Microwave-assisted chemical recovery of glass fiber and epoxy resin from non-metallic components in waste printed circuit boards.

An efficient, microwave-assisted chemical recovery approach for epoxy resin and glass fiber from non-metallic components (NMC) in waste printed circuit boards (WPCBs) for resource reutilization was developed in this research. HNO3 was selected as the chemical reagent because epoxy resin has low corrosion resistance to HNO3. The influence of reaction parameters such as reaction time, temperature, concentration of HNO3, liquid-solid ratio, and power of the microwave synthesizer on the separation efficiency of NMC (epoxy resin and glass fiber) and the reaction mechanism were investigated. The physical and chemical properties of NMC, reaction solvent, and decomposed products were analyzed using energy dispersive X-ray Spectroscopy (SEM-EDX) and Fourier transform infrared spectroscopy (FT-IR). The results showed that up to 88.42% of epoxy resin and glass fiber ((5 g) 10 mL/g) could be separated under the action of 300 W microwave power at 95 ℃ for 12 h and a HNO3 concentration of 7 mol/L. During the reaction, C-N bonds formed by the crosslinking agent and the three-dimensional network structure of the thermosetting epoxy resin were destroyed. The carbon chain structure and chemical properties of epoxy resin did not change significantly and the functional groups of ethyl acetate maintained the chemical structure before and after the reaction. This uncomplicated and efficient inorganic acid chemical microwave-assisted process holds promise for use as a feasible recovery technology for epoxy resin and glass fibers in NMC. The proposed process is particularly appealing because of its high selectivity, considerable economic advantages, and environmental benefits.