systematically investigated. Moreover, the densification mechanism of the W-Cu composite coating is analyzed from the viewpoints of forward-pulse plating and reverse-pulse plating. At the current density (J) of 2 A/dm2, frequency (f) of 1500 Hz, forward duty cycle (df) of 40% and reverse duty cycle (dr) of 10%, the W-Cu composite coating rendered a uniform microstructure and compact structure, resulting in a hardness of 127 HV and electrical conductivity of 53.7 MS/m.

Entities:  

Keywords:  W–Cu composite; duty cycle; electroplating; forward-reverse pulse current; mechanical properties; microstructural uniformity

Year:  2021        PMID: 33807901      PMCID: PMC7961998          DOI: 10.3390/ma14051233

Source DB:  PubMed          Journal:  Materials (Basel)        ISSN: 1996-1944            Impact factor:   3.623


  2 in total

1.  The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State.

Authors:  James B Marro; Taghi Darroudi; Chukwudi A Okoro; Yaw S Obeng; Kathleen C Richardson
Journal:  Thin Solid Films       Date:  2016-11-30       Impact factor: 2.183

2.  Synergistic enhancing effect for mechanical and electrical properties of tungsten copper composites using spark plasma infiltrating sintering of copper-coated graphene.

Authors:  Wenge Chen; Longlong Dong; Jiaojiao Wang; Ying Zuo; Shuxin Ren; Yongqing Fu
Journal:  Sci Rep       Date:  2017-12-19       Impact factor: 4.379

  2 in total

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