Literature DB >> 33686278

Phonon-engineered extreme thermal conductivity materials.

Xin Qian1, Jiawei Zhou1, Gang Chen2.   

Abstract

Materials with ultrahigh or low thermal conductivity are desirable for many technological applications, such as thermal management of electronic and photonic devices, heat exchangers, energy converters and thermal insulation. Recent advances in simulation tools (first principles, the atomistic Green's function and molecular dynamics) and experimental techniques (pump-probe techniques and microfabricated platforms) have led to new insights on phonon transport and scattering in materials and the discovery of new thermal materials, and are enabling the engineering of phonons towards desired thermal properties. We review recent discoveries of both inorganic and organic materials with ultrahigh and low thermal conductivity, highlighting heat-conduction physics, strategies used to change thermal conductivity, and future directions to achieve extreme thermal conductivities in solid-state materials.

Year:  2021        PMID: 33686278     DOI: 10.1038/s41563-021-00918-3

Source DB:  PubMed          Journal:  Nat Mater        ISSN: 1476-1122            Impact factor:   43.841


  11 in total

1.  Role of Optical Phonons and Anharmonicity in the Appearance of the Heat Capacity Boson Peak-like Anomaly in Fully Ordered Molecular Crystals.

Authors:  Alexander I Krivchikov; Andrezj Jeżowski; Daria Szewczyk; Oxsana A Korolyuk; Olesya O Romantsova; Lubov M Buravtseva; Claudio Cazorla; Josep Ll Tamarit
Journal:  J Phys Chem Lett       Date:  2022-06-02       Impact factor: 6.888

Review 2.  Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application.

Authors:  Chang-Ping Feng; Fang Wei; Kai-Yin Sun; Yan Wang; Hong-Bo Lan; Hong-Jing Shang; Fa-Zhu Ding; Lu Bai; Jie Yang; Wei Yang
Journal:  Nanomicro Lett       Date:  2022-06-14

3.  Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity.

Authors:  Yongqiang Guo; Hua Qiu; Kunpeng Ruan; Yali Zhang; Junwei Gu
Journal:  Nanomicro Lett       Date:  2021-12-10

4.  Atomic-scale probing of heterointerface phonon bridges in nitride semiconductor.

Authors:  Yue-Hui Li; Rui-Shi Qi; Ruo-Chen Shi; Jian-Nan Hu; Zhe-Tong Liu; Yuan-Wei Sun; Ming-Qiang Li; Ning Li; Can-Li Song; Lai Wang; Zhi-Biao Hao; Yi Luo; Qi-Kun Xue; Xu-Cun Ma; Peng Gao
Journal:  Proc Natl Acad Sci U S A       Date:  2022-02-22       Impact factor: 12.779

5.  How Hydrodynamic Phonon Transport Determines the Convergence of Thermal Conductivity in Two-Dimensional Materials.

Authors:  Jianhui Jiang; Shuang Lu; Yulou Ouyang; Jie Chen
Journal:  Nanomaterials (Basel)       Date:  2022-08-18       Impact factor: 5.719

6.  Solid-State Janus Nanoprecipitation Enables Amorphous-Like Heat Conduction in Crystalline Mg3 Sb2 -Based Thermoelectric Materials.

Authors:  Rui Shu; Zhijia Han; Anna Elsukova; Yongbin Zhu; Peng Qin; Feng Jiang; Jun Lu; Per O Å Persson; Justinas Palisaitis; Arnaud le Febvrier; Wenqing Zhang; Oana Cojocaru-Mirédin; Yuan Yu; Per Eklund; Weishu Liu
Journal:  Adv Sci (Weinh)       Date:  2022-07-18       Impact factor: 17.521

7.  On the origin of elasticity and heat conduction anisotropy of liquid crystal elastomers at gigahertz frequencies.

Authors:  Yu Cang; Jiaqi Liu; Meguya Ryu; Bartlomiej Graczykowski; Junko Morikawa; Shu Yang; George Fytas
Journal:  Nat Commun       Date:  2022-09-06       Impact factor: 17.694

8.  Glassy thermal conductivity in Cs3Bi2I6Cl3 single crystal.

Authors:  Paribesh Acharyya; Tanmoy Ghosh; Koushik Pal; Kewal Singh Rana; Moinak Dutta; Diptikanta Swain; Martin Etter; Ajay Soni; Umesh V Waghmare; Kanishka Biswas
Journal:  Nat Commun       Date:  2022-08-27       Impact factor: 17.694

9.  Enhancing the Thermal Conductivity of Amorphous Carbon with Nanowires and Nanotubes.

Authors:  Geraudys Mora-Barzaga; Felipe J Valencia; Matías I Carrasco; Rafael I González; Martín G Parlanti; Enrique N Miranda; Eduardo M Bringa
Journal:  Nanomaterials (Basel)       Date:  2022-08-18       Impact factor: 5.719

10.  Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration.

Authors:  Ming-Ding Li; Xiao-Quan Shen; Xin Chen; Jia-Ming Gan; Fang Wang; Jian Li; Xiao-Liang Wang; Qun-Dong Shen
Journal:  Nat Commun       Date:  2022-10-04       Impact factor: 17.694

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