Cyanide-free environment-friendly alternative to copper electroplating for zinc die-cast alloys.

In this paper, a cyanide-free electroplating bath containing glutamate as a complexing agent is investigated as an environment-friendly alternative for copper plating on zinc die-cast alloys. Glutamate reacts with copper in an aqueous solution that exhibits similar copper cyanide properties by forming complexes. The electroplating bath pH is chosen from equilibrium diagrams to avoid the formation of insoluble complexes and oxides at varying copper-to-glutamate molar ratio. The plating bath's electrochemical response on a stationary electrode confirms that a 1:3 molar ratio between copper and glutamate at pH 8 exhibits better copper deposition onto the substrate, with its morphology characterized using SEM. The results suggest that the copper glutamate electroplating bath can be suitable for copper cyanide bath replacement without additives, allowing a one-step electroplating process. Moreover, the polarization and electrochemical impedance measurements suggest inhibition of the substrate's corrosion when copper was electroplated at a 1:3 copper-to-glutamate molar ratio. With the careful control of the concentration ratio, the process can provide adequate copper deposition and anti-corrosion capability suitable for green nanocoating applications.